SG10201910031VA - Wiring board manufacturing method - Google Patents

Wiring board manufacturing method

Info

Publication number
SG10201910031VA
SG10201910031VA SG10201910031VA SG10201910031VA SG10201910031VA SG 10201910031V A SG10201910031V A SG 10201910031VA SG 10201910031V A SG10201910031V A SG 10201910031VA SG 10201910031V A SG10201910031V A SG 10201910031VA SG 10201910031V A SG10201910031V A SG 10201910031VA
Authority
SG
Singapore
Prior art keywords
wiring board
board manufacturing
manufacturing
wiring
board
Prior art date
Application number
SG10201910031VA
Inventor
Suzuki Katsuhiko
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201910031VA publication Critical patent/SG10201910031VA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
SG10201910031VA 2018-11-05 2019-10-26 Wiring board manufacturing method SG10201910031VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018208323A JP2020077670A (en) 2018-11-05 2018-11-05 Manufacturing method of wiring board

Publications (1)

Publication Number Publication Date
SG10201910031VA true SG10201910031VA (en) 2020-06-29

Family

ID=70458817

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201910031VA SG10201910031VA (en) 2018-11-05 2019-10-26 Wiring board manufacturing method

Country Status (7)

Country Link
US (1) US11153975B2 (en)
JP (1) JP2020077670A (en)
KR (1) KR20200051484A (en)
CN (1) CN111148344A (en)
DE (1) DE102019216954A1 (en)
SG (1) SG10201910031VA (en)
TW (1) TW202037243A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112776454B (en) * 2021-02-01 2023-01-10 中山市睿科智能电子有限公司 Flexible copper-clad plate laminating machine

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2716268A (en) * 1952-10-16 1955-08-30 Erie Resistor Corp Method of making printed circuits
US4327143A (en) * 1981-01-23 1982-04-27 Westinghouse Electric Corp. Moisture resistant laminates impregnated with an impregnating composition comprising epoxy resin and a dicyandiamide derivative
JP4300687B2 (en) 1999-10-28 2009-07-22 味の素株式会社 Manufacturing method of multilayer printed wiring board using adhesive film
JP2003101222A (en) * 2001-09-21 2003-04-04 Sony Corp Thin film circuit substrate unit and its manufacturing method
JP4703141B2 (en) * 2004-07-22 2011-06-15 株式会社荏原製作所 Polishing apparatus, substrate processing apparatus, and substrate jumping detection method
JP5217639B2 (en) * 2008-05-30 2013-06-19 富士通株式会社 Core substrate and printed wiring board
TW201124267A (en) * 2009-09-25 2011-07-16 Sumitomo Chemical Co Method of preparing metal foil laminate
JP2013080823A (en) 2011-10-04 2013-05-02 Ibiden Co Ltd Printed wiring board and manufacturing method of the same
JP2014168007A (en) * 2013-02-28 2014-09-11 Kyocer Slc Technologies Corp Wiring board and manufacturing method of the same
JP6779087B2 (en) * 2016-10-05 2020-11-04 株式会社ディスコ Wiring board manufacturing method

Also Published As

Publication number Publication date
JP2020077670A (en) 2020-05-21
US20200146158A1 (en) 2020-05-07
DE102019216954A1 (en) 2020-05-07
KR20200051484A (en) 2020-05-13
TW202037243A (en) 2020-10-01
CN111148344A (en) 2020-05-12
US11153975B2 (en) 2021-10-19

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