JP2002079771A - Master plate for intaglio offset printing, manufacturing method of the master plate and forming method of film circuit using the master plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a master plate for a deep-etch plate type offset printing which is excellent in reproducibility and enables attainment of a minute and highly precise image and a manufacturing method thereof and also to provide a forming method of a film circuit having high reproducibility and enabling attainment of a minute and highly precise circuit pattern. SOLUTION: A recess part 5 to be an image part is formed in an aluminum substrate 3 prepared by forming an anodized film 4 on the surface of an aluminum sheet, and a ground metal layer 6 excellent in adhesion to aluminum and a copper-plating layer 7 are formed on the recess part 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a master plate for intaglio offset printing, a method of manufacturing the master plate, and a method of forming a film circuit using the master plate.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller and lighter and have more functions, there is an increasing demand for higher density circuit substrates and finer wiring. As is well known, the photolithography technology is a technology capable of responding to the demand for higher density and miniaturization as described above, but has a problem that the process is complicated, and the cost is high due to manufacturing facilities and process auxiliary materials. In a field where a reduction in manufacturing cost is urgently required, for example, in the manufacture of a printed wiring board for consumer equipment (hereinafter abbreviated as PCB) or a color filter used in a color liquid crystal display device, the process is simple, and Research has been conducted to form a fine film circuit using a printing technology that can be expected to be mass-produced.

[0003] For example, Japanese Patent Application Laid-Open No. 11-354979 discloses that a resist pattern is formed by printing on a conductive metal film by intaglio offset printing, and a portion of the metal film exposed in the resist pattern is removed by etching. Describes a method of forming a stripe-shaped or lattice-shaped electromagnetic wave shield pattern.

[0004] The lithographic plate (master plate) used for offset printing includes "special printing" (author: Kazuo Matsumoto, publisher:
Printing and Publishing Laboratory Co., Ltd., published in 1983). 25-
As described in No. 29, there are a planographic intaglio plate and a planographic plate plate composed of two different metal layers. The planographic printing plate is chrome-plated on the copper plate, the chromium in the image area is removed by etching to form a concave part where copper is exposed, and the planographic printing plate is copper-plated on the entire aluminum plate, and the copper in the non-image area is removed by etching. Then, aluminum is exposed to form a projection made of copper.

[0005] Regarding the master plate used for the offset printing, chromium or aluminum which is a non-image portion is hydrophilic, and a copper convex portion or a copper concave portion which is an image portion is lipophilic in both planographic and planographic printing plates. When the dampening solution is applied to the master plate, the non-image portion receives the water, but the image portion repels the water. In such a state, when the roller with the ink is rolled on the plate surface, the ink is peeled off in the non-image area, and the image area receives the ink and forms an ink film on the image area. After the ink film is once transferred to a blanket made of an elastic material such as rubber, the film is transferred again from the blanket to the print substrate.

[0006] As described above, it is necessary to prevent ink from adhering to the non-image area, that is, it is necessary to improve the releasability. Desirably, it is easy to accept.

[0007] Further, it is preferable that the amount of ink transferred to the printing substrate is large. However, in order to improve the releasability of the ink in the non-image area as described above, it is necessary to select an ink having low tackiness. Therefore, in the planographic printing plate, the thickness of the ink in the image area cannot be increased, and the amount of transferred ink is limited. On the other hand, in the planographic printing plate, the ink film thickness can be increased by increasing the depth of the concave portion in the image area, and the ink transfer amount can be increased.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to form a fine film circuit by using a printing technique which has a simple process and can be expected to be mass-produced. As described above, in order to increase the amount of ink transfer in offset printing, it is preferable to use a planographic master plate.

[0009] However, the conventional intaglio plate in which a chromium plating is applied to a conventional copper plate and the chromium is etched to form an image portion where copper is exposed has a problem that the drainage treatment and handling of heavy metal chromium are extremely troublesome. .

When a planographic printing plate is manufactured using a two-layer plate in which a hydrophilic chromium is plated on a lipophilic copper plate,
Since the bottom surface of the concave image portion is lipophilic but the side portion becomes hydrophilic, if the depth of the concave image portion is increased in order to increase the amount of ink transfer, water received on the side portion of the concave image portion There is a problem in that emulsification of the ink occurs, so that it is difficult to obtain a fine and accurate image with good reproducibility.

