WO2012128467A2

WO2012128467A2 - Apparatus and method for manufacturing a cylindrical stamp using a cylindrical pattern mask

Info

Publication number: WO2012128467A2
Application number: PCT/KR2012/000752
Authority: WO
Inventors: 채주현; 유지강; 허지원; 이규만
Original assignee: (주)뉴옵틱스
Priority date: 2011-03-18
Filing date: 2012-01-31
Publication date: 2012-09-27
Also published as: KR20120106335A; KR101244856B1; WO2012128467A3

Abstract

The present invention relates to an apparatus and method for manufacturing a cylindrical stamp using a cylindrical pattern mask , and more particularly, to an apparatus and method for manufacturing a cylindrical stamp using a cylindrical pattern mask, wherein at least one semi-cylindrical pattern mask is coupled to a cylindrical mold plated with Ni-P for UV exposure, to thereby manufacture various patterns having a size of several micrometers through a continuous automated process. The apparatus for manufacturing a cylindrical stamp using the cylindrical pattern mask includes: a cylindrical mold on which preprocessing for UV exposure is performed; a transfer device for transferring the cylindrical mold; at least one pattern mask for forming patterns on the cylindrical mold; and a UV light source for performing UV exposure.

Description

Cylindrical Stamp Production Apparatus and Manufacturing Method Using Cylindrical Pattern Mask

The present invention relates to a cylindrical stamp manufacturing apparatus and a cylindrical stamp manufacturing method using a cylindrical pattern mask, by combining one or more semi-cylindrical pattern mask to the Ni-P plated cylindrical mold to perform UV exposure to a variety of micrometer-class The present invention relates to a cylindrical stamp manufacturing apparatus and a cylindrical stamp manufacturing method using a cylindrical pattern mask that can produce a pattern through a continuous automated process.

As a general exposure process in semiconductors and displays, not only the basic processes such as deposition, exposure (mask), development, and etching have to be repeated several times or dozens of times, but also ultra-precision printing in nanometers cannot be realized. In order to print, the plate was imprinted on a small substrate using a flat die engraved with a nano pattern through a flat plate imprint process.

When the flat printing process is applied to a large area, a problem arises in that the uniformity of the pattern and the manufacturing cost increase, and a nano printing process using a cylindrical mold is currently applied. Therefore, the nano printing process using the cylindrical mold is easy to secure the uniformity of the pattern when applying a large area, there is an advantage in large area using the seamless cylindrical mold.

1 is a configuration diagram showing an exposure method of a cylindrical mold according to the prior art. As shown in (a) of FIG. 1, the pattern 11 to be transferred to the cylindrical mold 20 is formed in the planar film mask 10, and the photosensitive liquid is formed on the cylindrical mold 20 as shown in (b). 30 performs a coating treatment. Thereafter, the film mask 10 having a flat shape is adhered to the cylindrical mold 20 using a tape (not shown), and then, the light source 40 is used to the cylindrical mold 20 to which the film mask 10 is adhered. After the exposure is performed, the film mask 10 is removed to form a pattern 12 as shown in (e) in the cylindrical mold 20.

Such a prior art is difficult to adhere to the correct position when the flat film mask 10 is adhered to the cylindrical mold 20, and a tape (not shown) is also used to fix the film mask 10 to the cylindrical mold 20. Since the adhesive using such as the manufacturing process is complicated and takes a long time to produce.

2 is a configuration diagram showing an exposure method of a cylindrical mold according to another prior art. As shown in FIG. 2, UV light is irradiated to the cylindrical mold 90 through the light irradiation means 50 and the light guide means 60, and the light guide means 60 and the cylindrical mold 90 are provided. ), A photo mask 70 is provided. At this time, the light irradiating means 50 irradiates the cylindrical mold 90 with UV light through the light inducing means 60, and the UV light is patterned to the cylindrical mold 90 rotating through the photo mask 70. ) Can be formed.

Such a prior art has the advantage of manufacturing the pattern 80 in the cylindrical mold 90 in a short time, but as the distance difference between the cylindrical mold 90 and the photo mask 70 occurs, the precise pattern 80 is realized. There is a problem that is difficult to do, and there is a problem that it is difficult to produce a variety of patterns 80 in the cylindrical mold (90) in accordance with the limit of the light guide means (60).

