JPH07329441A - Intaglio and printing method using the same - Google Patents

Intaglio and printing method using the same

Info

Publication number
JPH07329441A
JPH07329441A JP6153123A JP15312394A JPH07329441A JP H07329441 A JPH07329441 A JP H07329441A JP 6153123 A JP6153123 A JP 6153123A JP 15312394 A JP15312394 A JP 15312394A JP H07329441 A JPH07329441 A JP H07329441A
Authority
JP
Japan
Prior art keywords
ink
resin
cured
intaglio
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6153123A
Other languages
Japanese (ja)
Other versions
JP3503198B2 (en
Inventor
Toshiro Nagase
俊郎 長瀬
Masao Mogi
雅男 茂木
Hideo Miyazaki
秀夫 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP15312394A priority Critical patent/JP3503198B2/en
Publication of JPH07329441A publication Critical patent/JPH07329441A/en
Application granted granted Critical
Publication of JP3503198B2 publication Critical patent/JP3503198B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Abstract

PURPOSE:To transfer all of the ink cured within cells to an article to be printed by taking up the same by a self-adhesive on the surface of the article to be printed by forming at least the bottom surfaces of the cells from a cured ink releasable resin. CONSTITUTION:A toluene diluted soln. of chlorinated polyolefin 10 being one of cured ink releasable resins is applied to the surface of an intaglio substrate 25 obtained in a process A5 by spray coating so that film thickness after drying becomes, for example, 4mum. Next, this solidified chlorinated polyolefin 10 is heated and melted, for example, at 120 deg.C to enhance the close adhesiveness with the surface of the substrate 2 and chlorinated polyolefin 10 on room temp. curable silicone rubber 7 is peeled in the same way as the previous process A5 by bonding a cellophane tape to chlorinated polyolefin. By this method, an intaglio 1 of which the surface surrounding the cells 11 is formed from the room temp. curable silicone rubber 7 and the bottom surfaces of the cells 11 are formed from the cured ink releasable resin of chlorinated polyolefin is formed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、微細なパターンを印刷
する必要がある分野、具体的には電気部品、電子部品等
の製造において配線パターン等を印刷する場合の技術に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a field in which a fine pattern needs to be printed, and more specifically to a technique for printing a wiring pattern or the like in the production of electric parts, electronic parts and the like.

【0002】また、通常の印刷においても、印刷品質が
特に高いことを必要とする場合に係わり、インキの厚さ
を厚くすることが必要な場合等に有用な技術を提供す
る。
[0002] In addition, the present invention also provides a useful technique in the case where it is necessary to increase the thickness of the ink in the case where it is necessary for the printing quality to be particularly high even in ordinary printing.

【0003】[0003]

【従来の技術】電子技術の進歩に伴って、素子類のサイ
ズは益々小さくなっており、それにつれて配線パターン
も微細化することが要求され、その解決策として主にフ
ォトリソグラフィがある。しかし、低価格化を図るた
め、他の方法の開発が強く求められている。また、従来
技術より精度の高いパターン形成方法の要求もある。
2. Description of the Related Art With the progress of electronic technology, the size of devices has become smaller and smaller, and it has been required to miniaturize wiring patterns, and photolithography is mainly used as a solution to this problem. However, there is a strong demand for development of other methods in order to reduce the price. There is also a demand for a pattern forming method with higher accuracy than the conventional technique.

【0004】フォトリソグラフィ以外の新しい製法とし
て、凹版のセル中でインキを硬化させ、この硬化したイ
ンキを粘着剤を賦与した被印刷物の表面に剥離して転移
させる技術が特開平3−150376号公報、特開平3
−280416号公報等に開示されている。
As a new manufacturing method other than photolithography, there is a technique in which ink is cured in an intaglio cell, and the cured ink is peeled off and transferred to the surface of a substrate to which an adhesive has been applied, which is disclosed in JP-A-3-150376. , JP-A-3
-280416 gazette etc. are disclosed.

【0005】[0005]

【発明が解決しようとする課題】しかし、セル内で硬化
したインキは、版から剥離し難くなることがあると云っ
た問題点があった。すなわち、特開平3−150376
号公報の技術においては、ステンレス鋼板上に銅めっき
のパターンを形成したときには、その間の接着力は水洗
水の圧力で剥離するほど低い。しかし、ステンレス鋼板
−電着樹脂や、ステンレス鋼以外の金属板−金属めっき
パターンの場合は、粘着剤の側へ剥離して転移すること
が極めて困難であった。
However, there is a problem that the ink cured in the cell may be difficult to peel off from the plate. That is, Japanese Patent Laid-Open No. 3-150376
In the technique of the publication, when a copper plating pattern is formed on a stainless steel plate, the adhesive force between them is so low that it is peeled off by the pressure of washing water. However, in the case of a stainless steel plate-electrodeposition resin or a metal plate other than stainless steel-metal plating pattern, it was extremely difficult to peel and transfer to the adhesive side.