In addition, it is necessary to prevent the ink from adhering to the non-image area, that is, it is necessary to improve the releasability, and the non-image area is more hydrophilic and more easily accepts dampening solution. There is a problem that must be.

[0012] The present invention solves the above problems,
It provides a planographic intaglio-type offset printing master plate that does not use heavy metal materials such as chromium and has good reproducibility and can obtain fine and highly accurate images, and a method for manufacturing the same. It is intended to provide a method for forming a film circuit capable of obtaining a fine, high-precision circuit pattern with high accuracy.

[0013]

The first master for intaglio offset printing according to the present invention has a concave portion serving as an image portion formed on an aluminum support having an anodized film formed on a surface thereof, and the concave portion is sequentially formed in the concave portion. This is one in which a base metal layer and a copper plating layer having good adhesion to aluminum are formed.

[0014] A second intaglio offset printing master plate according to the present invention is the first intaglio offset printing master plate, wherein the base metal layer is tin or zinc.

According to a first method of manufacturing a master plate for intaglio offset printing according to the present invention, a step of applying a photoresist on an aluminum support having an anodic oxide film formed on its surface, and using a photomask having an image pattern. Exposing the photoresist to form a masking resist pattern in which the photoresist has been patterned by a development process, and forming recesses in the aluminum support using an etching bath containing phosphoric acid and hydrofluoric acid. Performing a displacement plating process using a substantially neutral plating bath to form a base metal layer in the recess, forming a copper plating layer on the base metal layer by electrolytic plating, and stripping the masking resist pattern. To perform the process.

According to a second method of manufacturing an intaglio offset printing master plate according to the present invention, in the first method of manufacturing an intaglio offset printing master plate, the base metal layer is made of tin or zinc.

A first method for forming a film circuit according to the present invention comprises:
A master plate for intaglio offset printing in which a concave portion serving as an image portion is formed on an aluminum support having an anodic oxide film formed on the surface, and a base metal layer and a copper plating layer having good adhesion to aluminum are sequentially formed in the concave portion. And an offset printing step of printing a resist ink on a circuit substrate to form a resist pattern.

According to a second method of forming a film circuit according to the present invention,
In the first film circuit forming method, in the offset printing step, a positive resist pattern is formed on the conductor film using a substrate having a conductor film formed on an insulating material as a circuit substrate. After the step, an etching step of etching the conductor film using the positive resist pattern as a masking resist is included.

According to a third method of forming a film circuit according to the present invention,
In the first film circuit forming method, in the offset printing step, an insulating material is used as a circuit base, a negative resist pattern is formed on the insulating material, and after the offset printing step, the negative resist is formed. The method includes a conductor film forming step of forming a conductor film in a pattern.

According to a fourth method of forming a membrane circuit according to the present invention,
In the first film circuit forming method, in the offset printing step, a negative resist pattern is formed on the conductive film using a base material having a conductive film formed on an insulating material as a circuit base material. After the step, a plating step of forming a plating film made of solder or tin on the conductor film of the negative resist pattern, a step of peeling the negative resist pattern, and using the plating film as a masking resist And an etching step of etching the conductive film.

According to a fifth method of forming a membrane circuit according to the present invention,
In the first method for forming a film circuit, the resist ink contains a resin which is cured by heating or irradiation with ultraviolet rays.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention uses an aluminum support having an anodized film formed on an aluminum plate or the like,
A concave image portion was formed on this aluminum support. Conventionally, an aluminum support having an anodized film formed on an aluminum plate or the like was used, and a concave image portion was formed on the aluminum support. There is no master plate for intaglio offset printing. The reason is that in forming a concave shape in the aluminum support or forming a lipophilic metal film in the concave portion, the resistance of the photoresist becomes an obstacle, and the formation of the concave portion with the adjusted depth and the concave portion This is because a lipophilic metal film having good adhesion to the film cannot be formed.

The present invention examines various photoresists to be applied to an aluminum support, and an etching bath and a plating bath for an aluminum plate in consideration of the durability of the photoresist, and performs etching capable of accurately adjusting the depth of a concave portion. The present invention has been realized as a result of finding plating conditions capable of forming copper plating with uniformity and good adhesion in the concave portion without impairing the conditions and the resistance of the photoresist.