The present invention devised to solve the problems of the prior art as described above is combined with a pattern mask formed in at least one of the cylindrical mold, and then subjected to UV exposure to the pattern mask, to easily form a cylindrical stamp formed on the cylindrical mold The purpose is to.

In addition, the present invention has another object to form a pattern in the cylindrical mold, to enable a continuous and automated process when forming a variety of micrometer-class pattern.

In addition, the present invention is another object for producing a cylindrical stamp formed with a large area pattern of various sizes by combining two or more pattern masks in the cylindrical mold when the diameter of the cylindrical mold is large.

In addition, the present invention has another object to facilitate the division of the printed pattern according to the size of each pattern mask by combining the two or more pattern masks in the cylindrical mold, by adjusting the size of the combined pattern mask.

The object of the present invention is a cylindrical stamp manufacturing apparatus, comprising a cylindrical mold to be pretreated for UV exposure, a transfer device for moving the cylindrical mold and at least one pattern mask for forming a pattern on the cylindrical mold and the UV It is achieved by the cylindrical stamp manufacturing apparatus using the cylindrical pattern mask which consists of a UV light source for performing exposure.

Another object of the present invention is a cylindrical stamp manufacturing method, the first step of pre-processing the cylindrical mold and the second step of applying a photoresist to the cylindrical mold and the third step of coupling the pattern mask to the cylindrical mold and the It is achieved by a cylindrical stamp manufacturing method using a cylindrical pattern mask comprising a fourth step of performing a UV exposure to the cylindrical mold and a fifth step of separating the pattern mask bonded to the cylindrical mold.

Therefore, the UV exposure apparatus and the exposure method of the Ni-P cylinder using the cylindrical pattern mask of the present invention combine the pattern mask formed in two or more in the cylindrical mold, and then perform the UV exposure on the pattern mask, thereby easily patterning the cylindrical mold There is an effect that can form.

In addition, the present invention by forming a pattern on the cylindrical mold, when forming a variety of patterns of the micrometer class has another effect capable of continuous and automated processes.

In addition, the present invention has another effect of forming a large area pattern of various sizes by combining two or more pattern masks in the cylindrical mold when the diameter of the cylindrical mold is large.

In addition, the present invention has the effect of facilitating the division of the printed pattern according to the size of each pattern mask by adjusting the size of the combined pattern mask by combining two or more pattern masks in the cylindrical mold.

1 is a block diagram showing an exposure method of a cylindrical mold according to the prior art,

2 is a configuration diagram showing an exposure method of a cylindrical mold according to another prior art;

3 is a block diagram for manufacturing a cylindrical stamp using a cylindrical pattern mask according to the first embodiment of the present invention,

4 is a UV exposure configuration for producing a cylindrical stamp according to the first embodiment of the present invention,

5 is a block diagram for manufacturing a cylindrical stamp using a cylindrical pattern mask according to a second embodiment of the present invention,

6 is a UV exposure configuration for producing a cylindrical stamp according to a second embodiment of the present invention,

7 is a flowchart illustrating a method of manufacturing a cylindrical stamp using a cylindrical pattern mask according to the present invention;

8 is a flow chart of pretreatment in a method of manufacturing a cylindrical stamp using a cylindrical pattern mask according to the present invention.

The terms or words used in this specification and claims are not to be construed as being limited to their ordinary or dictionary meanings, and the inventors may appropriately define the concept of terms in order to best describe their invention. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a block diagram for manufacturing a cylindrical stamp using a cylindrical pattern mask according to the first embodiment of the present invention. As shown in FIG. 3A, the cylindrical mold 110 having a predetermined diameter is moved by the transfer device 120 to be coupled with the pattern mask 130.

The conveying apparatus 120 may horizontally or horizontally convey the combined cylindrical mold 110 or vertically convey the vertically.

Pattern mask 130 is formed in two or more are coupled in the axial direction of the cylindrical mold (110), it is coupled while wrapping one outer peripheral surface and the other outer peripheral surface of the cylindrical mold (110).

Meanwhile, at least one alignment point mark (not shown) is displayed on the cylindrical mold 110 and the pattern mask 130 to facilitate coupling between the cylindrical mold 110 and the pattern mask 130. And is displayed on the side surface portion of the pattern mask 130.

