HK1250118A1 - Method for manufacturing shield printed wiring board - Google Patents

Method for manufacturing shield printed wiring board

Info

Publication number
HK1250118A1
HK1250118A1 HK18109513.9A HK18109513A HK1250118A1 HK 1250118 A1 HK1250118 A1 HK 1250118A1 HK 18109513 A HK18109513 A HK 18109513A HK 1250118 A1 HK1250118 A1 HK 1250118A1
Authority
HK
Hong Kong
Prior art keywords
wiring board
printed wiring
shield printed
manufacturing shield
manufacturing
Prior art date
Application number
HK18109513.9A
Other languages
Chinese (zh)
Inventor
Kousuke Kado
Kazuhiro Hashimoto
Syouhei Morimoto
Hiroshi Tajima
Masahiro Watanabe
Sirou Yamauchi
Original Assignee
Tatsuta Electric Wire & Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire & Cable Co Ltd filed Critical Tatsuta Electric Wire & Cable Co Ltd
Publication of HK1250118A1 publication Critical patent/HK1250118A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
HK18109513.9A 2015-09-14 2018-07-23 Method for manufacturing shield printed wiring board HK1250118A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015180656 2015-09-14
PCT/JP2016/004154 WO2017047072A1 (en) 2015-09-14 2016-09-13 Method for manufacturing shield printed wiring board

Publications (1)

Publication Number Publication Date
HK1250118A1 true HK1250118A1 (en) 2018-11-23

Family

ID=58288552

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18109513.9A HK1250118A1 (en) 2015-09-14 2018-07-23 Method for manufacturing shield printed wiring board

Country Status (6)

Country Link
JP (1) JPWO2017047072A1 (en)
KR (1) KR20180053677A (en)
CN (1) CN108029195A (en)
HK (1) HK1250118A1 (en)
TW (1) TW201722227A (en)
WO (1) WO2017047072A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018199128A1 (en) * 2017-04-28 2018-11-01 日東電工株式会社 Flexible wiring circuit board and imaging device
JP7390779B2 (en) 2017-04-28 2023-12-04 日東電工株式会社 Flexible wiring circuit board and imaging device
CN107272260B (en) 2017-07-19 2020-04-21 京东方科技集团股份有限公司 Backlight lamp strip, backlight module and display device
KR102607345B1 (en) * 2018-12-11 2023-11-27 타츠타 전선 주식회사 Manufacturing method of shielded printed wiring board and shielded printed wiring board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002079771A (en) * 2000-09-07 2002-03-19 Shinwa Kogyo Kk Master plate for intaglio offset printing, manufacturing method of the master plate and forming method of film circuit using the master plate
JP2006024824A (en) * 2004-07-09 2006-01-26 Tatsuta System Electronics Kk Impedance control film, impedance control shield film, and wiring board using them
JP2009016545A (en) * 2007-07-04 2009-01-22 Dainippon Printing Co Ltd Electromagnetic wave shielding material, its manufacturing method, filter for display device, and its manufacturing method
JP4399019B1 (en) * 2008-07-31 2010-01-13 株式会社東芝 Electronic device, flexible printed wiring board, and method for manufacturing flexible printed wiring board
CN102693962A (en) * 2011-03-22 2012-09-26 精材科技股份有限公司 Integrated circuit wafer having electromagnetic shielding effect and manufacture method thereof

Also Published As

Publication number Publication date
CN108029195A (en) 2018-05-11
JPWO2017047072A1 (en) 2018-07-05
TW201722227A (en) 2017-06-16
KR20180053677A (en) 2018-05-23
WO2017047072A1 (en) 2017-03-23

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