WO2012128482A2

WO2012128482A2 - Method for duplicating pattern on cylindrical mold using uv imprint technique

Info

Publication number: WO2012128482A2
Application number: PCT/KR2012/001468
Authority: WO
Inventors: 신명동; 김유성; 허지원; 정상효
Original assignee: (주)뉴옵틱스
Priority date: 2011-03-22
Filing date: 2012-02-27
Publication date: 2012-09-27
Also published as: KR101333534B1; KR20120107696A; WO2012128482A3

Abstract

The present invention relates to a method for duplicating a pattern on a cylindrical mold using a UV imprint technique, and more specifically, to a method for duplicating a pattern on a cylindrical mold using a UV imprint technique, which enables the generation of a nano-unit pattern through a simple process, by duplicating a pattern using a UV imprint technique on a cylindrical mold. The method for duplicating a pattern on a cylindrical mold using a UV imprint technique comprises: a first step for coating a UV hardener on the pattern of an original mold, for a stamp cylinder to duplicate the pattern of the original mold while rotating in contact with the original mold, and for irradiating a UV light source on the stamp cylinder; a second step for etching the stamp cylinder duplicated with the pattern of the original mold; a third step for coating the UV hardener on the pattern of the stamp cylinder, for a duplicate mold to duplicate the pattern of the stamp cylinder while rotating in contact with the stamp cylinder, and for irradiating a UV light source on the duplicate mold and duplicating the pattern of the stamp cylinder on the duplicate mold; and a fourth step for etching the duplicate mold duplicated with the pattern of the stamp cylinder.

Description

How to duplicate a pattern on a cylindrical mold using the UV imprint technique

The present invention relates to a method of duplicating a pattern on a cylindrical mold by using a UV imprint technique, and more particularly, by replicating a pattern using a UV imprint technique on a cylindrical mold, a nano-scale pattern can be generated through a simple process. The present invention relates to a method of duplicating a pattern in a cylindrical mold using a UV imprint technique.

Various patterns are used in semiconductor devices such as a display device for displaying an image or a memory device for storing data. For example, the display device includes a pixel electrode and a thin film transistor for each pixel that is a basic unit of the screen, and the pixel electrode is formed of a conductive layer pattern. In addition, a protective film pattern is formed between the pixel electrode and the thin film transistor, and the protective film is formed of an insulating film pattern.

Conventionally, a method of printing a stamp on a flat plate has been used. When printing through a stamp on a flat plate, when applied to a large area, a problem occurs in the uniformity of the pattern, there was a problem that the manufacturing cost increases.

Accordingly, a technology for generating a pattern using a cylindrical mold has been developed, and when a pattern is generated using a cylindrical mold, it is advantageous for a large area using a seamless cylindrical mold and has an advantage of ensuring uniformity of the pattern.

As a technique for generating a pattern on the cylindrical mold, it is common to fix the patterned film or sheet to the cylindrical mold to be duplicated. When the problem occurs, there is a problem that occurs due to the continuous rotation of the cylindrical mold in the roll-to-roll process.

For this reason, a method of generating a pattern in the cylindrical mold using the cylindrical mold was used, and ink transfer of the pattern was used using a printing technique. However, the printing technique has a problem that there is a technical difficulty in forming a pattern of nano units.

The present invention devised to solve the problems of the prior art as described above by duplicating a pattern using a UV imprint technique in a cylindrical mold, by using a UV imprint technique that can generate a nano-scale pattern through a simple process Its purpose is to provide a method of duplicating a pattern in a mold.

The object of the present invention is a UV curing agent is applied to the pattern of the original mold, the stamp cylinder is rotated in contact with the original mold to duplicate the pattern of the original mold, the first step of irradiating the UV light source to the stamp cylinder; A second step of etching the stamp cylinder in which the pattern of the original mold is duplicated; A UV curing agent is applied to the pattern of the stamp cylinder, and the replica die replicates the pattern of the stamp cylinder while rotating in contact with the stamp cylinder, and irradiates a UV light source to the replica mold to transfer the pattern of the stamp cylinder to the replica mold. Replicating the third step; And a fourth step of etching the replica mold having the pattern of the stamp cylinder replicated, using a UV imprint technique.

In addition, another object of the present invention is a first step of applying a UV curing agent to the plate to the plate and the original mold to rotate in contact with the original mold to duplicate the pattern of the original mold on the plate, and irradiating the UV light source on the plate; A second step of etching the flat plate on which the pattern of the original mold is duplicated; A UV curing agent is applied to the pattern of the flat plate, and the replication mold replicates the pattern of the flat plate while rotating in contact with the flat plate; step; And a fourth step of etching the replica mold having the pattern of the plate replicated thereon, using a UV imprint technique.