In addition, two or more pattern masks 130 may be provided. Two or more pattern masks 130 may be combined to surround the outer circumferential surface of the cylindrical mold 110 and may be provided according to the shape and size of the pattern to be printed. It can be produced as above.

(b) shows that the two pattern masks 130 are coupled to the cylindrical mold 110 transferred by the transfer device 120.

Figure 4 is a UV exposure configuration for producing a cylindrical stamp according to the first embodiment of the present invention. As shown in FIG. 4, when UV exposure is performed in the process of forming a pattern in the cylindrical mold 110 transferred by the conveying apparatus 120, a cylindrical pattern mask coupled to two or more surfaces of the cylindrical mold ( The UV light source 150 installed to uniformly expose the 130 may be a UV light source (upright, left, right, and right positions as shown in (a), up, down, left and right positions as shown in (b) or the entire circumference of the cylindrical mold as shown in (c)). After the 150 is installed, a variety of micrometer-class patterns may be formed on the surface of the cylindrical mold 110 according to a pattern formed on the pattern mask 130 by performing UV exposure.

5 is a block diagram for manufacturing a cylindrical stamp using a cylindrical pattern mask according to a second embodiment of the present invention. As shown in FIG. 5, (a) couples one pattern mask 130 to one side of the cylindrical mold 110 transferred by the transfer apparatus 120, and the pattern mask 130 is coupled to the cylindrical shape. The shield stage 140 is positioned below the cylindrical mold 110 to couple the shield stage 140 to the other side of the mold 110.

(b) shows a state in which the shield stage 140 located below the cylindrical mold 110 is coupled to the other side of the cylindrical mold 110, and (c) shows a pattern mask 130 and a cylindrical mask 110 in the cylindrical mold 110. After coupling the shield stage 140, the UV mask is exposed to the pattern mask 130 on one side (upper surface) of the cylindrical mold 110 to which the shield stage 140 is not coupled. UV exposure is preferably carried out from the UV light source 150 located above the cylindrical mold (110).

After the first UV exposure is performed on the pattern mask 130 of one side (upper surface) of the cylindrical mold 110 to which the shield stage 140 is not coupled, the pattern mask 130 of one side (upper surface) is applied. And the shield stage 140 of the other side (lower surface) is separated, the cylindrical mold 110 is rotated 180 ° by the transfer device 120.

Since the other side of the rotated cylindrical mold 110 is not exposed to the UV by the shield stage 140, the pattern mask 130 is positioned to perform the UV exposure, and one of the rotated cylindrical mold 110 The side of the shield stage 140 is coupled because the UV exposure was performed in accordance with the combination of the pattern mask 130.

Thereafter, the second UV exposure is performed through the UV light source 150 to the pattern mask 130 coupled to the other side of the cylindrical mold 110.

That is, one side of the cylindrical mold 110 subjected to the first UV exposure is rotated by 180 ° by the transfer device 120 to shield the pattern formed on the surface from the second UV exposure. The other side of the cylindrical mold 110 subjected to the first UV exposure is rotated 180 ° by the transfer device 120 and the pattern mask 130 is coupled to form a pattern on the surface according to the second UV exposure. Can be formed.

6 is a UV exposure configuration for manufacturing a cylindrical stamp according to a second embodiment of the present invention. As shown in FIG. 6, the UV light source 150 is provided for UV exposure to the pattern mask 130 located on one side (upper surface) of the cylindrical mold 110 transferred by the transfer apparatus 120. The shield stage 140 coupled with the pattern mask 130 located on the other side (lower surface) of the cylindrical mold 110 is cylindrical from the UV exposure irradiated from the UV light source 150 so that the other side (lower) of the mold 110 is lowered. Cotton) can be protected.

That is, (a) shows a planar UV light source 150 for performing UV exposure on the pattern mask 130 coupled to one side (top) of the cylindrical mold 110, (b) is two or more planar The UV light source 150 is shown, and (c) has shown the semi-cylindrical UV light source.

Each embodiment is optionally available depending on the degree of exposure through the UV light source 150.

