TW201529709A - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- TW201529709A TW201529709A TW104114127A TW104114127A TW201529709A TW 201529709 A TW201529709 A TW 201529709A TW 104114127 A TW104114127 A TW 104114127A TW 104114127 A TW104114127 A TW 104114127A TW 201529709 A TW201529709 A TW 201529709A
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- resin composition
- organic
- resin
- epoxy resin
- manufactured
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- 239000011342 resin composition Substances 0.000 title claims abstract description 159
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 87
- 239000003822 epoxy resin Substances 0.000 claims abstract description 73
- 238000007789 sealing Methods 0.000 claims abstract description 36
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 28
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims description 63
- 239000011256 inorganic filler Substances 0.000 claims description 19
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 19
- 229910052623 talc Inorganic materials 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 13
- 239000000454 talc Substances 0.000 claims description 9
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 6
- 229910002113 barium titanate Inorganic materials 0.000 claims description 6
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
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- 239000010445 mica Substances 0.000 claims description 4
- 229910052618 mica group Inorganic materials 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
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- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
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- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
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- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 2
- 239000001095 magnesium carbonate Substances 0.000 claims description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
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- 239000000463 material Substances 0.000 abstract description 11
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 9
- 239000012756 surface treatment agent Substances 0.000 description 9
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- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 7
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- 239000011258 core-shell material Substances 0.000 description 6
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- 125000001624 naphthyl group Chemical group 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-M phenolate Chemical compound [O-]C1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-M 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 1
- LHGVFZTZFXWLCP-UHFFFAOYSA-N pyrocatechol monomethyl ether Natural products COC1=CC=CC=C1O LHGVFZTZFXWLCP-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000002298 terpene group Chemical group 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- TXMIUMUSEKVUBH-UHFFFAOYSA-M tetrabutylphosphanium;2,2,2-trifluoroacetate Chemical compound [O-]C(=O)C(F)(F)F.CCCC[P+](CCCC)(CCCC)CCCC TXMIUMUSEKVUBH-UHFFFAOYSA-M 0.000 description 1
- GFZMLBWMGBLIDI-UHFFFAOYSA-M tetrabutylphosphanium;acetate Chemical compound CC([O-])=O.CCCC[P+](CCCC)(CCCC)CCCC GFZMLBWMGBLIDI-UHFFFAOYSA-M 0.000 description 1
