TW201518471A - 導電性接著劑、導電性接著片、配線裝置及配線裝置的製造方法 - Google Patents

導電性接著劑、導電性接著片、配線裝置及配線裝置的製造方法 Download PDF

Info

Publication number
TW201518471A
TW201518471A TW103138122A TW103138122A TW201518471A TW 201518471 A TW201518471 A TW 201518471A TW 103138122 A TW103138122 A TW 103138122A TW 103138122 A TW103138122 A TW 103138122A TW 201518471 A TW201518471 A TW 201518471A
Authority
TW
Taiwan
Prior art keywords
conductive adhesive
parts
weight
adhesive layer
conductive
Prior art date
Application number
TW103138122A
Other languages
English (en)
Chinese (zh)
Inventor
Satoshi Nishinohara
Hidenobu Kobayashi
Kazunori Matsudo
Original Assignee
Toyo Ink Sc Holdings Co Ltd
Toyochem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink Sc Holdings Co Ltd, Toyochem Co Ltd filed Critical Toyo Ink Sc Holdings Co Ltd
Publication of TW201518471A publication Critical patent/TW201518471A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C08L61/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW103138122A 2013-11-07 2014-11-04 導電性接著劑、導電性接著片、配線裝置及配線裝置的製造方法 TW201518471A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013231200 2013-11-07

Publications (1)

Publication Number Publication Date
TW201518471A true TW201518471A (zh) 2015-05-16

Family

ID=53041393

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103138122A TW201518471A (zh) 2013-11-07 2014-11-04 導電性接著劑、導電性接著片、配線裝置及配線裝置的製造方法

Country Status (3)

Country Link
JP (1) JP5928556B2 (enExample)
TW (1) TW201518471A (enExample)
WO (1) WO2015068611A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI720356B (zh) * 2018-03-15 2021-03-01 日商拓自達電線股份有限公司 電磁波屏蔽膜及屏蔽印刷配線板
CN113748161A (zh) * 2019-04-26 2021-12-03 东亚合成株式会社 树脂组合物、接合膜、带有树脂组合物层的层叠体、层叠体、及电磁波屏蔽膜
TWI800700B (zh) * 2018-12-12 2023-05-01 日商拓自達電線股份有限公司 屏蔽印刷配線板及屏蔽印刷配線板之製造方法
CN116529333A (zh) * 2020-12-10 2023-08-01 味之素株式会社 导电性粘接膜
TWI895524B (zh) * 2020-10-23 2025-09-01 日商東亞合成股份有限公司 樹脂組成物、黏合薄膜、附有樹脂組成物層的積層體、積層體、及電磁波遮蔽薄膜