7 is a flow chart showing a method of manufacturing a cylindrical stamp using a cylindrical pattern mask according to the present invention, Figure 8 is a pre-processing flow chart in the method of manufacturing a cylindrical stamp using a cylindrical pattern mask according to the present invention. As shown in FIGS. 7 and 8, the cylindrical mold to be subjected to UV exposure is subjected to a pretreatment step (S210), and the nozzle position of the spray coater is set to apply the photoresist to the surface of the cylindrical mold which has been pretreated. (S220).

Thereafter, a photoresist coating process value is set (S230), and the photoresist is coated on the surface of the cylindrical mold by the set process value and dried (S240).

The cylindrical mold coated with the photoresist is moved by a transfer device to a place where the UV light source is located to perform UV exposure, and then combines one or more pattern masks provided to surround the outer circumferential surface of the cylindrical mold (S250).

At this time, when one pattern mask is coupled to one side of the cylindrical mold, the shield stage is coupled to the other side of the cylindrical mold in order to protect the other side of the cylindrical mold from UV exposure.

The shield stage is tightly coupled to the bottom pattern mask to protect the pattern mask located on the other side of the cylindrical mold from UV exposure.

On the other hand, the shield stage is the same as the size of the pattern mask is preferably matched to match the pattern mask joint portion bonded to the cylindrical mold.

When coupling of the shield mask to the pattern mask and the other side of one side of the cylindrical mold is completed, the first UV exposure is performed using a UV light source to the pattern mask located on one side of the cylindrical mold (S260). After completing the first UV exposure, the pattern mask coupled to one side of the cylindrical mold and the shield mask coupled to the other side are removed (S270).

Thereafter, the cylindrical mold is rotated by 180 ° by the transfer device, the pattern mask is coupled to the other side of the cylindrical mold for the second UV exposure, and the shield stage is coupled to the one side, so as to expose the second UV from the UV light source. (S260).

That is, after the exchange of positions of one side and the other side of the cylindrical mold is completed, one side of the cylindrical mold combines the shield stage to protect the formed pattern, and the other side of the cylindrical mold uses a pattern mask to perform UV exposure. To combine. Accordingly, the second UV exposure is performed and the shield stage coupled to the lower pattern mask is removed (S270).

On the other hand, the number of times of performing the UV exposure is determined according to the size of the pattern mask bonded to the outer peripheral surface of the cylindrical mold. For example, when the size of the pattern mask coupled to the outer circumferential surface of the cylindrical mold is 1/3 the size of the outer circumferential surface of the cylindrical mold, the 1/3 size pattern mask is combined to one side of the cylindrical mold, and the 2/3 size cylindrical The other side of the mold is coupled to the shield stage to perform the first UV exposure.

Subsequently, by rotating the cylindrical mold 120 °, the pattern mask is bonded to any one of the other sides of the cylindrical mold not subjected to UV exposure, and one side of the cylindrical mold subjected to UV exposure and the cylindrical surface not subjected to UV exposure. The secondary UV exposure is performed by coupling the shield stage to the other part of the other side of the mold.

Finally, by rotating the cylindrical mold 120 °, the pattern mask is bonded to the other part of the other side of the cylindrical mold not subjected to the UV exposure, and one side of the cylindrical mold subjected to the first and second UV exposures and The third stage of UV exposure is performed by coupling the shield stage to any one of the other sides.

In addition, when two or more pattern masks are combined at step S250 to cover all of the outer circumferential surface of the cylindrical mold, a UV light source corresponding to the outer circumferential surface of the cylindrical mold to form a pattern on the cylindrical mold using the pattern mask coupled to the outer circumferential surface of the cylindrical mold. UV exposure is performed using (S260).

The UV exposure in step S260 is preferably performed on the combined pattern mask along the outer circumferential surface of the cylindrical mold, and after the UV exposure is performed, the combined pattern mask is removed (S270).

After all the UV exposure is performed on the outer circumferential surface of the cylindrical mold, development of the cylindrical mold subjected to the UV exposure is performed (S280), and an etching process may be further performed as necessary (S290). The etching process of step S290 is preferably carried out by at least one of wet etching or dry etching.

Meanwhile, the pretreatment step S210 of the cylindrical mold may be performed by a process as shown in FIG. 8.