- WHDWTYUVZOXXKX-UHFFFAOYSA-M tetrabutylphosphanium;formate Chemical compound [O-]C=O.CCCC[P+](CCCC)(CCCC)CCCC WHDWTYUVZOXXKX-UHFFFAOYSA-M 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 125000001889 triflyl group Chemical group FC(F)(F)S(*)(=O)=O 0.000 description 1
- 229940116269 uric acid Drugs 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Electroluminescent Light Sources (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009013702 | 2009-01-23 |
Publications (1)
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|---|---|
| TW201529709A true TW201529709A (zh) | 2015-08-01 |
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| TW104114127A TW201529709A (zh) | 2009-01-23 | 2010-01-22 | 樹脂組成物 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW099101808A TWI504662B (zh) | 2009-01-23 | 2010-01-22 | Resin composition |
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| JP (2) | JP5601202B2 (ja) |
| TW (2) | TWI504662B (ja) |
| WO (1) | WO2010084939A1 (ja) |
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| KR101601271B1 (ko) | 2009-07-20 | 2016-03-08 | 주식회사 엘지화학 | 발광소자 봉지용 조성물, 발광 다이오드 및 액정표시장치 |
| TWI494340B (zh) * | 2010-08-02 | 2015-08-01 | Taiwan Union Technology Corp | 環氧樹脂組成物及其製成的預浸材和印刷電路板 |
| TWI522438B (zh) | 2010-11-02 | 2016-02-21 | Ｌｇ化學股份有限公司 | 黏著層及利用其封裝有機電子裝置之方法 |
| KR101182449B1 (ko) * | 2010-12-24 | 2012-09-12 | 삼성디스플레이 주식회사 | 봉지시트와 그것을 사용한 평판 표시 장치 및 그 제조방법 |
| JP2013069480A (ja) * | 2011-09-21 | 2013-04-18 | Semiconductor Energy Lab Co Ltd | 発光装置、電子機器、及び照明装置 |
| JP2013213114A (ja) * | 2012-03-30 | 2013-10-17 | Furukawa Electric Co Ltd:The | 封止材用組成物、封止材、及び有機エレクトロルミネッセンス素子 |
| JPWO2013147156A1 (ja) * | 2012-03-30 | 2015-12-14 | 古河電気工業株式会社 | 有機エレクトロルミネッセンス素子封止用樹脂組成物、その製造方法、該樹脂組成物を用いた接着フィルム、ガスバリアフィルム、有機エレクトロルミネッセンス素子および有機エレクトロルミネッセンスパネル |
| JP5959274B2 (ja) * | 2012-03-30 | 2016-08-02 | 古河電気工業株式会社 | 有機エレクトロルミネッセンス素子封止用樹脂組成物、これを用いた有機エレクトロルミネッセンス素子およびディスプレイ装置 |
| WO2014007219A1 (ja) * | 2012-07-05 | 2014-01-09 | 株式会社スリーボンド | シート状接着剤およびこれを用いた有機ｅｌパネル |
| WO2014163090A1 (ja) * | 2013-04-01 | 2014-10-09 | Jnc株式会社 | 光硬化性エポキシ接着剤、樹脂組成物、積層体、ディスプレイ、および樹脂組成物の製造方法 |
| KR20160084852A (ko) * | 2013-11-08 | 2016-07-14 | 아지노모토 가부시키가이샤 | 하이드로탈사이트를 함유하는 봉지용 수지 조성물 및 봉지용 시트 |
| EP3067392B1 (en) * | 2013-11-08 | 2018-03-07 | Ajinomoto Co., Inc. | Sealing resin composition and sealing sheet |
| JP2015103572A (ja) * | 2013-11-21 | 2015-06-04 | 日東電工株式会社 | 両面セパレータ付き封止用シート、及び、半導体装置の製造方法 |
| JP5872129B1 (ja) | 2014-05-02 | 2016-03-01 | 三井化学株式会社 | シール材及びその硬化物 |
| JP6613021B2 (ja) * | 2014-06-06 | 2019-11-27 | 積水化学工業株式会社 | トップエミッション型有機エレクトロルミネッセンス表示素子封止用樹脂組成物、トップエミッション型有機エレクトロルミネッセンス表示素子封止用樹脂シート、及び、トップエミッション型有機エレクトロルミネッセンス表示素子 |
| WO2016136715A1 (ja) * | 2015-02-24 | 2016-09-01 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
| JP6767758B2 (ja) * | 2015-04-10 | 2020-10-14 | 株式会社カネカ | 貯蔵安定性および接着性の改善されたポリマー微粒子含有硬化性樹脂組成物 |
| JP6650704B2 (ja) * | 2015-08-31 | 2020-02-19 | エルジー ディスプレイ カンパニー リミテッド | フレキシブル有機ｅｌ表示装置 |
| KR20180081725A (ko) * | 2015-11-09 | 2018-07-17 | 닛뽄 가야쿠 가부시키가이샤 | 시일제 |
| KR101805298B1 (ko) * | 2016-03-22 | 2017-12-05 | 주식회사 케이씨씨 | 열경화형 접착 필름 |
| JP6654505B2 (ja) * | 2016-05-18 | 2020-02-26 | 双葉電子工業株式会社 | 乾燥剤、封止構造、及び有機ｅｌ素子 |
