FR2605176B1 - Procede de cablage filaire et outil pour la mise en oeuvre de ce procede - Google Patents

Procede de cablage filaire et outil pour la mise en oeuvre de ce procede

Info

Publication number
FR2605176B1
FR2605176B1 FR8614277A FR8614277A FR2605176B1 FR 2605176 B1 FR2605176 B1 FR 2605176B1 FR 8614277 A FR8614277 A FR 8614277A FR 8614277 A FR8614277 A FR 8614277A FR 2605176 B1 FR2605176 B1 FR 2605176B1
Authority
FR
France
Prior art keywords
implementing
tool
same
wiring process
wired wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8614277A
Other languages
English (en)
Other versions
FR2605176A1 (fr
Inventor
Celnik Jean
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Automobiles Peugeot SA
Automobiles Citroen SA
Original Assignee
Automobiles Peugeot SA
Automobiles Citroen SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Automobiles Peugeot SA, Automobiles Citroen SA filed Critical Automobiles Peugeot SA
Priority to FR8614277A priority Critical patent/FR2605176B1/fr
Publication of FR2605176A1 publication Critical patent/FR2605176A1/fr
Application granted granted Critical
Publication of FR2605176B1 publication Critical patent/FR2605176B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Wire Bonding (AREA)
FR8614277A 1986-10-09 1986-10-09 Procede de cablage filaire et outil pour la mise en oeuvre de ce procede Expired - Fee Related FR2605176B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8614277A FR2605176B1 (fr) 1986-10-09 1986-10-09 Procede de cablage filaire et outil pour la mise en oeuvre de ce procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8614277A FR2605176B1 (fr) 1986-10-09 1986-10-09 Procede de cablage filaire et outil pour la mise en oeuvre de ce procede

Publications (2)

Publication Number Publication Date
FR2605176A1 FR2605176A1 (fr) 1988-04-15
FR2605176B1 true FR2605176B1 (fr) 1994-04-01

Family

ID=9339844

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8614277A Expired - Fee Related FR2605176B1 (fr) 1986-10-09 1986-10-09 Procede de cablage filaire et outil pour la mise en oeuvre de ce procede

Country Status (1)

Country Link
FR (1) FR2605176B1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4906812A (en) * 1988-12-22 1990-03-06 General Electric Company Fiber optic laser joining apparatus
EP0423433A1 (fr) * 1989-09-28 1991-04-24 International Business Machines Corporation Méthode et appareil pour faire le bonding de conduits d'éléments à des pastilles posées sur un substrat élastique
US5074037A (en) * 1989-12-01 1991-12-24 Oerlikon-Contraves Ag Process for producing electrical connections on a universal substrate
DE4320055A1 (de) * 1993-06-17 1994-12-22 Ghassem Dipl Ing Azdasht Belötungsvorrichtung
US6501043B1 (en) * 1999-10-22 2002-12-31 Medtronic, Inc. Apparatus and method for laser welding of ribbons
DE102017114771B4 (de) * 2017-06-29 2022-01-27 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zur Herstellung einer Drahtverbindung sowie Bauelementanordnung mit Drahtverbindung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3304403A (en) * 1963-10-14 1967-02-14 Texas Instruments Inc Laser welding of contacts
US3463898A (en) * 1965-07-09 1969-08-26 Tokyo Shibaura Electric Co Welding device utilizing laser beams
DE3334380A1 (de) * 1983-09-23 1985-04-11 Taunuslicht Glühlampenfabrik Otto Müller KG, 6392 Neu-Anspach Verfahren und vorrichtung zum schneiden von straengen, insbesondere von duennen metalldraehten
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
JPS60247487A (ja) * 1984-05-23 1985-12-07 Nec Corp ワイヤボンデイング装置

Also Published As

Publication number Publication date
FR2605176A1 (fr) 1988-04-15

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Legal Events

Date Code Title Description
ST Notification of lapse