WO2012128480A2

WO2012128480A2 - Method for duplicating pattern on cylindrical mold

Info

Publication number: WO2012128480A2
Application number: PCT/KR2012/001465
Authority: WO
Inventors: 신명동; 김유성; 허지원; 정상효
Original assignee: (주)뉴옵틱스
Priority date: 2011-03-22
Filing date: 2012-02-27
Publication date: 2012-09-27
Also published as: WO2012128480A3; KR20120107694A; KR101324493B1

Abstract

The present invention relates to a method for duplicating a pattern on a cylindrical mold, and more specifically, to a method for copying a pattern on a cylindrical mold for manufacturing a cylindrical mold having a pattern engraved thereon using a simple process through a direct etching without an exposure process, after duplicating the pattern onto the cylindrical mold. The method for duplicating a pattern onto a cylindrical mold of the present invention comprises: a first step for coating an ink on the pattern of an original mold; a second step for generating a pattern, through the ink coated on the pattern of the original mold being printed on a duplicate mold; and a third step for etching the portions where the pattern is not printed on the duplicate mold.

Description

How to duplicate a pattern on a cylindrical mold

The present invention relates to a method of duplicating a pattern on a cylindrical mold, and more particularly, a pattern on a cylindrical mold for duplicating a pattern on a cylindrical mold, and then manufacturing a cylindrical mold having a pattern engraved in a simple process through direct etching without an exposure process. It is about how to clone.

Various patterns are used in semiconductor devices such as a display device for displaying an image or a memory device for storing data. For example, the display device includes a pixel electrode and a thin film transistor for each pixel that is a basic unit of the screen, and the pixel electrode is formed of a conductive layer pattern. In addition, a protective film pattern is formed between the pixel electrode and the thin film transistor, and the protective film is formed of an insulating film pattern.

In generating a pattern, a method of printing through a stamp on a flat plate is conventionally used. When printing through a stamp on a flat plate, when applied to a large area, a problem occurs in the uniformity of the pattern, there was a problem that the manufacturing cost increases.

Accordingly, a technology for generating a pattern using a cylindrical mold has been developed, and when a pattern is generated using a cylindrical mold, it is advantageous for a large area using a seamless cylindrical mold and has an advantage of ensuring uniformity of the pattern.

As a technique for generating a pattern on the cylindrical mold, it is common to fix the patterned film or sheet to the cylindrical mold to be duplicated. When the problem occurs, there is a problem that occurs due to the continuous rotation of the cylindrical mold in the roll-to-roll process.

In addition, in generating the pattern in the cylindrical mold, but generated through the exposure and development process, there is a problem in that the process is complicated, resulting in a high cost.

The present invention devised to solve the problems of the prior art as described above is a method of duplicating a pattern in a cylindrical mold to generate a pattern in a simpler process by generating a pattern of the cylindrical mold without the process of exposure and development through printing. The purpose is to provide.

The above object of the present invention is a first step of applying ink to the pattern of the original mold; A second step of printing an ink applied to a pattern of the original mold on a replica mold to generate a pattern; And a third step of etching the portion in which the pattern is not printed in the replica die.

In addition, in the first step of the present invention, it is preferable that the printing roll is positioned on the side of the original mold so that the ink applied to the printing roll is uniformly applied through the rotation of the original mold.

In addition, in the first step of the present invention, it is preferable that the printing roll and the replication mold are positioned on both sides of the original mold and rotated to abut.

In addition, in the first step of the present invention, it is preferable that the original mold and the replica die are rotated to abut on both sides of the printing roll.

In the third step of the present invention, it is preferable to perform dry etching using an inductively coupled plasma.

Therefore, the method of duplicating the pattern in the cylindrical mold of the present invention has the effect of generating a pattern in a simpler process by generating a pattern of the cylindrical mold without the process of exposure and development through printing.

1 is a process diagram of a method for duplicating a pattern in a cylindrical mold according to an embodiment of the present invention;

2 is a process diagram of a method for duplicating a pattern in a cylindrical mold according to another embodiment of the present invention;

3 is a process chart of an etching process according to an embodiment of the present invention,

4 is a view showing an ICP process chamber for a plasma etching process according to an embodiment of the present invention.

The terms or words used in this specification and claims are not to be construed as being limited to their ordinary or dictionary meanings, and the inventors may appropriately define the concept of terms in order to best describe their invention. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a process diagram of a method for duplicating a pattern in a cylindrical mold according to an embodiment of the present invention. Referring to FIG. 1, in copying a pattern, a method of generating a symmetric pattern with an original pattern is illustrated.

The cylindrical mold 110 to which the pattern is to be duplicated is referred to as a duplicate mold 110, and the pattern is engraved so that the cylindrical mold 120 for duplicating the pattern to the duplicate mold 110 is referred to as an original mold 120. .

The replica die 110 may be applied by a method such as a cylindrical spin coater, a spray coater, a roll coater, a slit die coater, or the like.

The printing roll 100 rotates to apply the ink 102 to the printing roll 100 from the ink supply device 104. The printing roll 100 and the original mold 120 rotate in contact with each other to apply the applied ink of the printing roll 100 onto the pattern 122 of the original mold 120.