【0006】一方、特開平3−280416号公報の実
施例には、銅製凹版とエポキシアクリル系インキとの組
み合わせが開示されているが、この場合もインキが完全
に硬化すると版から剥離させることが極めて困難になる
と云った問題点があった。
On the other hand, the example of Japanese Patent Laid-Open No. 3-280416 discloses a combination of a copper intaglio plate and an epoxy acrylic ink, but in this case as well, when the ink is completely cured, it can be peeled from the plate. There was a problem that it would be extremely difficult.

【0007】なお、凹版のセル内で硬化したインキが容
易に剥離して被印刷物の側に転移し得るようにする対策
として、シリコーン樹脂やテフロン樹脂を凹版のセル内
に配置することが考えられる。しかし、本発明者等の検
討によると、離型性の優れた通常のシリコーン樹脂やテ
フロン樹脂を配置した場合には、インキをセル内へ供給
することが難しくなった。例えば、このような凹版へイ
ンキングロールを用いてインキを供給しようとしても、
セル内にインキが全く移らず、インキングロール上に残
ったままであった。また、ドクターリングによって供給
しようとしても、一度セル内に入ったインキがドクター
の移動と共にドクターの刃先に付着して引っ張り出さ
れ、セル内が空になってしまった。
As a measure for allowing the ink cured in the intaglio cells to be easily peeled off and transferred to the side of the object to be printed, it is conceivable to arrange a silicone resin or Teflon resin in the intaglio cells. . However, according to a study by the present inventors, it has been difficult to supply the ink into the cell when a normal silicone resin or Teflon resin having excellent releasability is arranged. For example, when trying to supply ink to such an intaglio using an inking roll,
No ink was transferred into the cell and remained on the inking roll. Further, even if the ink was supplied by the doctor ring, the ink once inside the cell adhered to the blade edge of the doctor and was pulled out as the doctor moved, and the inside of the cell became empty.

【0008】従って、インキングロールやドクターでイ
ンキを供給することが可能で、かつ硬化したインキが容
易に離型する凹版と、その製造方法、さらにはその凹版
を用いた印刷方法を見い出すことが課題であった。
Therefore, it is possible to find an intaglio plate which can be supplied with ink by an inking roll or a doctor and which allows the hardened ink to be easily released from the mold, a manufacturing method thereof, and a printing method using the intaglio plate. It was a challenge.

【0009】[0009]

【課題を解決するための手段】従来技術の課題を解決す
る手段として、本発明はセルの少なくとも底面が硬化イ
ンキ離型性樹脂によって形成された凹版を提供するもの
であり、
As a means for solving the problems of the prior art, the present invention provides an intaglio plate in which at least the bottom surface of the cell is formed of a cured ink releasing resin,

【0010】また、前記セルを囲繞形成する版表面が撥
インキ性樹脂によって形成された凹版を提供するもので
ある。
Further, the present invention provides an intaglio plate in which the plate surface surrounding the cell is formed of an ink repellent resin.

【0011】なお、本発明において硬化インキ離型性樹
脂とは、第一に液状(硬化前)インキを受容する特性が
あること、すなわち通常の方法(ロールインキング、ド
クターリング等)でインキを載せることが可能である特
性を有すること、第二にインキが版内で硬化した時に離
型することができる程、接着力が低下する特性の樹脂を
意味する。
In the present invention, the cured ink releasable resin has the property of first receiving a liquid (pre-cured) ink, that is, the ink is prepared by a usual method (roll inking, doctor ring, etc.). Secondly, it means a resin having a property of being able to be placed, and secondly, a property of lowering adhesive strength so that the ink can be released from the mold when cured in the plate.

【0012】例えばポリオレフィン樹脂の一種であるポ
リエチレンには通常のアマニ油系のオフセットインキが
未硬化の状態では載る。すなわち、インキング可能であ
る。しかし、インキが硬化して固体状になると剥がれ易
くなり、例えばそのインキの上にセロテープを貼りつけ
て引き剥がすと、固体状のインキは容易にポリエチレン
フィルムから剥がれる。すなわち、離型する。
For example, a normal linseed oil-based offset ink is mounted in an uncured state on polyethylene, which is a type of polyolefin resin. That is, inking is possible. However, when the ink is hardened and becomes solid, it easily peels off. For example, when a cellophane tape is stuck on the ink and peeled off, the solid ink is easily peeled off from the polyethylene film. That is, the mold is released.

