WO2012128482A2 - Procédé permettant de reproduire un motif sur un moule cylindrique à l'aide d'une technique d'impression par uv - Google Patents

Procédé permettant de reproduire un motif sur un moule cylindrique à l'aide d'une technique d'impression par uv Download PDF

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Publication number
WO2012128482A2
WO2012128482A2 PCT/KR2012/001468 KR2012001468W WO2012128482A2 WO 2012128482 A2 WO2012128482 A2 WO 2012128482A2 KR 2012001468 W KR2012001468 W KR 2012001468W WO 2012128482 A2 WO2012128482 A2 WO 2012128482A2
Authority
WO
WIPO (PCT)
Prior art keywords
pattern
mold
stamp cylinder
imprint technique
flat plate
Prior art date
Application number
PCT/KR2012/001468
Other languages
English (en)
Korean (ko)
Other versions
WO2012128482A3 (fr
Inventor
신명동
김유성
허지원
정상효
Original Assignee
(주)뉴옵틱스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)뉴옵틱스 filed Critical (주)뉴옵틱스
Publication of WO2012128482A2 publication Critical patent/WO2012128482A2/fr
Publication of WO2012128482A3 publication Critical patent/WO2012128482A3/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/76—Cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C3/00—Reproduction or duplicating of printing formes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts

