JP2020526010A - ワイヤ接続を構築するための方法および装置ならびにワイヤ接続を有する部品配置 - Google Patents
ワイヤ接続を構築するための方法および装置ならびにワイヤ接続を有する部品配置 Download PDFInfo
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- JP2020526010A JP2020526010A JP2019570047A JP2019570047A JP2020526010A JP 2020526010 A JP2020526010 A JP 2020526010A JP 2019570047 A JP2019570047 A JP 2019570047A JP 2019570047 A JP2019570047 A JP 2019570047A JP 2020526010 A JP2020526010 A JP 2020526010A
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- H—ELECTRICITY
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- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- Manufacturing Of Electrical Connectors (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
ワイヤボンダとして実現される周知のワイヤガイドツールは、面に接触するようにワイヤを位置決めするとともに、超音波をワイヤに印加することによってこのワイヤとコンタクト面との間に機械的コンタクトを構築する役割を果たすことができるが、このワイヤガイドツールとは異なり、本発明に従い使用されるワイヤガイドツールは、コンタクトに対してワイヤを位置決めする役割のみを果たし、ワイヤとコンタクトとの間にコンタクト接続を構築する役割はない。むしろ、導電性を有しかつ機械的耐性を有する接続が、第1のコンタクト面とコンタクト端部との間に形成されるコンタクト領域を濡らすことによって構築され、このコンタクト領域は、第1のコンタクト面とコンタクト端部との間に機械的な導電性接続が構築されるように第1のはんだ材料接続を構築するために、はんだ材料成形部から形成された、少なくとも一部が溶融した第1のはんだ材料量を用いて、濡らされる。
本発明に係るこの装置は、ワイヤのコンタクト端部を第1のコンタクト面に対して位置決めするため、および、第1のコンタクト面と少なくとも1つの他のコンタクト面との間にワイヤ部分を形成するため、ならびに他のコンタクト面に対してワイヤ部分端部を位置決めするための、ワイヤガイドツールと、コンタクト端部と第1のコンタクト面との間に形成されたコンタクト領域と、ワイヤ部分端部と他のコンタクト面との間に形成されたコンタクト領域とに、少なくとも一部が溶融したはんだ材料成形部を適用するためのはんだ材料適用装置とを備える。
好ましくは、はんだ材料適用装置はワイヤガイドツールから独立して実現され、よって、この適用装置はワイヤガイド装置から独立して位置決めすることができる、すなわち、はんだ材料成形部の適用は、異なる初期位置から、ワイヤガイドツールの連続するコンタクト位置において実行することができ、これにより、コンタクト領域それぞれの最良の濡れ性が可能になる。
Claims (14)
- 第1のコンタクト面(15,75,97)と少なくとも1つの他のコンタクト面(42,76,77,98)との間にワイヤ接続を構築する方法であって、
ワイヤガイドツール(17,51)を用いて、ワイヤ(35,79,101)のコンタクト端部(37)を、前記第1のコンタクト面(15,75,97)に対するコンタクト位置に位置決めし、次に、前記第1のコンタクト面(15,75,97)と前記コンタクト端部(37)との間に機械的な導電性接続が形成されるように第1のはんだ材料接続(38,80,102)を構築するために、はんだ材料成形部(33)から形成された、少なくとも一部が溶融した第1のはんだ材料量を用いて、前記第1のコンタクト面(15,75,97)と前記コンタクト端部(37)との間に形成されるコンタクト領域(39)を濡らし、
次に、前記ワイヤガイドツール(17,51)の移動により前記第1のコンタクト面(15,75,97)と前記他のコンタクト面(42,76,77,98)との間に形成されるワイヤ部分(41)のワイヤ部分端部(45)と、前記他のコンタクト面(42,76,77,98)との間に、コンタクト領域(44)が形成されるように、前記ワイヤガイドツール(17,51)を前記他のコンタクト面(42)まで移動させ、
次に、前記ワイヤ部分端部(45)と前記他のコンタクト面(42,76,77,98)との間に機械的な導電性接続が構築されるように少なくとも1つの他のはんだ材料接続(48,81,82,103)を構築するために、はんだ材料成形部(33)から形成された、少なくとも一部が溶融した第2のはんだ材料量を用いて、第2のコンタクト領域(44)を濡らす、方法。 - 前記他のはんだ材料接続(48,81,82,103)の構築後に、前記ワイヤガイドツール(17,51)によって案内される前記ワイヤ(35,79,101)から、前記ワイヤ部分(41,78,99)を切り離すことを特徴とする、請求項1に記載の方法。
