TW201817807A - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

Info

Publication number
TW201817807A
TW201817807A TW107102969A TW107102969A TW201817807A TW 201817807 A TW201817807 A TW 201817807A TW 107102969 A TW107102969 A TW 107102969A TW 107102969 A TW107102969 A TW 107102969A TW 201817807 A TW201817807 A TW 201817807A
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
mass
insulating layer
circuit board
Prior art date
Application number
TW107102969A
Other languages
English (en)
Chinese (zh)
Inventor
西村嘉生
川合賢司
中村茂雄
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW201817807A publication Critical patent/TW201817807A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
TW107102969A 2012-05-31 2013-05-28 樹脂組成物 TW201817807A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-124032 2012-05-31
JP2012124032 2012-05-31

Publications (1)

Publication Number Publication Date
TW201817807A true TW201817807A (zh) 2018-05-16

Family

ID=49982577

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107102969A TW201817807A (zh) 2012-05-31 2013-05-28 樹脂組成物
TW102118794A TWI620781B (zh) 2012-05-31 2013-05-28 樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW102118794A TWI620781B (zh) 2012-05-31 2013-05-28 樹脂組成物

Country Status (3)

Country Link
JP (2) JP5904160B2 (enExample)
KR (2) KR102018392B1 (enExample)
TW (2) TW201817807A (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6458921B2 (ja) * 2014-02-26 2019-01-30 インテル・コーポレーション 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体
JP6269294B2 (ja) * 2014-04-24 2018-01-31 味の素株式会社 プリント配線板の絶縁層用樹脂組成物
TWI668269B (zh) * 2014-06-30 2019-08-11 日商味之素股份有限公司 Resin composition
KR102330406B1 (ko) * 2015-07-06 2021-11-23 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 그것을 사용한 프리프레그, 레진 시트, 적층판, 및 프린트 배선판
US10869390B2 (en) * 2015-07-06 2020-12-15 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate, and printed circuit board
JP6867131B2 (ja) * 2015-09-30 2021-04-28 積水化学工業株式会社 積層体及び積層体の製造方法
WO2018124158A1 (ja) * 2016-12-28 2018-07-05 三菱瓦斯化学株式会社 プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板
CN110168015A (zh) 2017-03-14 2019-08-23 三井金属矿业株式会社 树脂组合物、带树脂铜箔、介电层、覆铜层压板、电容器元件以及内置电容器的印刷电路板
US11548977B2 (en) 2017-06-21 2023-01-10 Dic Corporation Active ester resin and composition and cured product using the same
US11407708B2 (en) 2017-06-21 2022-08-09 Dic Corporation Active ester compound and composition and cured product obtained using the same
JP7210901B2 (ja) 2017-06-26 2023-01-24 味の素株式会社 樹脂組成物層
JP6904125B2 (ja) 2017-07-18 2021-07-14 味の素株式会社 樹脂組成物
JP6859916B2 (ja) 2017-10-13 2021-04-14 味の素株式会社 樹脂組成物層
JP7185519B2 (ja) * 2017-12-25 2022-12-07 太陽インキ製造株式会社 熱硬化性樹脂充填材、その硬化物および多層プリント配線板
JP7296191B2 (ja) 2018-01-09 2023-06-22 味の素株式会社 硬化性樹脂組成物、樹脂シート、プリント配線板及び半導体装置
CN111936526B (zh) 2018-03-29 2022-09-30 Dic株式会社 固化性组合物及其固化物
US11901249B2 (en) 2018-03-29 2024-02-13 Dic Corporation Curable composition and cured product thereof
US11873356B2 (en) 2018-03-29 2024-01-16 Dic Corporation Curable composition and cured product thereof
JP7238374B2 (ja) * 2018-12-12 2023-03-14 株式会社レゾナック 封止用樹脂組成物及び半導体装置
JP7443778B2 (ja) * 2020-01-16 2024-03-06 株式会社レゾナック 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法
JP7540164B2 (ja) * 2020-02-18 2024-08-27 住友ベークライト株式会社 封止用樹脂組成物および電子装置
JP7388235B2 (ja) 2020-02-20 2023-11-29 味の素株式会社 樹脂組成物
JP7658250B2 (ja) * 2021-11-02 2025-04-08 味の素株式会社 樹脂組成物
WO2023199738A1 (ja) * 2022-04-11 2023-10-19 株式会社Adeka 組成物及び硬化物
JP7752918B2 (ja) 2022-09-13 2025-10-14 信越化学工業株式会社 ボンディングフィルム用硬化性樹脂組成物、ボンディングフィルム及びプリント配線板
JP7683584B2 (ja) * 2022-10-14 2025-05-27 味の素株式会社 樹脂組成物
JP2024163031A (ja) * 2023-05-10 2024-11-21 味の素株式会社 樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1171501A (ja) * 1997-08-29 1999-03-16 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた硬化物
JPH11130939A (ja) * 1997-10-29 1999-05-18 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた硬化物
JP2008121010A (ja) 2006-10-20 2008-05-29 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2009231790A (ja) * 2008-02-27 2009-10-08 Ajinomoto Co Inc 多層プリント配線板の製造方法
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
JP2013023666A (ja) * 2011-07-25 2013-02-04 Sekisui Chem Co Ltd エポキシ樹脂材料、硬化物及びプラズマ粗化処理硬化物
JP6026095B2 (ja) * 2011-10-31 2016-11-16 太陽インキ製造株式会社 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板

Also Published As

Publication number Publication date
KR20130135107A (ko) 2013-12-10
TWI620781B (zh) 2018-04-11
TW201410777A (zh) 2014-03-16
JP2016156019A (ja) 2016-09-01
JP6217775B2 (ja) 2017-10-25
KR102018392B1 (ko) 2019-09-04
KR102132771B1 (ko) 2020-07-13
JP2014005464A (ja) 2014-01-16
JP5904160B2 (ja) 2016-04-13
KR20190104287A (ko) 2019-09-09

Similar Documents

Publication Publication Date Title
TWI620781B (zh) 樹脂組成物
JP6163803B2 (ja) 樹脂組成物
KR102122706B1 (ko) 지지체 함유 프리폴리머 시트
TWI677528B (zh) 多層印刷配線板之絕緣層用的熱硬化性環氧樹脂組成物、多層印刷配線板之絕緣層用的接著薄膜及多層印刷配線板
KR102324291B1 (ko) 수지 조성물
JP6308713B2 (ja) 樹脂組成物
JP6024599B2 (ja) 多層プリント配線板の製造方法
TWI624508B (zh) Curable resin composition
JP6164113B2 (ja) 支持体付き樹脂シート
JP6123177B2 (ja) 樹脂組成物
TWI619761B (zh) Curable resin composition
TWI635130B (zh) Resin composition
TW201418357A (zh) 樹脂組成物
KR20170100434A (ko) 지지체 부착 수지 시트
JP2014136779A (ja) 樹脂組成物
KR102422859B1 (ko) 수지 시트
TW201311810A (zh) 樹脂組成物
JP6694833B2 (ja) 樹脂組成物
TW201910372A (zh) 樹脂組成物層
JP6418273B2 (ja) 樹脂組成物
JP2022179517A (ja) 樹脂組成物
TWI613251B (zh) 硬化性樹脂組成物
JP7263069B2 (ja) 樹脂組成物
TW201420346A (zh) 樹脂組成物
JP7131311B2 (ja) 樹脂組成物