Definitions

  • the present invention relates to a method of duplicating a pattern on a cylindrical mold by using a UV imprint technique, and more particularly, by replicating a pattern using a UV imprint technique on a cylindrical mold, a nano-scale pattern can be generated through a simple process.
  • the present invention relates to a method of duplicating a pattern in a cylindrical mold using a UV imprint technique.
  • the display device includes a pixel electrode and a thin film transistor for each pixel that is a basic unit of the screen, and the pixel electrode is formed of a conductive layer pattern.
  • a protective film pattern is formed between the pixel electrode and the thin film transistor, and the protective film is formed of an insulating film pattern.
  • a technology for generating a pattern using a cylindrical mold has been developed, and when a pattern is generated using a cylindrical mold, it is advantageous for a large area using a seamless cylindrical mold and has an advantage of ensuring uniformity of the pattern.
  • the printing technique has a problem that there is a technical difficulty in forming a pattern of nano units.
  • the present invention devised to solve the problems of the prior art as described above by duplicating a pattern using a UV imprint technique in a cylindrical mold, by using a UV imprint technique that can generate a nano-scale pattern through a simple process Its purpose is to provide a method of duplicating a pattern in a mold.
  • the object of the present invention is a UV curing agent is applied to the pattern of the original mold, the stamp cylinder is rotated in contact with the original mold to duplicate the pattern of the original mold, the first step of irradiating the UV light source to the stamp cylinder; A second step of etching the stamp cylinder in which the pattern of the original mold is duplicated; A UV curing agent is applied to the pattern of the stamp cylinder, and the replica die replicates the pattern of the stamp cylinder while rotating in contact with the stamp cylinder, and irradiates a UV light source to the replica mold to transfer the pattern of the stamp cylinder to the replica mold. Replicating the third step; And a fourth step of etching the replica mold having the pattern of the stamp cylinder replicated, using a UV imprint technique.
  • another object of the present invention is a first step of applying a UV curing agent to the plate to the plate and the original mold to rotate in contact with the original mold to duplicate the pattern of the original mold on the plate, and irradiating the UV light source on the plate; A second step of etching the flat plate on which the pattern of the original mold is duplicated; A UV curing agent is applied to the pattern of the flat plate, and the replication mold replicates the pattern of the flat plate while rotating in contact with the flat plate; step; And a fourth step of etching the replica mold having the pattern of the plate replicated thereon, using a UV imprint technique.
  • the stamp cylinder of this invention is a transparent material.
  • the UV light source of this invention in the inside or the outside of the said stamp cylinder.
  • the method of duplicating a pattern in a cylindrical mold using the UV imprint technique of the present invention has an effect of generating a nano-scale pattern through a simple process by duplicating the pattern in a cylindrical mold using the UV imprint technique. .
  • the present invention has another effect of making the transfer of the pattern uniform by duplicating the pattern in the cylindrical mold by using the UV imprint technique on the flat plate.
  • FIG. 1 is a process diagram of a method for duplicating a pattern in a cylindrical mold using a UV imprint technique according to an embodiment of the present invention
  • FIG. 2 is a process diagram of a method of duplicating a pattern in a cylindrical mold using a UV imprint technique according to another embodiment of the present invention
  • FIG. 3 is a process chart of an etching process according to an embodiment of the present invention.
  • FIG. 4 is a view showing an ICP process chamber for a plasma etching process according to an embodiment of the present invention.
  • FIG. 1 is a process diagram of a method for duplicating a pattern in a cylindrical mold using a UV imprint technique in accordance with an embodiment of the present invention.
  • the cylindrical mold 170 to which the pattern is to be duplicated is referred to as a duplicate mold 170, and the pattern is engraved so that the cylindrical mold 110 to duplicate the pattern to the duplicate mold 170 is an original mold. Referred to as (110).
  • the UV curing agent 120 is applied between the original mold 110 and the stamp cylinder 130, and the UV light source 140 is irradiated to the stamp cylinder 130 to which the UV curing agent 120 is applied.
  • the pattern 135 is generated in the stamp cylinder 130 when the UV curing agent 120 is irradiated.
  • the UV light source 140 may irradiate the stamp cylinder 130 from the inside or outside the stamp cylinder 130, when irradiating from the inside, the cylinder 130 is made of a transparent material to effectively transmit light, It is preferable to configure with a material such as quartz or glass, but is not limited thereto.
  • the portion of the stamp cylinder 130, which is not the pattern 135 is not printed, is etched 150 to complete the stamp cylinder 160 having the pattern engraved thereon.
  • the UV light source 140 is irradiated with the UV curing agent 120 while applying the UV curing agent 120 to generate the pattern 175 on the replication mold 170 using the stamped cylinder 160 having the pattern engraved thereon.
  • the pattern 175 generated by 120 is cured.
  • the replica mold 170 in which the pattern 175 is generated is etched 180 in which the pattern 175 is not formed to complete the replica mold in which the pattern is engraved (190).
  • the etching (150, 180) is preferably dry etching using a plasma.
  • the pattern 175 may generate up to nano-patterns.
  • FIG. 2 is a process diagram of a method for duplicating a pattern in a cylindrical mold using a UV imprint technique in accordance with another embodiment of the present invention. 2, a method of duplicating a pattern of an original mold by using a flat plate.
  • the UV curing agent 240 is applied to the flat plate 220, and the pattern 215 is generated on the flat plate 220 while rotating the original mold 210 having the pattern in contact with the flat plate 220.
  • the UV light source 230 is irradiated onto the plate 220 so that the pattern 215 generated on the plate 220 may be cured in response to UV.
  • the flat plate 220 is preferably a transparent material such as quartz, glass, etc. for effective irradiation of the UV light source 230, but is not limited thereto.
  • a portion 250 on which the pattern 215 is not printed is etched to complete the flat plate 260 having the pattern engraved thereon.
  • the UV curing agent 240 is applied to the patterned flat plate 260, and the pattern 275 of the flat plate 260 is printed on the copying mold 270 while rotating the replica mold 270 in contact with the flat plate 260. .
  • the UV light source 230 is irradiated to cure the pattern 275 made of the UV curing agent 240 printed on the replication mold 270.
  • the UV light source 230 is preferably irradiated at a portion symmetrical with the portion where the flat plate 260 and the original mold 210 or the replication mold 270 abuts.
  • the replication mold 270 in which the pattern 275 is generated is etched 280 to etch the pattern on the replication mold 290.
  • the etching (250, 280) is preferably dry etching using a plasma.
  • FIG. 3 is a process diagram of an etching process according to an embodiment of the present invention.
  • the UV light source 330 is irradiated and subjected to an etching process.
  • a UV light source is irradiated onto the replica die 310 to react with a UV curing agent in which a pattern is formed, and a portion where the pattern 340 is printed is cured, and a portion where the pattern 340 is not printed is reacted by UV.
  • the portion in which the reaction occurs is precisely etched (320).
  • FIG. 4 is a view showing an ICP process chamber for a plasma etching process according to an embodiment of the present invention.
  • the etching process may be performed by dry etching using plasma.
  • 4 is an inductively coupled plasma (ICP) process chamber 400 having a built-in antenna.
  • ICP inductively coupled plasma
  • the inductively coupled plasma process chamber 400 is replicated to the outer wall 405, the support means 410 and the support means 410 insulated from the outer wall 405 of the vacuum chamber 400 made of a conductor connected to ground.
  • the replica die 420 is etched using the inductively coupled plasma process chamber 400, and etching is possible up to nano units.
  • the replication mold 420 may be made of a conductive material, and one side of the replication mold 420 is connected to the RF power source 425 through the impedance matching network 415 and the other side thereof through the termination capacitor 430. As a result, the negative RF magnetic bias is applied to the surface of the replication mold 420 when the plasma 435 is discharged. In this case, the frequency of the RF power source 425 may be selected such that the standing wave effect and the transmission line effect are minimized according to the antenna substrate.
  • the insulated support means 410 may be grounded to avoid discharge voltages due to standing wave effects.
  • the temperature of the replication mold 420 may be adjusted, and the interior of the replication mold 420 is separated from each other with the process chamber through vacuum sealing (445). .
  • RF power is applied to the replica die 420 through the impedance matching network 415, and resonance occurs in the RF power, thereby forming a plasma 435 in the process chamber 400. .
  • a negative DC power magnetic bias is formed in the replica die 420 by a difference in movement of ions and electrons, and the replica die 420 is etched using acceleration of ions in the formed plasma 435.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