After transferring the cylindrical mold coupled to the transfer device to a place where the pretreatment process can be performed (S211), electroless nickel plating and heat treatment are performed on the surface of the cylindrical mold (S212).

Electroless nickel plating is performed so that a nickel (Ni) layer having a phosphorus (P) content of 8 to 20 wt% is formed, and the heat treatment is preferably a cylindrical mold surface hardness of 600 to 950 Hv.

After that, the surface treatment is performed on the surface of the cylindrical mold (S213). The surface treatment is a mirror surface treatment such that the surface roughness Ra of the cylindrical mold is 1 to 5 nm, and the mirror surface treatment is divided into a lapping process and a polishing process, and each process is performed in a machine tool.

The lapping process is performed 3 to 8 times by selecting 5 to 7 different alumina (AL203) lapping films having different particle sizes from alumina (AL203) lapping films having a size of 30 μm to 1 μm. Carry out step by step.

The polishing process is carried out in steps of 25 to 35 minutes in the order of the smallest particle size, by selecting diamond suspensions of three to five different particle sizes among diamond suspensions having a particle size of 3 μm to 0.05 μm.

After the surface treatment of the cylindrical mold is completed, the surface of the cylindrical mold is cleaned (S214), and if necessary, a nitrogen blowing step (S215) may be additionally performed.

Although the present invention has been shown and described with reference to the preferred embodiments as described above, it is not limited to the above embodiments and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.

Claims

In the cylindrical stamp manufacturing apparatus,

A cylindrical mold in which pretreatment is performed for UV exposure;

A transfer device for moving the cylindrical mold;

One or more pattern masks for forming a pattern in the cylindrical mold; And

UV light source for performing the UV exposure

Cylindrical stamp production apparatus using a cylindrical pattern mask comprising a.
The method of claim 1,

When one of the pattern mask is coupled to one side of the cylindrical mold, the other side of the cylindrical mold cylindrical using a cylindrical pattern mask further comprises a semi-cylindrical shield stage for blocking the UV exposure Stamp production device.
The method of claim 2,

The pattern mask is a cylindrical stamp manufacturing apparatus using a cylindrical pattern mask, characterized in that one or more are combined to form a semi-cylindrical shape around the axis of the cylindrical mold to surround one side of the cylindrical mold.
The method of claim 3, wherein

The shield stage is a cylindrical stamp manufacturing apparatus using a cylindrical pattern mask, characterized in that when the one pattern mask is coupled to one side of the cylindrical mold, the other side of the cylindrical mold to which the pattern mask is coupled.
The method of claim 4, wherein

The UV light source is a cylindrical stamp manufacturing apparatus using a cylindrical pattern mask, characterized in that it is provided to perform UV exposure to the pattern mask coupled to the cylindrical mold.
The method of claim 5,

The UV exposure is a cylindrical stamp manufacturing apparatus using a cylindrical pattern mask, characterized in that the shielding mask is coupled to the pattern mask is not coupled.
The method of claim 1,

The pretreatment is a cylindrical stamp manufacturing apparatus using a cylindrical pattern mask, characterized in that performing any one or more of electroless nickel plating, heat treatment, mirror treatment, cleaning or nitrogen blowing.
The method of claim 7, wherein

The electroless nickel plating is a cylindrical stamp manufacturing apparatus using a cylindrical pattern mask, characterized in that the nickel (Ni) layer having a phosphorus (P) content of 8 to 20 wt% is formed.
The method of claim 7, wherein

The heat treatment is a cylindrical stamp manufacturing apparatus using a cylindrical pattern mask, characterized in that the surface hardness of the cylindrical mold is 600 to 950 HV.
The method of claim 7, wherein

The mirror surface treatment is a cylindrical stamp manufacturing apparatus using a cylindrical pattern mask, characterized in that the surface roughness (Ra) 1 to 5nm.
The method of claim 1,

The transfer device is coupled to the central axis of the cylindrical mold cylindrical stamp manufacturing apparatus using a cylindrical pattern mask, characterized in that to move the cylindrical mold horizontally in the horizontal direction or vertical movement in the vertical direction.
The method of claim 1,

The cylindrical mold and the pattern mask is a cylindrical stamp manufacturing apparatus using a cylindrical pattern mask, characterized in that one or more (align) point mark is displayed to be coupled to a mutually matching position.
In the cylindrical stamp manufacturing method,