Moreover, it is preferable that the stamp cylinder of this invention is a transparent material.

Moreover, it is preferable to irradiate the UV light source of this invention in the inside or the outside of the said stamp cylinder.

In addition, it is preferable to perform dry etching using the inductively coupled plasma of the present invention.

Therefore, the method of duplicating a pattern in a cylindrical mold using the UV imprint technique of the present invention has an effect of generating a nano-scale pattern through a simple process by duplicating the pattern in a cylindrical mold using the UV imprint technique. .

In addition, the present invention has another effect of making the transfer of the pattern uniform by duplicating the pattern in the cylindrical mold by using the UV imprint technique on the flat plate.

1 is a process diagram of a method for duplicating a pattern in a cylindrical mold using a UV imprint technique according to an embodiment of the present invention;

2 is a process diagram of a method of duplicating a pattern in a cylindrical mold using a UV imprint technique according to another embodiment of the present invention;

3 is a process chart of an etching process according to an embodiment of the present invention,

4 is a view showing an ICP process chamber for a plasma etching process according to an embodiment of the present invention.

The terms or words used in this specification and claims are not to be construed as being limited to their ordinary or dictionary meanings, and the inventors may appropriately define the concept of terms in order to best describe their invention. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a process diagram of a method for duplicating a pattern in a cylindrical mold using a UV imprint technique in accordance with an embodiment of the present invention. Referring to FIG. 1, the cylindrical mold 170 to which the pattern is to be duplicated is referred to as a duplicate mold 170, and the pattern is engraved so that the cylindrical mold 110 to duplicate the pattern to the duplicate mold 170 is an original mold. Referred to as (110).

In order to duplicate the pattern of the original mold 110 engraved pattern is provided with a stamp cylinder 130, to rotate the original mold 110 and the stamp cylinder 130 abut. At this time, the UV curing agent 120 is applied between the original mold 110 and the stamp cylinder 130, and the UV light source 140 is irradiated to the stamp cylinder 130 to which the UV curing agent 120 is applied.

Since the UV curing agent 120 is hardened immediately after the UV light source 140 is irradiated, the pattern 135 is generated in the stamp cylinder 130 when the UV curing agent 120 is irradiated.

The UV light source 140 may irradiate the stamp cylinder 130 from the inside or outside the stamp cylinder 130, when irradiating from the inside, the cylinder 130 is made of a transparent material to effectively transmit light, It is preferable to configure with a material such as quartz or glass, but is not limited thereto.

In the stamp cylinder 130 in which the pattern 135 is generated, the portion of the stamp cylinder 130, which is not the pattern 135 is not printed, is etched 150 to complete the stamp cylinder 160 having the pattern engraved thereon.

The UV light source 140 is irradiated with the UV curing agent 120 while applying the UV curing agent 120 to generate the pattern 175 on the replication mold 170 using the stamped cylinder 160 having the pattern engraved thereon. The pattern 175 generated by 120 is cured.

The replica mold 170 in which the pattern 175 is generated is etched 180 in which the pattern 175 is not formed to complete the replica mold in which the pattern is engraved (190). In addition, the etching (150, 180) is preferably dry etching using a plasma.

In this case, the pattern 175 may generate up to nano-patterns.

2 is a process diagram of a method for duplicating a pattern in a cylindrical mold using a UV imprint technique in accordance with another embodiment of the present invention. 2, a method of duplicating a pattern of an original mold by using a flat plate.

The UV curing agent 240 is applied to the flat plate 220, and the pattern 215 is generated on the flat plate 220 while rotating the original mold 210 having the pattern in contact with the flat plate 220. When the pattern 215 is generated by the original mold 210, the UV light source 230 is irradiated onto the plate 220 so that the pattern 215 generated on the plate 220 may be cured in response to UV. . In addition, the flat plate 220 is preferably a transparent material such as quartz, glass, etc. for effective irradiation of the UV light source 230, but is not limited thereto.

In the flat plate 220 on which the pattern 215 is formed, a portion 250 on which the pattern 215 is not printed is etched to complete the flat plate 260 having the pattern engraved thereon.

The UV curing agent 240 is applied to the patterned flat plate 260, and the pattern 275 of the flat plate 260 is printed on the copying mold 270 while rotating the replica mold 270 in contact with the flat plate 260. . At this time, the UV light source 230 is irradiated to cure the pattern 275 made of the UV curing agent 240 printed on the replication mold 270. In addition, the UV light source 230 is preferably irradiated at a portion symmetrical with the portion where the flat plate 260 and the original mold 210 or the replication mold 270 abuts.

The replication mold 270 in which the pattern 275 is generated is etched 280 to etch the pattern on the replication mold 290. In addition, the etching (250, 280) is preferably dry etching using a plasma.

