WO2012128480A3 - Method for duplicating pattern on cylindrical mold - Google Patents

Method for duplicating pattern on cylindrical mold Download PDF

Info

Publication number
WO2012128480A3
WO2012128480A3 PCT/KR2012/001465 KR2012001465W WO2012128480A3 WO 2012128480 A3 WO2012128480 A3 WO 2012128480A3 KR 2012001465 W KR2012001465 W KR 2012001465W WO 2012128480 A3 WO2012128480 A3 WO 2012128480A3
Authority
WO
WIPO (PCT)
Prior art keywords
pattern
mold
cylindrical mold
duplicating
cylindrical
Prior art date
Application number
PCT/KR2012/001465
Other languages
French (fr)
Korean (ko)
Other versions
WO2012128480A2 (en
Inventor
신명동
김유성
허지원
정상효
Original Assignee
(주)뉴옵틱스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)뉴옵틱스 filed Critical (주)뉴옵틱스
Publication of WO2012128480A2 publication Critical patent/WO2012128480A2/en
Publication of WO2012128480A3 publication Critical patent/WO2012128480A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C3/00—Reproduction or duplicating of printing formes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/18—Curved printing formes or printing cylinders

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The present invention relates to a method for duplicating a pattern on a cylindrical mold, and more specifically, to a method for copying a pattern on a cylindrical mold for manufacturing a cylindrical mold having a pattern engraved thereon using a simple process through a direct etching without an exposure process, after duplicating the pattern onto the cylindrical mold. The method for duplicating a pattern onto a cylindrical mold of the present invention comprises: a first step for coating an ink on the pattern of an original mold; a second step for generating a pattern, through the ink coated on the pattern of the original mold being printed on a duplicate mold; and a third step for etching the portions where the pattern is not printed on the duplicate mold.
PCT/KR2012/001465 2011-03-22 2012-02-27 Method for duplicating pattern on cylindrical mold WO2012128480A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110025349A KR101324493B1 (en) 2011-03-22 2011-03-22 Method for reprinting pattern in cylindrical mold
KR10-2011-0025349 2011-03-22

Publications (2)

Publication Number Publication Date
WO2012128480A2 WO2012128480A2 (en) 2012-09-27
WO2012128480A3 true WO2012128480A3 (en) 2012-11-22

Family

ID=46879843

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/001465 WO2012128480A2 (en) 2011-03-22 2012-02-27 Method for duplicating pattern on cylindrical mold

Country Status (2)

Country Link
KR (1) KR101324493B1 (en)
WO (1) WO2012128480A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102311665B1 (en) 2019-08-26 2021-10-13 부산대학교 산학협력단 Method for Fabricating CFRP based Etch free nano cylindrical mold
CN113751274A (en) * 2021-09-06 2021-12-07 广州厚邦木业制造有限公司 Design method of concave grain coating roller with wood grain patterns and roller coating method applied to wood floor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005246712A (en) * 2004-03-03 2005-09-15 Hitachi Chem Co Ltd Resist pattern forming method, electronic component manufacturing method and electronic component
KR100631016B1 (en) * 2004-04-30 2006-10-04 엘지.필립스 엘시디 주식회사 A method for fabricating printing roll forming pattern using printing process and method for forming pattern using the same
KR100631014B1 (en) * 2004-03-17 2006-10-04 엘지.필립스 엘시디 주식회사 Method of fabricating a printing roll and method of forming pattern using thereof
KR20080092707A (en) * 2007-04-13 2008-10-16 주식회사 엘지화학 Method for formation of fine patterns

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005246712A (en) * 2004-03-03 2005-09-15 Hitachi Chem Co Ltd Resist pattern forming method, electronic component manufacturing method and electronic component
KR100631014B1 (en) * 2004-03-17 2006-10-04 엘지.필립스 엘시디 주식회사 Method of fabricating a printing roll and method of forming pattern using thereof
KR100631016B1 (en) * 2004-04-30 2006-10-04 엘지.필립스 엘시디 주식회사 A method for fabricating printing roll forming pattern using printing process and method for forming pattern using the same
KR20080092707A (en) * 2007-04-13 2008-10-16 주식회사 엘지화학 Method for formation of fine patterns

Also Published As

Publication number Publication date
WO2012128480A2 (en) 2012-09-27
KR101324493B1 (en) 2013-11-01
KR20120107694A (en) 2012-10-04

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