FIG. 1 is a sectional view showing an embodiment of an offset printing master plate according to the present invention. In the figure, 1 is a master plate, 3 is an aluminum support having an aluminum plate on which an anodic oxide film 4 is formed, 5 is a recess formed in the aluminum support 3 by etching, and 6 is a recess formed in the recess 5 by electroless plating. Base metal layer. Reference numeral 7 denotes a copper plating layer formed on the base metal layer 6 by electrolytic plating, and the depth of the concave portion 5 is adjusted to a predetermined depth in a range of 5 μm to 30 μm. The base metal layer 6
Anything that can be replaced with aluminum, such as tin plating or zinc plating, to form a plating film with good adhesion may be used.Aluminum is a base metal for copper plating with poor adhesion and improves the adhesion of copper plating. is there.

Even if the depth of the concave portion 5 becomes 30 μm or more,
Due to piling (a phenomenon in which 100% of the ink does not transfer), the ink transfer amount does not increase. In addition, if the thickness of the copper plating layer 7 is 2 to 3 μm or more, lipophilicity can be maintained.

The non-image area where the anodic oxide film 3 is formed
Since the anodic oxide coating 3 has a strong hydrophilic property, the releasability of the ink is very good, and an lipophilic copper plating layer with improved adhesion is formed on the entire surface of the concave portion via a base metal in the image portion. By performing offset printing using the master plate 1, it is possible to print a fine pattern with a large amount of ink transfer, good reproducibility, and extremely high printing durability.

The method of manufacturing the master plate shown in FIG. 1 will be described with reference to the manufacturing process sectional views shown in FIG. First, a positive resist is applied to an aluminum support having an anodic oxide film formed on an aluminum plate, or a so-called PS plate in which an anodic oxide film is formed on an aluminum plate and further coated with a positive photoresist 8 ( A presensitized version 2 is prepared (FIG. 2A). Below, PS
This will be described using version 2.

Next, a photomask 9 (negative type) on which an image pattern is formed is brought into close contact with the positive type resist 8 and exposed (FIG. 2B).
Develop in a 1.5% by weight KOH aqueous solution to form a masking resist pattern (FIG. 2C). Here, the positive resist 8 is exposed and developed using a negative photomask 9, but the negative resist may be exposed and developed using a positive photomask.

Next, an aqueous solution containing 3 to 10% by weight of phosphoric acid, 0.1 to 1.0% by weight of hydrofluoric acid and 0.2% by weight of a nonionic surfactant is prepared. ~ 3
The substrate is immersed in an etching bath at 0 ° C., and the aluminum in the opening (masking resist pattern) of the positive resist 8 is etched to form a concave portion 10 (FIG. 2D). The depth of the recess 10 can be adjusted by the immersion time. This etching solution can uniformly etch the PS plate 2 having the anodic oxide film formed on the aluminum plate without impairing the resistance of the positive resist 8.

Next, the underlying metal layer 6 is formed in the recess 10 by electroless plating (FIG. 2E). For the electroless plating, electroless tin plating or electroless zinc plating that can be replaced with aluminum is used. In the case of electroless tin plating and electroless zinc plating, 10 or 10
In an electroless plating bath adjusted to pH 7 to 9 by adding chlorides and organic salts to an aqueous solution containing
Soak for 90 seconds.

In the above electroless plating, the positive resist 8
The pH is adjusted in consideration of the resistance of the solution to a neutral bath close to neutral. In addition, although electrolytic copper plating with good adhesion cannot be applied to aluminum, the base metal layer 6 with good adhesion to aluminum formed by this electroless plating is
By using the base metal for the electrolytic copper plating, the adhesion of the copper plating can be improved.

Next, flash plating is performed by immersion in an aqueous solution containing 0.5 to 1.0% by weight of copper ions and adjusted to about pH 10 with EDTA and an organic alkali.
This flash plating is immersed for about 30 to 60 seconds at a constant voltage control of 0.5 to 1.0 V. Subsequent to the flash plating, electrolytic plating is performed in an aqueous solution containing about 5 to 50 g / l of copper sulfate and about 0.01 g / l of a sulfur compound to form a copper plating layer 7 having a thickness of 2 to 3 μm. ,
The resist is immersed in an organic solvent to peel off and remove the positive resist 8 (FIG. 2 (f)). This electrolytic plating is 0.5 to 1.0
It is performed by V constant voltage management.

Next, a method for forming a film circuit using the master plate manufactured as described above will be described.