| FR3051797A1 (fr) | 2016-05-24 | 2017-12-01 | Univ Claude Bernard Lyon | Materiau composite epoxyde / thermoplastique et son procede de preparation |
| CN110036070A (zh) * | 2016-12-07 | 2019-07-19 | 日立化成株式会社 | 密封用树脂组合物、固化物、电子部件装置及电子部件装置的制造方法 |
| JP2018178102A (ja) * | 2017-04-04 | 2018-11-15 | ナガセケムテックス株式会社 | 熱硬化性樹脂シートおよびその製造方法 |
| JP6879082B2 (ja) * | 2017-06-29 | 2021-06-02 | 昭和電工マテリアルズ株式会社 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 |
| JP7375541B2 (ja) * | 2017-09-15 | 2023-11-08 | 株式会社レゾナック | エポキシ樹脂組成物、及び電子部品装置 |
| JP7047539B2 (ja) * | 2018-03-30 | 2022-04-05 | 味の素株式会社 | 樹脂組成物及びその硬化体 |
| JP6485721B1 (ja) * | 2018-10-12 | 2019-03-20 | ナガセケムテックス株式会社 | 熱硬化性シートの製造方法および電子部品の封止方法 |
| JP7354251B2 (ja) * | 2018-12-07 | 2023-10-02 | エルジー・ケム・リミテッド | 封止組成物 |
| WO2023276814A1 (ja) * | 2021-06-29 | 2023-01-05 | ナミックス株式会社 | エポキシ樹脂組成物、半導体装置および半導体装置の製造方法 |
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| JPS59170116A (ja) * | 1983-03-16 | 1984-09-26 | Sanyurejin Kk | 液状エポキシ樹脂組成物 |
| JP3233382B2 (ja) * | 1993-12-20 | 2001-11-26 | 住友ベークライト株式会社 | 樹脂組成物 |
| JP4752087B2 (ja) * | 2000-03-22 | 2011-08-17 | カシオ計算機株式会社 | 電界発光素子 |
| JP2004079208A (ja) * | 2002-08-09 | 2004-03-11 | Senyo Shoji Kk | 有機ｅｌ素子封止用ガラス部材及び前記ガラス部材を用いた有機ｅｌパネル |
| JP2004231938A (ja) * | 2002-09-13 | 2004-08-19 | Sekisui Chem Co Ltd | 有機ｅｌ素子封止用光硬化性接着剤組成物、有機ｅｌ素子の封止方法および有機ｅｌ素子 |
| TWI225501B (en) * | 2002-11-06 | 2004-12-21 | Delta Optoelectronics Inc | Packaging material used for a display device and method of forming thereof |
| JP2005122910A (ja) * | 2003-10-14 | 2005-05-12 | Hitachi Ltd | 有機ｅｌディスプレイ装置および有機ｅｌ素子の構造体の製造方法 |
| JP4933751B2 (ja) * | 2004-06-23 | 2012-05-16 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス素子封止剤、及び、有機エレクトロルミネッセンス素子 |
| JP2006291072A (ja) * | 2005-04-12 | 2006-10-26 | Sekisui Chem Co Ltd | 光硬化型樹脂組成物、有機エレクトロルミネッセンス素子用接着剤、有機エレクトロルミネッセンス表示素子、及び、有機エレクトロルミネッセンス表示素子の製造方法 |
| JP2007134321A (ja) * | 2005-10-14 | 2007-05-31 | Matsushita Electric Ind Co Ltd | 発光装置、発光装置の製造方法および露光装置、画像形成装置 |
| KR100838073B1 (ko) * | 2005-12-30 | 2008-06-13 | 삼성에스디아이 주식회사 | 유기 발광 소자 및 그 제조 방법 |
| JP2007197517A (ja) * | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | 接着性封止組成物、封止フィルム及び有機ｅｌ素子 |
| JP2007284472A (ja) * | 2006-04-12 | 2007-11-01 | Shin Etsu Chem Co Ltd | エンドシール材 |
| JP4753803B2 (ja) * | 2006-06-28 | 2011-08-24 | 京セラ株式会社 | 有機ｅｌディスプレイ |
| EP2174969A4 (en) * | 2007-07-26 | 2012-07-25 | Ajinomoto Kk | RESIN COMPOSITION |
| WO2009107201A1 (ja) * | 2008-02-26 | 2009-09-03 | パイオニア株式会社 | 有機ｅｌパネル及びその製造方法 |
| JP2009259656A (ja) * | 2008-04-18 | 2009-11-05 | Toyo Ink Mfg Co Ltd | 封止剤 |
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2010
- 2010-01-22 TW TW099101808A patent/TWI504662B/zh active
- 2010-01-22 JP JP2010547523A patent/JP5601202B2/ja active Active
- 2010-01-22 TW TW104114127A patent/TW201529709A/zh unknown
- 2010-01-22 WO PCT/JP2010/050759 patent/WO2010084939A1/ja active Application Filing
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2014
- 2014-08-19 JP JP2014166667A patent/JP2015015250A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2010084939A1 (ja) | 2012-07-19 |
| JP5601202B2 (ja) | 2014-10-08 |
| JP2015015250A (ja) | 2015-01-22 |
| TWI504662B (zh) | 2015-10-21 |
| WO2010084939A1 (ja) | 2010-07-29 |
| TW201038660A (en) | 2010-11-01 |
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