KR102018392B1 - 수지 조성물 - Google Patents

수지 조성물 Download PDF

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Publication number
KR102018392B1
KR102018392B1 KR1020130060908A KR20130060908A KR102018392B1 KR 102018392 B1 KR102018392 B1 KR 102018392B1 KR 1020130060908 A KR1020130060908 A KR 1020130060908A KR 20130060908 A KR20130060908 A KR 20130060908A KR 102018392 B1 KR102018392 B1 KR 102018392B1
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KR
South Korea
Prior art keywords
resin composition
resin
preferable
insulating layer
mass
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KR1020130060908A
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English (en)
Korean (ko)
Other versions
KR20130135107A (ko
Inventor
요시오 니시무라
켄지 카와이
시게오 나카무라
Original Assignee
아지노모토 가부시키가이샤
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Publication of KR20130135107A publication Critical patent/KR20130135107A/ko
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Publication of KR102018392B1 publication Critical patent/KR102018392B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
KR1020130060908A 2012-05-31 2013-05-29 수지 조성물 Active KR102018392B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012124032 2012-05-31
JPJP-P-2012-124032 2012-05-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190106119A Division KR102132771B1 (ko) 2012-05-31 2019-08-28 수지 조성물

Publications (2)

Publication Number Publication Date
KR20130135107A KR20130135107A (ko) 2013-12-10
KR102018392B1 true KR102018392B1 (ko) 2019-09-04

Family

ID=49982577

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020130060908A Active KR102018392B1 (ko) 2012-05-31 2013-05-29 수지 조성물
KR1020190106119A Active KR102132771B1 (ko) 2012-05-31 2019-08-28 수지 조성물

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020190106119A Active KR102132771B1 (ko) 2012-05-31 2019-08-28 수지 조성물

Country Status (3)

Country Link
JP (2) JP5904160B2 (enExample)
KR (2) KR102018392B1 (enExample)
TW (2) TWI620781B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6458921B2 (ja) * 2014-02-26 2019-01-30 インテル・コーポレーション 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体
JP6269294B2 (ja) * 2014-04-24 2018-01-31 味の素株式会社 プリント配線板の絶縁層用樹脂組成物
JP6672616B2 (ja) * 2014-06-30 2020-03-25 味の素株式会社 樹脂組成物、接着フィルム、プリント配線板及び半導体装置
CN107709468B (zh) * 2015-07-06 2020-06-16 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板和印刷电路板
CN107849334B (zh) * 2015-07-06 2020-06-05 三菱瓦斯化学株式会社 树脂组合物、使用其的预浸料、树脂片、层叠板和印刷电路板
JP6867131B2 (ja) * 2015-09-30 2021-04-28 積水化学工業株式会社 積層体及び積層体の製造方法
TWI656151B (zh) * 2016-12-28 2019-04-11 日商三菱瓦斯化學股份有限公司 預浸體、疊層板、覆金屬箔疊層板、印刷電路板、及多層印刷電路板
JP7013444B2 (ja) 2017-03-14 2022-01-31 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
WO2018235425A1 (ja) 2017-06-21 2018-12-27 Dic株式会社 活性エステル樹脂並びにこれを用いた組成物および硬化物
KR102494828B1 (ko) 2017-06-21 2023-02-01 디아이씨 가부시끼가이샤 활성 에스테르 화합물 그리고 이것을 사용한 조성물 및 경화물
JP7210901B2 (ja) * 2017-06-26 2023-01-24 味の素株式会社 樹脂組成物層
JP6904125B2 (ja) 2017-07-18 2021-07-14 味の素株式会社 樹脂組成物
JP6859916B2 (ja) 2017-10-13 2021-04-14 味の素株式会社 樹脂組成物層
JP7185519B2 (ja) * 2017-12-25 2022-12-07 太陽インキ製造株式会社 熱硬化性樹脂充填材、その硬化物および多層プリント配線板
JP7296191B2 (ja) 2018-01-09 2023-06-22 味の素株式会社 硬化性樹脂組成物、樹脂シート、プリント配線板及び半導体装置
KR102388192B1 (ko) 2018-03-29 2022-04-19 디아이씨 가부시끼가이샤 경화성 조성물 및 그 경화물
CN111918891B (zh) * 2018-03-29 2023-02-28 Dic株式会社 固化性组合物及其固化物
WO2019188332A1 (ja) 2018-03-29 2019-10-03 Dic株式会社 硬化性組成物及びその硬化物
JP7238374B2 (ja) * 2018-12-12 2023-03-14 株式会社レゾナック 封止用樹脂組成物及び半導体装置
JP7443778B2 (ja) * 2020-01-16 2024-03-06 株式会社レゾナック 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法
JP7540164B2 (ja) * 2020-02-18 2024-08-27 住友ベークライト株式会社 封止用樹脂組成物および電子装置
JP7388235B2 (ja) 2020-02-20 2023-11-29 味の素株式会社 樹脂組成物
JP7658250B2 (ja) * 2021-11-02 2025-04-08 味の素株式会社 樹脂組成物
WO2023199738A1 (ja) * 2022-04-11 2023-10-19 株式会社Adeka 組成物及び硬化物
JP7752918B2 (ja) 2022-09-13 2025-10-14 信越化学工業株式会社 ボンディングフィルム用硬化性樹脂組成物、ボンディングフィルム及びプリント配線板
JP7683584B2 (ja) * 2022-10-14 2025-05-27 味の素株式会社 樹脂組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011132507A (ja) * 2009-11-26 2011-07-07 Ajinomoto Co Inc エポキシ樹脂組成物

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JPH1171501A (ja) * 1997-08-29 1999-03-16 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた硬化物
JPH11130939A (ja) * 1997-10-29 1999-05-18 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた硬化物
JP2008121010A (ja) 2006-10-20 2008-05-29 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2009231790A (ja) * 2008-02-27 2009-10-08 Ajinomoto Co Inc 多層プリント配線板の製造方法
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
JP2013023666A (ja) * 2011-07-25 2013-02-04 Sekisui Chem Co Ltd エポキシ樹脂材料、硬化物及びプラズマ粗化処理硬化物
JP6026095B2 (ja) * 2011-10-31 2016-11-16 太陽インキ製造株式会社 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2011132507A (ja) * 2009-11-26 2011-07-07 Ajinomoto Co Inc エポキシ樹脂組成物

Also Published As

Publication number Publication date
TWI620781B (zh) 2018-04-11
KR20190104287A (ko) 2019-09-09
TW201410777A (zh) 2014-03-16
KR102132771B1 (ko) 2020-07-13
JP2016156019A (ja) 2016-09-01
JP5904160B2 (ja) 2016-04-13
JP2014005464A (ja) 2014-01-16
TW201817807A (zh) 2018-05-16
KR20130135107A (ko) 2013-12-10
JP6217775B2 (ja) 2017-10-25

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