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107109161B (zh) * 2014-11-12 2019-07-02 迪睿合株式会社 热固化性粘合组合物
JP2017118102A (ja) * 2015-12-18 2017-06-29 Dic株式会社 熱硬化性接着シート、補強部付フレキシブルプリント配線板、その製造方法及び電子機器
WO2019035697A1 (ko) * 2017-08-18 2019-02-21 주식회사 네패스 Emi 차폐필름
CN110776847B (zh) * 2018-07-27 2021-11-12 嘉兴蓉阳电子科技有限公司 一种导电胶、原料组合物、电子元件、制备方法和应用
KR20200038814A (ko) 2018-10-04 2020-04-14 주식회사 엘지화학 회로 기판 제조용 연속 시트의 제조 방법 및 이로부터 제조된 회로 기판 제조용 연속 시트
TWI796476B (zh) 2018-10-22 2023-03-21 日商拓自達電線股份有限公司 導電性接著片
JP6904464B2 (ja) * 2019-06-12 2021-07-14 東洋インキＳｃホールディングス株式会社 プリント配線板
TWI815049B (zh) 2019-12-03 2023-09-11 日商拓自達電線股份有限公司 電磁波屏蔽膜
JP6956926B1 (ja) 2020-01-07 2021-11-02 タツタ電線株式会社 電磁波シールドフィルム
TWI842957B (zh) 2020-02-26 2024-05-21 日商拓自達電線股份有限公司 電磁波屏蔽膜
CN111440580A (zh) * 2020-04-23 2020-07-24 东莞市中凌包装材料有限公司 一种水性基于apao的一次性医用包装热熔胶及制作工艺
JP7107344B2 (ja) * 2020-10-06 2022-07-27 東洋インキＳｃホールディングス株式会社 金属板用接合剤、プリント配線板用補強部材及びその製造方法、並びに、配線板及びその製造方法
JP7759533B1 (ja) 2024-06-20 2025-10-24 ａｒｔｉｅｎｃｅ株式会社 接着剤組成物、硬化物、接着シートおよび燃料電池用部材、並びにウレタンウレア樹脂の製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63280785A (ja) * 1987-05-14 1988-11-17 Mitsui Toatsu Chem Inc 構造用接着剤
JPH07157740A (ja) * 1993-12-07 1995-06-20 Nissan Motor Co Ltd 接着性樹脂組成物
EP1542273B1 (en) * 1997-03-31 2013-09-25 Hitachi Chemical Co., Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
JP3532749B2 (ja) * 1997-12-29 2004-05-31 株式会社巴川製紙所 導電性組成物、それを用いた導電性接着剤
JP2000100872A (ja) * 1998-09-17 2000-04-07 Sony Corp 電子部品装置およびそのリペアー方法
CN100357382C (zh) * 1999-02-08 2007-12-26 日立化成工业株式会社 用于电路连接的粘合剂、电极连接构造及电极连接方法
JP2002285103A (ja) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP2002368043A (ja) * 2001-06-12 2002-12-20 Matsushita Electric Ind Co Ltd 導電性ペーストとそれを用いた導電性バンプおよびその形成方法、導電性バンプの接続方法、並びに回路基板とその製造方法
KR100527990B1 (ko) * 2001-11-30 2005-11-09 미쯔이카가쿠 가부시기가이샤 회로 접속용 페이스트, 이방성 도전 페이스트 및 이들의사용방법
JP3864078B2 (ja) * 2001-11-30 2006-12-27 三井化学株式会社 異方性導電ペーストおよびその使用方法
JP3981341B2 (ja) * 2003-05-27 2007-09-26 住友ベークライト株式会社 異方導電性接着剤
JP2006124531A (ja) * 2004-10-29 2006-05-18 Shin Etsu Chem Co Ltd 異方導電性接着剤
JP4844003B2 (ja) * 2005-05-10 2011-12-21 日立化成工業株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
JP5233392B2 (ja) * 2008-04-30 2013-07-10 東洋インキＳｃホールディングス株式会社 ポリウレタンポリウレア接着剤、それを用いた硬化性電磁波シールド性接着性フィルム及びその製造方法
CN104263291A (zh) * 2007-08-08 2015-01-07 日立化成工业株式会社 粘接剂组合物、膜状粘接剂和电路部件的连接结构
WO2009090997A1 (ja) * 2008-01-15 2009-07-23 Toyo Ink Manufacturing Co., Ltd. 硬化性電磁波シールド性接着性フィルム、その製造方法、及びその使用方法、並びに電磁波遮蔽物の製造方法及び電磁波遮蔽物
KR101473045B1 (ko) * 2008-01-15 2014-12-15 토요잉크Sc홀딩스주식회사 경화성 전자파 차폐성 접착성 필름, 그의 제조방법, 그의 사용방법, 전자파 차폐물의 제조방법 및 전자파 차폐물
JP2010143981A (ja) * 2008-12-17 2010-07-01 Toyo Ink Mfg Co Ltd 硬化性導電性ポリウレタンポリウレア接着剤組成物、硬化性電磁波シールド性接着性フィルムおよびその製造方法
JP2011111474A (ja) * 2009-11-24 2011-06-09 Hitachi Chem Co Ltd 回路接続材料
WO2012011265A1 (ja) * 2010-07-23 2012-01-26 タツタ電線株式会社 接着剤組成物及び接着フィルム
JP2013125598A (ja) * 2011-12-13 2013-06-24 Sumitomo Electric Ind Ltd フィルム状異方導電性接着剤
JP2013143292A (ja) * 2012-01-11 2013-07-22 Sekisui Chem Co Ltd 異方性導電フィルム材料、接続構造体及び接続構造体の製造方法
WO2014003159A1 (ja) * 2012-06-29 2014-01-03 タツタ電線株式会社 導電性接着剤組成物、導電性接着フィルム、接着方法及び回路基板
JP5976112B2 (ja) * 2012-07-11 2016-08-23 タツタ電線株式会社 硬化性導電性接着剤組成物、電磁波シールドフィルム、導電性接着フィルム、接着方法及び回路基板