【0013】硬化インキ離型性樹脂とインキの種類には
組合せがあり、高い離型性が得られる組合せ、すなわち
離型性に優れた組合せと、その逆の組合せがある。本発
明においては、粘着剤の粘着力程度で容易に離型するイ
ンキ−硬化インキ離型性樹脂の組合せが対象である。
There are combinations of types of cured ink releasable resin and ink, and there are combinations that provide high releasability, that is, combinations that are excellent in releasability, and vice versa. In the present invention, a combination of an ink-cured ink releasing resin which is easily released by the adhesive strength of the adhesive is targeted.

【0014】硬化インキとして一般的に使用されるアマ
ニ油系、アクリル系に対して、ポリオレフィン樹脂、変
性ポリオレフィン樹脂、ポリエチレンオキシド樹脂、メ
ラミン樹脂は親インキ性を液体状態では示す。しかし、
インキが硬化すると離型性を示すようになる。このよう
な特性は一般的には樹脂とインキの成分との組合せによ
って発現したりしかなったりするが、理論的には液状イ
ンキの表面張力が対する樹脂の表面張力より低く、ヌレ
が発生し、かつ硬化したインキの表面張力が対する樹脂
の表面張力より大きく、また両者の間に何らの化学的結
合が生じない場合に発現すると考えられる。しかし、現
在ではこの考えは推定の域を出ていず、実際には各種の
組合せを具体的に検討する必要がある。
Polyolefin resins, modified polyolefin resins, polyethylene oxide resins and melamine resins show liquid affinity in the liquid state in contrast to linseed oil type and acrylic type which are generally used as cured inks. But,
When the ink cures, it exhibits releasability. Such characteristics are generally expressed by the combination of the resin and the ink component, but theoretically, the surface tension of the liquid ink is lower than the surface tension of the resin, and wetting occurs, Moreover, it is considered that the surface tension of the cured ink is higher than the surface tension of the corresponding resin, and that no chemical bond is generated between the two. However, at present, this idea does not go beyond the scope of estimation, and in practice, various combinations need to be specifically examined.

【0015】本発明のポリオレフィン樹脂、変性ポリオ
レフィン樹脂、ポリエチレンオキシド樹脂、メラミン樹
脂、加水硬化型シリコーン樹脂はテストの結果、硬化性
インキの内、樹脂分がアマニ油系、アクリル系であるも
のに対して上記特性「硬化インキ離型性」を有すること
が判明したものである。ただし、本発明の内容はこれに
限定されず、この硬化インキ離型性を発現するインキと
樹脂とさらには粘着剤(接着剤)の組合せを対象として
いる。粘着剤とインキの粘着力は硬化したインキと版面
上の上記樹脂との間の粘着力より高いことが必要であ
る。
The test results of the polyolefin resin, modified polyolefin resin, polyethylene oxide resin, melamine resin, and hydrolyzable silicone resin of the present invention show that among the curable inks, the resin component is linseed oil-based or acrylic-based. As a result, it has been found that it has the above-mentioned characteristic "cured ink releasability". However, the content of the present invention is not limited to this, and is intended for a combination of an ink that exhibits the releasing property of the cured ink, a resin, and an adhesive (adhesive). The adhesive force between the adhesive and the ink needs to be higher than the adhesive force between the cured ink and the resin on the plate surface.

【0016】また、セルの少なくとも底面に硬化インキ
離型性樹脂を配設して形成した凹版のセルに、硬化促進
可能なインキを供給してセル内で硬化させ、この版表面
と被印刷物の表面に配設した粘着剤とを密着した後、粘
着剤を硬化させるかそのままの硬度で被印刷物と凹版と
を引き離し、セル内で硬化したインキを硬化した粘着剤
の粘着力または硬化しないそのままの粘着剤の粘着力に
よって被印刷物に転移させる凹版を用いた印刷方法を提
供するものであり、
Further, ink capable of accelerating curing is supplied to a cell of an intaglio plate formed by disposing a cured ink releasing resin on at least the bottom surface of the cell and cured in the cell, and the surface of the plate and the material to be printed are cured. After making close contact with the pressure-sensitive adhesive provided on the surface, the pressure-sensitive adhesive is cured or the printing material and the intaglio are separated with the same hardness, and the ink cured in the cell has the adhesive force of the cured adhesive or is not cured. It is intended to provide a printing method using an intaglio plate that is transferred to an object to be printed by the adhesive force of an adhesive.