La présente invention a trait à un procédé permettant de reproduire un motif sur un moule cylindrique à l'aide d'une technique d'impression par UV et, plus particulièrement, à un procédé permettant de reproduire un motif sur un moule cylindrique à l'aide d'une technique d'impression par UV, qui permet de générer un nano-motif au moyen d'un processus simple, en reproduisant un motif à l'aide d'une technique d'impression par UV sur un moule cylindrique. Le procédé permettant de reproduire un motif sur un moule cylindrique à l'aide d'une technique d'impression par UV comprend : une première étape consistant à enduire un durcisseur par UV sur le motif d'un moule initial, afin qu'un cylindre de poinçon reproduise le motif sur le moule initial lorsqu'il tourne tout en étant en contact avec le moule initial et afin d'irradier une source de rayonnement UV sur le cylindre de poinçon ; une deuxième étape consistant à graver le cylindre de poinçon sur lequel a été reproduit le motif du moule initial ; une troisième étape consistant à enduire le durcisseur par UV sur le motif du cylindre de poinçon, afin qu'un moule de reproduction reproduise le motif sur le cylindre de poinçon lorsqu'il tourne tout en étant en contact avec le cylindre de poinçon et afin d'irradier une source de rayonnement UV sur le moule de reproduction et de reproduire le motif du cylindre de poinçon sur le moule de reproduction ; et une quatrième étape consistant à graver le moule de reproduction sur lequel a été reproduit le motif du cylindre de poinçon.
PCT/KR2012/001468 2011-03-22 2012-02-27 Procédé permettant de reproduire un motif sur un moule cylindrique à l'aide d'une technique d'impression par uv WO2012128482A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0025354 2011-03-22
KR1020110025354A KR101333534B1 (ko) 2011-03-22 2011-03-22 Ｕｖ 임프린트 기법을 이용하여 원통 금형에 패턴을 복제하는 방법

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WO2012128482A2 true WO2012128482A2 (fr) 2012-09-27
WO2012128482A3 WO2012128482A3 (fr) 2012-12-27

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WO (1) WO2012128482A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104853897A (zh) * 2012-11-22 2015-08-19 综研化学株式会社 压印用模具的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002079771A (ja) * 2000-09-07 2002-03-19 Shinwa Kogyo Kk 凹版オフセット印刷用マスタ版、そのマスタ版の製造方法及びそのマスタ版を用いた膜回路の形成方法
KR20050092980A (ko) * 2004-03-17 2005-09-23 엘지.필립스 엘시디 주식회사 인쇄롤의 패턴형성방법
KR20050114968A (ko) * 2004-06-02 2005-12-07 엘지.필립스 엘시디 주식회사 패턴형성을 위한 인쇄장치 및 이를 이용한 패턴형성방법
JP2007290274A (ja) * 2006-04-26 2007-11-08 Toppan Printing Co Ltd 凹凸パターンを有する金型の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100842931B1 (ko) * 2007-06-28 2008-07-02 한국기계연구원 임프린트 리소그래피를 이용한 롤 스탬프의 제조방법
KR100988935B1 (ko) * 2009-10-28 2010-10-20 한국기계연구원 롤 임프린트 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002079771A (ja) * 2000-09-07 2002-03-19 Shinwa Kogyo Kk 凹版オフセット印刷用マスタ版、そのマスタ版の製造方法及びそのマスタ版を用いた膜回路の形成方法
KR20050092980A (ko) * 2004-03-17 2005-09-23 엘지.필립스 엘시디 주식회사 인쇄롤의 패턴형성방법
KR20050114968A (ko) * 2004-06-02 2005-12-07 엘지.필립스 엘시디 주식회사 패턴형성을 위한 인쇄장치 및 이를 이용한 패턴형성방법
JP2007290274A (ja) * 2006-04-26 2007-11-08 Toppan Printing Co Ltd 凹凸パターンを有する金型の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104853897A (zh) * 2012-11-22 2015-08-19 综研化学株式会社 压印用模具的制造方法
CN104853897B (zh) * 2012-11-22 2017-05-03 综研化学株式会社 压印用模具的制造方法

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Publication number Publication date
WO2012128482A3 (fr) 2012-12-27
KR101333534B1 (ko) 2013-11-28
KR20120107696A (ko) 2012-10-04

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