FIG. 3 is a configuration diagram showing the configuration of the offset printing press. In the figure, 11 is a roll-shaped cylinder on which the master plate 1 is set on the outer periphery, 12 is a damping device for supplying dampening water to the master plate 1, and 13 is an ink for the master plate 1 supplied with dampening water. Is a roll-shaped blanket cylinder on which a rubber blanket 15 is set on the outer circumference; 16 is an impression cylinder that supplies a printing material 17 between the blanket cylinder and the plate cylinder 11; Cylinder 14 and impression cylinder 16
Rotate in the directions of the arrows.

The dampening solution supplied from the dampening device 12 is received by the non-image portion of the master plate 1, the ink is supplied from the ink device 13 to the master plate 1 to which the dampening solution is supplied, and the ink is supplied to the image portion. Is accepted. Further, the ink received in the image area of the master plate 1 is transferred to the blanket 15 of the blanket cylinder 14, and the ink transferred to the blanket 15 is the printing material supplied between the blanket cylinder 14 and the impression cylinder 16. Transferred to 17.

FIG. 4 is a sectional view showing an embodiment of the film forming method of the present invention. As shown in the drawing, a resist ink is printed on a circuit substrate 21 having a conductor 19 formed on the surface of an insulating material 20 by using an offset printing machine to form a pattern of a masking resist 18.
8 by heat curing or UV irradiation curing,
A resist pattern is formed (FIG. 4A), and the conductor 19 exposed between the masking resists 18 is removed by wet etching to form a film circuit composed of the conductor 19 (FIG. 4B).

After the formation of the film circuit composed of the conductor 19, the masking resist 18 is washed with an alkaline solution or an organic solvent.
Is peeled off and washed and dried.

The circuit substrate 21 has a conductor such as copper or copper alloy adhered to an insulating material such as a polyimide resin film, a bakelite plate, or a glass epoxy resin plate, and an ITO (indium-tin oxide) ) Can be applied.

As the resist ink, a resin containing a thermosetting or ultraviolet-curable component is used, and the resist ink has resistance to the chemical depending on the chemical used for the wet etching.
A material having high adhesion to the circuit substrate 21 is selected.

As the UV-curable component, there can be mentioned, for example, those containing polyester acrylate, epoxy acrylate, polyurethane acrylate or the like as a main component, and blending a photopolymerizable monomer and a photopolymerization initiator. There is no particular limitation on the mixing method and mixing ratio, but it is necessary to mix a water-insoluble material in consideration of emulsification with a fountain solution during printing.

As the thermosetting resist ink, an alkali-soluble rosin-modified resin conventionally used in the production of PCBs can be used as a base, and the volatile components for forming the ink can be improved.

Further, a dispersant, a plasticizer, an antioxidant, an organic or inorganic pigment, conductive particles, and the like can be added to the resist ink as required.

In the method of forming the film circuit shown in FIG.
A positive circuit type resist pattern was formed on a circuit substrate having a conductor adhered to an insulating material, and the conductor exposed between the resist patterns was removed by etching to form a film circuit. As shown in FIG. The masking resist 18 is printed so as to form a negative resist pattern on the circuit substrate 22 made of a material (FIG. 5A).
A conductor 19 made of a metal such as copper or a copper alloy is formed by chemical vapor deposition, sputtering, electrolytic plating, or electroless plating (FIG. 5B), and after forming the conductor 19, the masking resist 18 is peeled off, so-called lift-off. A film circuit can also be formed by the method.

As the circuit substrate 22 of the lift-off method, glass, ceramic, or the like can be used in addition to an insulator such as a polyimide resin film, a bakelite plate, or a glass epoxy resin plate. In this case, a circuit substrate containing a catalyst such as palladium is used, or a catalyst such as palladium is adhered to the circuit substrate.

In the lift-off method, by using the method of forming the conductor 19 by electrolytic plating and electroless plating, the cost of manufacturing equipment can be reduced as compared with the method of forming the conductor 19 by chemical vapor deposition and sputtering. In addition, mass productivity can be improved.

As an effective application example of the lift-off method, there is a case where copper plating is performed in a through hole of a PCB. That is, when copper plating is performed in the through holes of the PCB, the thickness of the copper film in the surface of the PCB substrate varies, but as shown in the cross-sectional view of FIG. The masking resist 18 is printed so as to form a negative resist pattern exposing the
By performing copper plating in 5, it is possible to prevent variations in the copper film thickness in the plane of the PCB surface.