【0017】セルの少なくとも底面に硬化インキ離型性
樹脂を配設して形成した凹版のセルに、硬化促進可能な
インキを供給してセル内で硬化させ、さらに粘着性イン
キを硬化したインキの上に供給し、この版表面と被印刷
物の面または被印刷物の表面に配設した粘着剤とを重
ね、粘着剤を被印刷物と密着させた後、粘着剤を硬化さ
せるかそのままの硬度で被印刷物と凹版とを引き離し、
セル内で硬化したインキと粘着剤を被印刷物に転移させ
る凹版を用いた印刷方法を提供するものである。
An ink capable of accelerating curing is supplied to an intaglio cell formed by disposing a cured ink release resin on at least the bottom surface of the cell to cure the ink in the cell, and an adhesive ink is cured. The surface of the plate and the pressure-sensitive adhesive provided on the surface of the substrate to be printed or on the surface of the substrate to be printed are superposed, and the pressure-sensitive adhesive is brought into close contact with the substrate to be printed. Separate the printed matter from the intaglio,
It is intended to provide a printing method using an intaglio plate that transfers an ink cured in a cell and an adhesive to a material to be printed.

【0018】また、前記凹版が、凹版基板の上面に配設
した未硬化の撥インキ性樹脂層に、凸部を片面に有する
母型基板の凸部上に硬化インキ離型性樹脂層を剥離可能
に配設して形成した型取り母型の硬化インキ離型性樹脂
層を合わせて密着型取りし、撥インキ性樹脂層の硬化
後、母型基板を除去して形成された印刷方法を提供する
ものであり、
Further, the intaglio plate is a uncured ink-repellent resin layer disposed on the upper surface of an intaglio plate, and a cured ink releasable resin layer is peeled off on a convex part of a mother die substrate having a convex part on one surface. A printing method that is formed by arranging the molds so that the cured ink releasable resin layer of the mold is put together and the ink-repellent resin layer is cured, and then the master substrate is removed. Is provided,

【0019】凹版基板の片面に硬化インキ離型性樹脂層
を配設し、この上に光硬化型シリコーン樹脂層を設け、
この光硬化型シリコーン樹脂層をパターン露光して所要
部を硬化させた後、未硬化部を除去し、撥インキ性樹脂
を光硬化型シリコーン樹脂層によって構成すると共に、
下層に配設した硬化インキ離型性樹脂層を露出して形成
された印刷方法を提供するものであり、
A cured ink releasable resin layer is provided on one surface of the intaglio substrate, and a photocurable silicone resin layer is provided thereon.
After pattern-exposing this photocurable silicone resin layer to cure the required portion, the uncured portion is removed, and the ink repellent resin is constituted by the photocurable silicone resin layer,
To provide a printing method formed by exposing a cured ink release resin layer disposed in a lower layer,

【0020】凹版基板の片面に硬化インキ離型性樹脂層
を配設し、この上に光硬化性粘着剤層を設け、さらにこ
の光硬化性粘着剤層の上にシリコーン樹脂層を設け、こ
のシリコーン樹脂層の上からパターン露光して光硬化性
粘着剤層の所要部を硬化させた後、光硬化性粘着剤層の
未硬化部をその表層部のシリコーン樹脂と共に除去し、
撥インキ性樹脂をシリコーン樹脂層によって構成すると
共に、下層に配設した硬化インキ離型性樹脂層を露出し
て形成された印刷方法を提供するものであり、
A cured ink releasable resin layer is provided on one surface of the intaglio substrate, a photocurable pressure sensitive adhesive layer is provided thereon, and a silicone resin layer is further provided on the photocurable pressure sensitive adhesive layer. After pattern exposure from the silicone resin layer to cure the required portion of the photocurable pressure-sensitive adhesive layer, the uncured portion of the photocurable pressure-sensitive adhesive layer is removed together with the silicone resin of the surface layer portion,
To provide a printing method in which an ink repellent resin is composed of a silicone resin layer and a cured ink release resin layer disposed in a lower layer is exposed.

【0021】凹版基板の凹部に供給した硬化インキ離型
性樹脂の液を固化して、セルの少なくとも底面に配設す
る硬化インキ離型性樹脂を形成された印刷方法を提供す
るものであり、
The present invention provides a printing method in which a liquid of a hardened ink releasing resin supplied to a concave portion of an intaglio plate is solidified to form a hardened ink releasing resin to be disposed on at least a bottom surface of a cell.