The printing roll 100 preferably uses an anilox roller, but is not limited thereto.

The original mold 120 rotates in contact with the duplicate mold 110 and prints the pattern 112 on the duplicate mold 110 with ink applied on the pattern 122 of the original mold 120.

Since the original mold 120 and the replica mold 110 rotate in contact with each other, the pattern 122 of the original mold 120 is printed to be symmetrical.

In the replica die 110 in which the pattern 112 is formed, the portions of the replica die 110 which are not printed on the pattern 112 are etched to complete the replica mold 140 having the pattern engraved therein.

When the ink is applied to the original mold 120 or the printing roll 100, the timing of applying the ink may be adjusted through the ink supply device 104, or the start point or the end point may be classified so that the ink does not come out indefinitely. That is, even when the ink applied to the original mold 120 or the printing roll 100 is not applied to the replica mold 110, the ink continues even when the ink is applied to the original mold 120 or the printing roll 100. When applied, since a problem occurs in generating a pattern later, the ink is controlled according to whether the ink is applied to the original mold 120 or the printing roll 100.

2 is a process diagram of a method for duplicating a pattern in a cylindrical mold according to another embodiment of the present invention. Referring to FIG. 2, in copying a pattern, a method of generating a pattern identical to an original pattern is generated.

In order to duplicate the same pattern as the pattern of the original mold 220, the printing roll 200 is positioned between the original mold 220 and the replication mold 210. The printing roll 200 is preferably an offset roller.

When ink is applied 222 to the original mold 220, the printing roll 200 rotates to print the pattern 202 of the original mold 220, and the pattern (202) on the replica mold 210 abutting the printing roll 200. 212) is printed.

In the replica mold 210 in which the pattern 212 is formed, etching a portion of the replica mold 212 other than the portion where the pattern 212 is printed 230 completes the replica mold 240 having the pattern engraved thereon.

3 is a process diagram of an etching process according to an embodiment of the present invention. Referring to FIG. 3, the pattern 340 is duplicated in the replication mold 310.

In the replica die 310, a portion of the pattern 340 that is not printed is etched 320 instead of a portion of the pattern 340 that is printed.

In the method of generating a pattern in FIGS. 1 to 2, the etching process may be performed by dry etching using plasma. 4 is an inductively coupled plasma (ICP) process chamber 400 having a built-in antenna.

The inductively coupled plasma process chamber 400 is replicated to the outer wall 405, the support means 410 and the support means 410 insulated from the outer wall 405 of the vacuum chamber 400 made of a conductor connected to ground. A mold 420.

The replica die 420 is etched using the inductively coupled plasma process chamber 400, and etching is possible up to nano units.

The replication mold 420 may be made of a conductive material, one side of the replication mold 420 is connected to the RF power source 425 through the impedance matching network 415, and the other side thereof through the termination capacitor 430. As a result, the negative RF magnetic bias is applied to the surface of the replication mold 420 when the plasma 435 is discharged. In this case, the frequency of the RF power source 425 may be selected such that the standing wave effect and the transmission line effect are minimized according to the antenna substrate.

In addition, the insulated support means 410 may be grounded to avoid discharge voltages due to standing wave effects.

By passing the fluid 440 at a predetermined temperature inside the replication mold 420, the temperature of the replication mold 420 may be adjusted, and the interior of the replication mold 420 is separated from each other with the process chamber through vacuum sealing (445). .

In the process of etching the replica die 420, RF power is applied to the replica die 420 through the impedance matching network 415, and resonance occurs in the RF power, thereby forming a plasma 435 in the process chamber 400. .

A negative DC power magnetic bias is formed in the replica die 420 by a difference in movement of ions and electrons, and the replica die 420 is etched using acceleration of ions in the formed plasma 435.

Although the present invention has been shown and described with reference to the preferred embodiments as described above, it is not limited to the above embodiments and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.

Claims

In the method of duplicating a pattern in a cylindrical mold,

A first step of applying ink to the pattern of the original mold;

A second step of printing an ink applied to a pattern of the original mold on a replica mold to generate a pattern; And

A third step of etching a portion in which the pattern is not printed in the replica die

How to duplicate the pattern in the cylindrical mold containing.
The method of claim 1,

The printing roll is positioned on the side of the original mold in the first step, the method for duplicating the pattern on the cylindrical mold further comprising applying the ink applied to the printing roll uniformly through the rotation of the original mold.
The method of claim 2,

And the printing roll and the replica mold are positioned on both sides of the original mold in a first step so that the pattern is rotated to abut.
The method of claim 2,

The method of replicating the pattern to the cylindrical mold, characterized in that the original mold and the replica mold is rotated in contact with both sides on the printing roll in the first step.
The method of claim 1,

The method of duplicating a pattern in a cylindrical mold, wherein applying ink in the first step controls the amount of ink applied by recognizing a start point and an end point of applying the ink.
The method of claim 1,

The third step is a method for replicating the pattern in the cylindrical mold, characterized in that for dry etching using an inductively coupled plasma.