TWI800700B - 屏蔽印刷配線板及屏蔽印刷配線板之製造方法 - Google Patents

屏蔽印刷配線板及屏蔽印刷配線板之製造方法 Download PDF

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Publication number
TWI800700B
TWI800700B TW108145563A TW108145563A TWI800700B TW I800700 B TWI800700 B TW I800700B TW 108145563 A TW108145563 A TW 108145563A TW 108145563 A TW108145563 A TW 108145563A TW I800700 B TWI800700 B TW I800700B
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
shielded printed
manufacturing
shielded
Prior art date
Application number
TW108145563A
Other languages
English (en)
Other versions
TW202029846A (zh
Inventor
春名裕介
山內志朗
田島宏
石岡宗悟
Original Assignee
日商拓自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商拓自達電線股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW202029846A publication Critical patent/TW202029846A/zh
Application granted granted Critical
Publication of TWI800700B publication Critical patent/TWI800700B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
TW108145563A 2018-12-12 2019-12-12 屏蔽印刷配線板及屏蔽印刷配線板之製造方法 TWI800700B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-232930 2018-12-12
JP2018232930 2018-12-12

Publications (2)

Publication Number Publication Date
TW202029846A TW202029846A (zh) 2020-08-01
TWI800700B true TWI800700B (zh) 2023-05-01

Family

ID=71075786

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108145563A TWI800700B (zh) 2018-12-12 2019-12-12 屏蔽印刷配線板及屏蔽印刷配線板之製造方法

Country Status (6)

Country Link
US (1) US11457527B2 (zh)
JP (1) JP7307095B2 (zh)
KR (1) KR102640159B1 (zh)
CN (1) CN113170604A (zh)
TW (1) TWI800700B (zh)
WO (1) WO2020122166A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114650648A (zh) * 2020-12-21 2022-06-21 3M创新有限公司 贴附了3d成型的电磁屏蔽膜的电路板、可3d成型的电磁屏蔽膜和3d成型的电磁屏蔽膜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201518471A (zh) * 2013-11-07 2015-05-16 Toyo Ink Sc Holdings Co Ltd 導電性接著劑、導電性接著片、配線裝置及配線裝置的製造方法
TW201704412A (zh) * 2015-07-16 2017-02-01 東洋油墨Ｓｃ控股股份有限公司 導電性接著劑層、導電性接著片、印刷配線板及電子機器
US20180126175A1 (en) * 2016-11-08 2018-05-10 Greatbatch Ltd. Hermetic terminal for an aimd having a composite brazed conductive lead
US20180332718A1 (en) * 2017-02-08 2018-11-15 Yazaki Corporation Electrical Connection Method of Printed Circuit and Electrical Connection Structure of Printed Circuit

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269632A (ja) * 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd シールドフレキシブルプリント配線板の製造方法、シールドフレキシブルプリント配線板用補強シールドフィルム及びシールドフレキシブルプリント配線板
JP4201548B2 (ja) * 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2014123630A (ja) * 2012-12-20 2014-07-03 Tatsuta Electric Wire & Cable Co Ltd シールドプリント配線板の製造方法、シールドフィルム、及び、シールドプリント配線板
KR102083251B1 (ko) 2014-08-29 2020-03-02 타츠타 전선 주식회사 플렉시블 프린트 배선판용 보강 부재, 및 이것을 포함한 플렉시블 프린트 배선판
TWI594671B (zh) * 2014-12-17 2017-08-01 Flexible circuit board micro-aperture conductive through-hole structure and manufacturing method
JP6187568B2 (ja) * 2015-09-17 2017-08-30 東洋インキＳｃホールディングス株式会社 電磁波シールド用積層体、電磁波シールド積層体、電子機器およびその製造方法
JP2018041953A (ja) * 2016-08-31 2018-03-15 東洋インキＳｃホールディングス株式会社 電磁波シールド積層体、この電磁波シールド積層体を用いた電子機器およびその製造方法
JP2018110769A (ja) 2017-01-13 2018-07-19 株式会社三洋物産 遊技機
JP2017212472A (ja) * 2017-09-12 2017-11-30 タツタ電線株式会社 シールドフィルム、及び、シールドプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201518471A (zh) * 2013-11-07 2015-05-16 Toyo Ink Sc Holdings Co Ltd 導電性接著劑、導電性接著片、配線裝置及配線裝置的製造方法
TW201704412A (zh) * 2015-07-16 2017-02-01 東洋油墨Ｓｃ控股股份有限公司 導電性接著劑層、導電性接著片、印刷配線板及電子機器
US20180126175A1 (en) * 2016-11-08 2018-05-10 Greatbatch Ltd. Hermetic terminal for an aimd having a composite brazed conductive lead
US20180332718A1 (en) * 2017-02-08 2018-11-15 Yazaki Corporation Electrical Connection Method of Printed Circuit and Electrical Connection Structure of Printed Circuit

Also Published As

Publication number Publication date
US20220030699A1 (en) 2022-01-27
US11457527B2 (en) 2022-09-27
JPWO2020122166A1 (ja) 2021-10-21
KR102640159B1 (ko) 2024-02-22
WO2020122166A1 (ja) 2020-06-18
KR20210099012A (ko) 2021-08-11
JP7307095B2 (ja) 2023-07-11
CN113170604A (zh) 2021-07-23
TW202029846A (zh) 2020-08-01

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