- 前記コンタクト領域から距離を置いた初期位置に配置されているはんだ材料成形部(33)によって、前記第1のコンタクト領域および前記第2のコンタクト領域(39,44)を濡らし、前記はんだ材料成形部(33)は、前記初期位置において少なくとも一部が溶融しており、前記少なくとも一部が溶融しているはんだ材料成形部(33)を、前記初期位置から前記コンタクト領域(39,44)に落すことを特徴とする、請求項1または2に記載の方法。
- 前記初期位置を定めるために、前記はんだ材料成形部(33)を、適用毛管(30)の口部(31)の内部における、前記口部(31)のディスペンサ開口(32)の上方に配置し、前記ディスペンサ開口(32)の直径Dが前記はんだ材料成形部(33)の直径dよりも小さく、前記はんだ材料成形部(33)を、前記はんだ材料成形部(33)に印加されたレーザエネルギによって溶融し、前記溶融したはんだ材料成形部(33)を、前記はんだ材料成形部(33)に加えられたガス圧力によって供給する、請求項3に記載の方法。
- 第1のコンタクト面(15,75,97)と少なくとも1つの他のコンタクト面(42,76,77,98)との間にワイヤ接続を構築するための装置であって、前記装置は、
ワイヤ(35,79,101)のコンタクト端部(37)を前記第1のコンタクト面(15,75,97)に対して位置決めするため、および、前記第1のコンタクト面(15,75,97)と前記他のコンタクト面(42,76,77,98)との間にワイヤ部分(41,78,99)を形成するため、ならびに前記他のコンタクト面(42,76,77,98)に対してワイヤ部分端部(45)を位置決めするための、ワイヤガイドツール(17,51)と、
前記コンタクト端部(37)と前記第1のコンタクト面(15,75,97)との間に形成されたコンタクト領域(39)と、前記ワイヤ部分端部(45)と前記他のコンタクト面(42,76,77,98)との間に形成されたコンタクト領域(44)とに、少なくとも一部が溶融したはんだ材料成形部(33)を適用するためのはんだ材料適用装置(18)とを備える、装置。 - 前記ワイヤ部分(41,78)を切り離すための切り離し装置(28,52)を特徴とする、請求項5に記載の装置。
- 前記はんだ材料適用装置(18)は、前記ワイヤガイド装置(17,51)から独立して形成されることを特徴とする、請求項5または6に記載の装置。
- 前記ワイヤガイドツール(17,51)はワイヤガイド毛管(19,54)を含み、前記ワイヤガイド毛管(19,54)は、前記ワイヤガイド毛管(19,54)の口部(25,55)に形成されたディスペンサ開口(26,56)から、送り装置によって運ばれるワイヤ(35,79)を供給するためのものであることを特徴とする、請求項5〜7のいずれか1項に記載の装置。
- 前記切り離し装置(28)の少なくとも一部が前記ワイヤガイド毛管(19)の前記口部(25)によって形成されることを特徴とする、請求項5〜8のいずれか1項に記載の装置。
- 前記切り離し装置(28,52)が、前記ワイヤガイド毛管(19,54)の前記口部(25,55)に対して移動可能に実現される切り離し要素(23,60)を有することを、特徴とする、請求項8または9に記載の装置。
- 前記ワイヤガイド毛管(19)は、前記ワイヤガイドツール(17)のベース本体(20)を介してワイヤ押さえ装置(21)に固定的に接続され、前記ワイヤ押さえ装置(21)は、前記切り離し要素(23)を含む中間空間(22)を介して前記ワイヤガイド毛管(19)の前記口部(25)から離隔されていることを特徴とする、請求項5〜10のいずれか1項に記載の装置。
- 特にチップとして実現される複数の電子部品(71,72,73,91,92)を有する部品配置(70,90)であって、前記電子部品は積層配置となるように配置され、請求項1〜4のいずれか1項に記載のように構築されたワイヤ接続を用いて互いに接続されている前記部品の接続側(83,95,96)にコンタクト面(75,76,77,97,98)が配置され、第1の部品(71,91)の第1のコンタクト面(75,97)をワイヤ(79,101)のコンタクト端部に接続する第1のはんだ材料接続(80,102)と、別の部品(72,73,92)の第2のコンタクト面(76,98)を前記ワイヤに接続する第2のはんだ材料接続(81)との間に、ワイヤ部分(78,99)が形成されている、部品配置。
- 前記部品(71,72,73)はピラミッド形状の積層配置を形成し、互いの上に配置された2つの部品(71,72,73)それぞれの接続側(83)と裏側(84)との間に部品接続が構築されるように、かつ、前記部品それぞれのコンタクト面(75,76,77)同士を接続するために形成されたワイヤ部分(78)が前記部品それぞれの隣り合う側方端にわたってカスケード状に延在するように、前記ピラミッド形状の積層配置が形成されることを特徴とする、請求項12に記載の部品配置。
- 互いの上に配置された2つの部品(91,92)それぞれの対向する裏側(93,94)同士の間に部品接続が構築され、前記部品それぞれのコンタクト面(97,98)同士を接続するために形成されたワイヤ部分(99)が、前記部品それぞれの隣り合う側方端に渡って弓形に延在することを特徴とする、請求項12に記載の部品配置。
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