As shown in FIG. 7, a negative resist pattern (negative circuit pattern) is formed by printing a masking resist 18 on the surface of the PCB 23 in which the copper plating is performed in the through holes 25. After performing solder plating or tin plating on the copper surface (circuit pattern 26) including the exposed through holes 25, the masking resist 1
8 is removed, and copper is etched using solder plating or tin plating as a resist to form through holes 25.
And a highly reliable membrane circuit in which conduction of the circuit pattern 26 is ensured using inexpensive and simple offset printing.

Further, a negative resist pattern is formed by forming a transparent electrode such as a liquid crystal display device or a plasma display.
Alternatively, an inexpensive and simple manufacturing method can be provided by forming an electromagnetic wave shield or connecting a transparent electrode to a peripheral circuit.

[0049]

According to the first and second masters for intaglio offset printing according to the present invention, a concave portion serving as an image portion is formed on an aluminum support having an anodic oxide film formed on the surface thereof, and the concave portion is sequentially formed in the concave portion. Since it is formed with a base metal layer and a copper plating layer having good adhesion to aluminum,
It is possible to print a fine pattern with a large amount of ink transfer, good reproducibility, and improved printing durability.

According to the first and second methods of manufacturing a master plate for intaglio offset printing according to the present invention, a step of applying a photoresist on an aluminum support having an anodic oxide film formed on its surface, and a step of forming an image pattern Exposing the photoresist using a photomask having, a step of forming a masking resist pattern in which the photoresist is patterned by a development process, using an etching bath containing phosphoric acid and hydrofluoric acid, to the aluminum support Forming a concave portion, performing displacement plating using a substantially neutral plating bath, forming a base metal layer in the concave portion, forming a copper plating layer on the base metal layer by electrolytic plating, and masking Since it has a process of removing the resist pattern, the ink transfer amount is large and reproducibility Good, it is possible to print a fine pattern, also, it is possible to produce a good printing durability intaglio offset printing master plate.

According to the first method for forming a film circuit according to the present invention, a concave portion serving as an image portion is formed on an aluminum support having an anodic oxide film formed on the surface, and the adhesiveness to aluminum is sequentially formed in the concave portion. Using an intaglio offset printing master plate with a good base metal layer and copper plating layer formed thereon, the method includes an offset printing step of printing a resist ink on a circuit substrate to form a resist pattern, so that the transfer of the resist ink It is possible to print a fine circuit pattern with a large amount and good reproducibility on a circuit substrate.

According to the second film circuit forming method of the present invention, in the offset printing step, a substrate having a conductor film formed on an insulating material is used as a circuit substrate, and a positive resist is formed on the conductor film. After the offset printing step, a pattern is formed, and an etching step of etching the conductor film using the positive resist pattern as a masking resist is performed, so that the pattern is reproduced on the base material on which the conductor film is formed on the insulating material. A fine and fine film circuit can be formed.

According to the third film circuit forming method of the present invention, in the offset printing step, an insulating material is used as a circuit base material, and a negative resist pattern is formed on the insulating material. After that, a conductor film forming step of forming a conductor film on the negative resist pattern is included, so that a fine film circuit with good reproducibility can be formed on the insulating material.

According to the fourth film circuit forming method of the present invention, in the offset printing step, a substrate in which a conductor film is formed on an insulating material is used as a circuit substrate, and a negative resist is formed on the conductor film. Forming a pattern, after this offset printing step, a plating step of forming a plating film made of solder or tin on the conductor film of the negative resist pattern, and a step of peeling the negative resist pattern,
And an etching step of etching the conductor film using the plating film as a masking resist, so that the reproducibility, fineness, and continuity of the solder or tin film plating are improved on the substrate on which the conductor film is formed on the insulating material. Can form a compensated membrane circuit.

According to the fifth method of forming a film circuit according to the present invention, since the resist ink contains a resin which is cured by heating or irradiation with ultraviolet rays, the plastic ink is quickly cured immediately after printing. Can be done.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a master plate for intaglio offset printing according to the present invention.

FIG. 2 is a manufacturing process sectional view showing a method for manufacturing a master plate for intaglio offset printing of the present invention.

FIG. 3 is a configuration diagram illustrating an example of a configuration of an offset printing press.