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI720356B (zh) * 2018-03-15 2021-03-01 日商拓自達電線股份有限公司 電磁波屏蔽膜及屏蔽印刷配線板
TWI800700B (zh) * 2018-12-12 2023-05-01 日商拓自達電線股份有限公司 屏蔽印刷配線板及屏蔽印刷配線板之製造方法
CN113748161A (zh) * 2019-04-26 2021-12-03 东亚合成株式会社 树脂组合物、接合膜、带有树脂组合物层的层叠体、层叠体、及电磁波屏蔽膜
TWI842878B (zh) * 2019-04-26 2024-05-21 日商東亞合成股份有限公司 樹脂組成物、接合薄膜、附有樹脂組成物層之積層體、積層體、及電磁波屏蔽薄膜
TWI895524B (zh) * 2020-10-23 2025-09-01 日商東亞合成股份有限公司 樹脂組成物、黏合薄膜、附有樹脂組成物層的積層體、積層體、及電磁波遮蔽薄膜
CN116529333A (zh) * 2020-12-10 2023-08-01 味之素株式会社 导电性粘接膜

Also Published As

Publication number Publication date
JP2015110769A (ja) 2015-06-18
WO2015068611A1 (ja) 2015-05-14
JP5928556B2 (ja) 2016-06-01

Similar Documents

Publication Publication Date Title
JP5928556B2 (ja) 導電性接着シート、配線デバイス、および配線デバイスの製造方法
TWI621686B (zh) 導電性接著劑、導電性接著片及配線元件
KR101973137B1 (ko) 도전성 접착제 조성물
JP4114706B2 (ja) 電磁波シールド性接着フィルム及びその製造方法、並びに被着体の電磁波遮蔽方法
JP5931305B1 (ja) 導電性接着剤組成物
CN101268163B (zh) 粘结剂组合物、使用它的粘结剂片及其应用
JPWO2014010524A1 (ja) 硬化性導電性接着剤組成物、電磁波シールドフィルム、導電性接着フィルム、接着方法及び回路基板
JP7099580B2 (ja) プリント配線板
JP2010229282A (ja) ポリウレタンポリウレア樹脂組成物、それを用いた硬化性電磁波シールド性接着性フィルム及びその製造方法
JP2009096940A (ja) 難燃性接着剤組成物、カバーレイおよび接着剤シート、フレキシブルプリント配線板
JP2009289840A (ja) 電磁波シールド性接着フィルム
JP2009290195A (ja) 硬化性電磁波シールド性接着性フィルムおよびその製造方法
JP2009277980A (ja) 電磁波シールド性接着フィルムおよびその製造方法
JP2010283175A (ja) 難燃性電磁波シールド接着フィルム及びその製造方法
JP5233392B2 (ja) ポリウレタンポリウレア接着剤、それを用いた硬化性電磁波シールド性接着性フィルム及びその製造方法
JP2009194353A (ja) 硬化性電磁波シールド性接着性フィルムおよびその製造方法
JP2010189589A (ja) 硬化性難燃性電磁波シールド接着フィルム
JP2010143981A (ja) 硬化性導電性ポリウレタンポリウレア接着剤組成物、硬化性電磁波シールド性接着性フィルムおよびその製造方法
JP5286740B2 (ja) 接着剤組成物、それを用いた接着剤シート、および補強材付きフレキシブルプリント配線板
JP6508078B2 (ja) 導電性接着剤、導電性接着シート、および配線デバイス
JP2011151095A (ja) 難燃性電磁波シールド接着フィルム及びその製造方法
JP2010238870A (ja) 電磁波シールド性カバーレイフィルム、フレキシブルプリント配線板の製造方法、及びフレキシブルプリント配線板。
JP2007073737A (ja) 複数の導電性回路層を有するプリント配線板並びにその製造方法
JP2007030177A (ja) フレキシブル銅張板及びフレキシブル銅張板の製造方法、並びにフレキシブルプリント配線板
JPWO2007032463A1 (ja) 接着剤組成物、それを用いた接着剤シート、並びにそれらの利用