A first step of pretreating the cylindrical mold;

Applying a photoresist to the cylindrical mold;

Coupling a pattern mask to the cylindrical mold;

A fourth step of performing UV exposure on the cylindrical mold; And

A fifth step of separating the pattern mask coupled to the cylindrical mold;

Cylindrical stamp production method using a cylindrical pattern mask comprising a.
The method of claim 13,

After the second step or before the third step

The cylindrical mold is a cylindrical stamp manufacturing method using a cylindrical pattern mask, characterized in that further comprising the step of transferring to the UV exposure apparatus through a transfer device.
The method of claim 14,

The transfer device is coupled to the central axis of the cylindrical mold cylindrical stamp manufacturing method using a cylindrical pattern mask, characterized in that for moving the cylindrical mold horizontally in the horizontal direction or vertically in the vertical direction.
The method of claim 13,

The third step of combining the pattern mask is

Coupling at least one semi-cylindrical pattern mask to the cylindrical mold; And

When one pattern mask is coupled to one side of the cylindrical mold, the shield stage is coupled to the other side of the cylindrical mold, or when the pattern mask is coupled to one side and the other side of the cylindrical mold, the shield stage is coupled. Second step to omit

Cylindrical stamp production method using a cylindrical pattern mask, characterized in that comprises a.
The method of claim 16,

The fourth step of performing the UV exposure when one pattern mask is coupled to one side of the cylindrical mold

Performing a first UV exposure on the pattern mask;

A second process of separating the pattern mask and the shield stage;

After rotating the cylindrical mold, the shield stage is coupled to one side of the cylindrical mold on which the first UV exposure has been performed, and the pattern mask is coupled to the other side of the cylindrical mold on which the UV exposure has not been performed. 3 courses;

A fourth process of performing a second UV exposure on the pattern mask; And

A fifth process of separating the pattern mask and the shield stage

Cylindrical stamp production method using a cylindrical pattern mask, characterized in that comprises a.
The method of claim 13,

After the fifth step

Developing the cylindrical mold subjected to the UV exposure; And

Etching the cylindrical mold

Cylindrical stamp production method using a cylindrical pattern mask, characterized in that it further comprises.
The method of claim 13,

The first step of preprocessing

A first process of electroless nickel plating the surface of the cylindrical mold;

A second step of performing heat treatment and mirror surface treatment on the surface of the cylindrical mold;

A third step of cleaning the surface of the cylindrical mold; And

A fourth process of nitrogen blowing the surface of the cylindrical mold

Cylindrical stamp production method using a cylindrical pattern mask comprising a.
The method of claim 19,

The electroless nickel plating is a cylindrical stamp manufacturing method using a cylindrical pattern mask, characterized in that the nickel (Ni) layer of 8 to 20 wt% of the phosphorus (P) content is formed.
The method of claim 19,

The heat treatment is a cylindrical stamp manufacturing method using a cylindrical pattern mask, characterized in that the surface hardness of the cylindrical mold 600 to 950HV.
The method of claim 19,

The mirror surface treatment is a method of producing a cylindrical stamp using a cylindrical pattern mask, characterized in that the surface roughness (Ra) is 1 to 5nm.
The method of claim 13,

The second step of applying the photoresist is

A first step of setting a nozzle position of a spray coater for applying the photoresist;

Setting a process value for applying the photoresist;

A third step of applying the photoresist using the spray coater; And

Fourth step of drying the applied photoresist

Cylindrical stamp production method using a cylindrical pattern mask comprising a.
The method of claim 13,

The pattern mask is a cylindrical stamp manufacturing method using a cylindrical pattern mask, characterized in that one or more are combined to form a semi-cylindrical shape around the axis of the cylindrical mold to surround the outer peripheral surface of the cylindrical mold.
The method of claim 24,

The cylindrical mold and the pattern mask is a cylindrical stamp manufacturing method using a cylindrical pattern mask, characterized in that one or more (align) point mark is displayed to be coupled to a mutually matching position.
The method of claim 18,

The etching is a cylindrical stamp manufacturing method using a cylindrical pattern mask, characterized in that any one of dry or wet etching.