FIG. 4 is a sectional view showing an embodiment of the film forming method of the present invention.

FIG. 5 is a cross-sectional view showing another embodiment of the film forming method of the present invention.

FIG. 6 is a cross-sectional view showing another embodiment of the film forming method of the present invention.

7A and 7B are a plan view and a sectional view showing another embodiment of the film forming method of the present invention.

[Explanation of symbols]

1 master plate, 2 PS plate, 3 aluminum plate, 4
Anodized film, 5,10 recess, 6 base metal layer, 7
Copper plating layer, 8 positive resist, 9 negative film (mask), 11 plate cylinder, 12 dampening device, 13 inking device, 14 rubber cylinder, 15 blanket, 16 impression cylinder, 17 printing material, 18 masking resist, 19
Conductor, 20 insulating material, 21, 22 circuit substrate, 23
PCB, 24 through hole land, 25 through hole, 26 circuit pattern.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G03F 7/00 503 G03F 7/00 503 5E339 7/40 521 7/40 521 5E343 7/42 7/42 H05K 3/02 H05K 3/02 A 3/06 3/06 F K 3/18 3/18 D 3/24 3/24 AB F term (reference) 2H096 AA06 CA03 CA20 HA17 HA18 HA27 JA04 LA02 2H114 AA02 AA14 AA27 AA30 DA04 EA02 FA13 GA09 GA31 4K022 AA02 BA21 BA25 DA03 DB28 DB30 4K023 AA19 BA06 CA01 DA02 DA04 DA06 DA07 4K024 AA09 AB01 BA01 BB16 BC10 CA02 CA03 CA05 FA05 GA01 5E339 AA02 AB02 AB05 AC01 BC02 BC05 BD02 BD03 BD05 CC08 CD06 CE13 CE14 CE17 CE18 CG04 DD04 5E343 AA02 AA12 AA15 AA17 AA18 BB24 BB34 BB52 BB67 BB71 DD23 DD25 DD33 DD43 ER13 GG08 GG11

Claims (9)

[Claims] 1. An aluminum support having an anodic oxide film formed on its surface, a concave portion serving as an image portion is formed, and a base metal layer and a copper plating layer having good adhesion to aluminum are sequentially formed in the concave portion. A master plate for intaglio offset printing characterized by the following. 2. The master plate for intaglio offset printing according to claim 1, wherein the base metal layer is tin or zinc. 3. A step of applying a photoresist on an aluminum support having an anodic oxide film formed on its surface, exposing the photoresist using a photomask having an image pattern, and patterning the photoresist by a development process. Forming an etched masking resist pattern, using an etching bath containing phosphoric acid and hydrofluoric acid,
Forming a recess in the aluminum support, forming a base metal layer in the recess by performing displacement plating using a substantially neutral plating bath, forming a copper plating layer on the base metal layer by electrolytic plating And a step of removing the masking resist pattern. 4. The method according to claim 3, wherein the base metal layer is made of tin or zinc. 5. An intaglio in which a concave portion serving as an image portion is formed on an aluminum support having an anodic oxide film formed on the surface, and a base metal layer and a copper plating layer having good adhesion to aluminum are sequentially formed in the concave portion. A method for forming a film circuit, comprising: an offset printing step of printing a resist ink on a circuit base material using a master plate for offset printing to form a resist pattern. 6. An offset printing step, wherein a substrate in which a conductor film is formed on an insulating material is used as a circuit substrate, a positive resist pattern is formed on the conductor film, and after the offset printing step, 6. The method according to claim 5, further comprising an etching step of etching the conductor film using a positive resist pattern as a masking resist. 7. An offset printing step, wherein an insulating material is used as a circuit base material, a negative resist pattern is formed on the insulating material, and after the offset printing step, a conductive film is formed on the negative resist pattern. 6. The method according to claim 5, further comprising the step of forming a conductive film. 8. The offset printing step uses a substrate having a conductor film formed on an insulating material as a circuit substrate, forms a negative resist pattern on the conductor film, and after the offset printing step, A plating step of forming a plating film made of solder or tin on the conductive film of the negative resist pattern, a step of peeling the negative resist pattern, and etching the conductive film using the plating film as a masking resist 6. The method according to claim 5, further comprising an etching step. 9. The method according to claim 5, wherein the resist ink contains a resin that is cured by heating or irradiation with ultraviolet rays.