JP5928556B2 - 導電性接着シート、配線デバイス、および配線デバイスの製造方法 - Google Patents

導電性接着シート、配線デバイス、および配線デバイスの製造方法 Download PDF

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Publication number
JP5928556B2
JP5928556B2 JP2014226400A JP2014226400A JP5928556B2 JP 5928556 B2 JP5928556 B2 JP 5928556B2 JP 2014226400 A JP2014226400 A JP 2014226400A JP 2014226400 A JP2014226400 A JP 2014226400A JP 5928556 B2 JP5928556 B2 JP 5928556B2
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conductive adhesive
elastomer
resin
adhesive layer
conductive
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Japanese (ja)
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JP2015110769A (ja
JP2015110769A5 (enExample
Inventor
聡 西之原
聡 西之原
英宣 小林
英宣 小林
和規 松戸
和規 松戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyochem Co Ltd
Artience Co Ltd
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Toyo Ink SC Holdings Co Ltd
Toyochem Co Ltd
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Publication of JP2015110769A5 publication Critical patent/JP2015110769A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C08L61/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Structure Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
JP2014226400A 2013-11-07 2014-11-06 導電性接着シート、配線デバイス、および配線デバイスの製造方法 Active JP5928556B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014226400A JP5928556B2 (ja) 2013-11-07 2014-11-06 導電性接着シート、配線デバイス、および配線デバイスの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013231200 2013-11-07
JP2013231200 2013-11-07
JP2014226400A JP5928556B2 (ja) 2013-11-07 2014-11-06 導電性接着シート、配線デバイス、および配線デバイスの製造方法

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JP2015110769A JP2015110769A (ja) 2015-06-18
JP2015110769A5 JP2015110769A5 (enExample) 2015-12-24
JP5928556B2 true JP5928556B2 (ja) 2016-06-01

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JP (1) JP5928556B2 (enExample)
TW (1) TW201518471A (enExample)
WO (1) WO2015068611A1 (enExample)

Cited By (1)

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KR20190019874A (ko) * 2017-08-18 2019-02-27 주식회사 네패스 Emi 차폐필름

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KR101941386B1 (ko) * 2014-11-12 2019-01-22 데쿠세리아루즈 가부시키가이샤 열경화성 접착 조성물
JP2017118102A (ja) * 2015-12-18 2017-06-29 Dic株式会社 熱硬化性接着シート、補強部付フレキシブルプリント配線板、その製造方法及び電子機器
JP6714631B2 (ja) * 2018-03-15 2020-06-24 タツタ電線株式会社 電磁波シールドフィルム及びシールドプリント配線板
JP7196200B2 (ja) * 2018-07-27 2022-12-26 嘉興蓉陽電子科技有限公司 導電性接着剤、原料組成物、電子部品、製造方法及び使用
KR20200038814A (ko) * 2018-10-04 2020-04-14 주식회사 엘지화학 회로 기판 제조용 연속 시트의 제조 방법 및 이로부터 제조된 회로 기판 제조용 연속 시트
TWI796476B (zh) 2018-10-22 2023-03-21 日商拓自達電線股份有限公司 導電性接著片
JP7307095B2 (ja) * 2018-12-12 2023-07-11 タツタ電線株式会社 シールドプリント配線板及びシールドプリント配線板の製造方法
WO2020218114A1 (ja) * 2019-04-26 2020-10-29 東亞合成株式会社 樹脂組成物、ボンディングフィルム、樹脂組成物層付き積層体、積層体、及び、電磁波シールドフィルム
JP6904464B2 (ja) * 2019-06-12 2021-07-14 東洋インキＳｃホールディングス株式会社 プリント配線板
TWI815049B (zh) 2019-12-03 2023-09-11 日商拓自達電線股份有限公司 電磁波屏蔽膜
CN114762470B (zh) 2020-01-07 2025-03-14 拓自达电线株式会社 电磁波屏蔽膜
TWI842957B (zh) 2020-02-26 2024-05-21 日商拓自達電線股份有限公司 電磁波屏蔽膜
CN111440580A (zh) * 2020-04-23 2020-07-24 东莞市中凌包装材料有限公司 一种水性基于apao的一次性医用包装热熔胶及制作工艺
JP7107344B2 (ja) * 2020-10-06 2022-07-27 東洋インキＳｃホールディングス株式会社 金属板用接合剤、プリント配線板用補強部材及びその製造方法、並びに、配線板及びその製造方法
JPWO2022085563A1 (enExample) * 2020-10-23 2022-04-28
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190019874A (ko) * 2017-08-18 2019-02-27 주식회사 네패스 Emi 차폐필름
KR102066730B1 (ko) * 2017-08-18 2020-01-15 주식회사 네패스 Emi 차폐필름

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Publication number Publication date
JP2015110769A (ja) 2015-06-18
TW201518471A (zh) 2015-05-16
WO2015068611A1 (ja) 2015-05-14

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