3 is a process diagram of an etching process according to an embodiment of the present invention. Referring to FIG. 3, when the pattern 340 is replicated to the replication mold 310 by the UV curing agent, the UV light source 330 is irradiated and subjected to an etching process.

A UV light source is irradiated onto the replica die 310 to react with a UV curing agent in which a pattern is formed, and a portion where the pattern 340 is printed is cured, and a portion where the pattern 340 is not printed is reacted by UV. In this case, the portion in which the reaction occurs is precisely etched (320).

In the method of generating a pattern in FIGS. 1 to 2, the etching process may be performed by dry etching using plasma. 4 is an inductively coupled plasma (ICP) process chamber 400 having a built-in antenna.

The inductively coupled plasma process chamber 400 is replicated to the outer wall 405, the support means 410 and the support means 410 insulated from the outer wall 405 of the vacuum chamber 400 made of a conductor connected to ground. A mold 420.

The replica die 420 is etched using the inductively coupled plasma process chamber 400, and etching is possible up to nano units.

The replication mold 420 may be made of a conductive material, and one side of the replication mold 420 is connected to the RF power source 425 through the impedance matching network 415 and the other side thereof through the termination capacitor 430. As a result, the negative RF magnetic bias is applied to the surface of the replication mold 420 when the plasma 435 is discharged. In this case, the frequency of the RF power source 425 may be selected such that the standing wave effect and the transmission line effect are minimized according to the antenna substrate.

In addition, the insulated support means 410 may be grounded to avoid discharge voltages due to standing wave effects.

By passing the fluid 440 at a predetermined temperature inside the replication mold 420, the temperature of the replication mold 420 may be adjusted, and the interior of the replication mold 420 is separated from each other with the process chamber through vacuum sealing (445). .

In the process of etching the replica die 420, RF power is applied to the replica die 420 through the impedance matching network 415, and resonance occurs in the RF power, thereby forming a plasma 435 in the process chamber 400. .

A negative DC power magnetic bias is formed in the replica die 420 by a difference in movement of ions and electrons, and the replica die 420 is etched using acceleration of ions in the formed plasma 435.

Although the present invention has been shown and described with reference to the preferred embodiments as described above, it is not limited to the above embodiments and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.

Claims

In the method of duplicating a pattern on a cylindrical mold using a UV imprint technique,

UV curing agent is applied to the pattern of the original mold, the stamp cylinder is rotated in contact with the original mold to duplicate the pattern of the original mold, and irradiating a UV light source to the stamp cylinder;

A second step of etching the stamp cylinder in which the pattern of the original mold is duplicated;

A UV curing agent is applied to the pattern of the stamp cylinder, and the replica die replicates the pattern of the stamp cylinder while rotating in contact with the stamp cylinder, and irradiates a UV light source to the replica mold to transfer the pattern of the stamp cylinder to the replica mold. Replicating the third step; And

A fourth step of etching the replica die having the replica of the stamp cylinder pattern;

Method for duplicating a pattern in a cylindrical mold using a UV imprint technique comprising a.
The method of claim 1,

The stamp cylinder is a method for duplicating a pattern in a cylindrical mold using a UV imprint technique, characterized in that the transparent material.
The method of claim 1,

And in the first or third step, the UV light source is irradiated from the inside or outside of the stamp cylinder.
The method of claim 1,

The second step or the fourth step is a method for replicating the pattern in the cylindrical mold using the UV imprint technique, characterized in that the dry etching using an inductively coupled plasma.
In the method of duplicating a pattern on a cylindrical mold using a UV imprint technique,

A first step of applying a UV curing agent to the flat plate so that the flat plate and the original mold rotate in contact with each other, thereby replicating the pattern of the original mold onto the flat plate, and irradiating a UV light source to the flat plate;

A second step of etching the flat plate on which the pattern of the original mold is duplicated;

A UV curing agent is applied to the pattern of the flat plate, and the replication mold replicates the pattern of the flat plate while rotating in contact with the flat plate, and radiates a pattern of the flat plate to the copy mold by irradiating a UV light source to the copy mold. step; And

A fourth step of etching the replica mold having the pattern of the plate replicated

Method for duplicating a pattern in a cylindrical mold using a UV imprint technique comprising a.
The method of claim 5,

The plate is a method of replicating a pattern in a cylindrical mold using a UV imprint technique, characterized in that the transparent material.
The method of claim 5,

In the first step or the third step, the UV light source is to copy the pattern to the cylindrical mold by using a UV imprint technique, characterized in that for irradiating the symmetrical portion of the portion in which the plate is in contact with the original mold or the replica mold. Way.
The method of claim 5,

The second step or the fourth step is a method for replicating the pattern in the cylindrical mold using the UV imprint technique, characterized in that the dry etching using an inductively coupled plasma.