【0022】凹凸部を逆に形成したネガ状凹版の版表面
に、未硬化の硬化インキ離型性樹脂を密着させて型取り
した後、ネガ状凹版を除去し、硬化インキ離型性樹脂の
凸部端面に撥インキ性樹脂を配設して形成された印刷方
法を提供するものであり、
After the uncured cured ink releasing resin is brought into close contact with the plate surface of the negative intaglio plate having the concavo-convex portions formed in reverse, the negative intaglio plate is removed to remove the cured ink releasing resin. To provide a printing method formed by disposing an ink-repellent resin on the end surface of a convex portion,

【0023】凹版基板の片面に硬化インキ離型性シリコ
ーン樹脂層を配設し、これを加湿硬化してこの上に金属
接着用プライマーを塗布し、さらにこのプライマーの上
に紫外線硬化型シリコーン樹脂層を設け、この紫外線硬
化型シリコーン樹脂層をパターン露光して所要部を硬化
させた後、未硬化部を除去し、撥インキ性樹脂を紫外線
硬化型シリコーン樹脂層によって構成すると共に、下層
に配設した硬化インキ離型性シリコーン樹脂層を露出し
て形成された印刷方法を提供するものである。
A cured ink releasable silicone resin layer is provided on one side of the intaglio substrate, the cured ink is wet-cured and a metal bonding primer is applied on the cured ink resin layer, and an ultraviolet-curable silicone resin layer is further applied on the primer. The UV-curable silicone resin layer is pattern-exposed to cure the required portion, and then the uncured portion is removed, and the ink-repellent resin is composed of the UV-curable silicone resin layer and is disposed on the lower layer. The present invention provides a printing method formed by exposing the cured ink releasable silicone resin layer.

【0024】以上の解決手段において、インキが硬化イ
ンキ離型性樹脂表面に付着するためには、その付着力が
インキ自体の凝集力より大きい必要がある。また、硬化
したインキが版から離型して粘着剤の方へ転移するため
には、付着力(硬化したインキ対硬化インキ離型性樹
脂)<粘着力(硬化したインキ対粘着剤)<凝集力(粘
着剤)、粘着力(粘着剤対被転写体)という関係が成立
する必要があり、各材料を選定する際にはこの関係式を
満足することを確認する必要がある。
In the above means for solving, in order for the ink to adhere to the surface of the cured ink releasable resin, the adhesive force must be larger than the cohesive force of the ink itself. Also, in order for the cured ink to be released from the plate and transferred to the adhesive, the adhesive force (cured ink vs. cured ink release resin) <adhesive force (cured ink vs. adhesive) <aggregation The relationship of force (adhesive) and adhesive force (adhesive vs. transfer target) must be established, and it is necessary to confirm that this relational expression is satisfied when selecting each material.

【0025】[0025]

【作用】セルの少なくとも底面が硬化インキ離型性樹脂
によって形成された凹版を用いるので、セルにインキを
供給することが可能であり、供給されてセル内で硬化し
たインキはセル内に密着することがない。このため、被
印刷物の表面と版表面とを密着した後、粘着剤を硬化さ
せるかそのままの硬度で被印刷物の表面と版表面とを引
き離すと、セル内で硬化していたインキは被印刷物の表
面に配設した粘着剤に取られて被印刷物の側に全て転移
する。
Since the intaglio plate having at least the bottom surface of the cell formed by the cured ink releasing resin is used, the ink can be supplied to the cell and the ink which is supplied and hardened in the cell adheres to the inside of the cell. Never. Therefore, after the surface of the material to be printed and the surface of the plate are brought into close contact with each other, when the pressure-sensitive adhesive is cured or the surface of the material to be printed is separated from the surface of the plate with the same hardness, the ink cured in the cells is It is taken up by the adhesive placed on the surface and is all transferred to the side of the printed material.

【0026】インキが凹版から被印刷物の側に転移する
時には、インキは硬化していてダレることがないので、
形状良く転移するだけでなく、重ね印刷でなければ従来
得られなかったような厚さのパターンを、1回の印刷で
得ることができる。
When the ink is transferred from the intaglio to the side of the printing material, the ink is hardened and does not drip.
Not only is the shape transferred well, but it is possible to obtain a pattern with a thickness that could not be obtained by overlay printing in a single printing.

【0027】版表面を撥インキ性樹脂によって形成した
凹版においては、インキがセルにのみ充填されるので、
インキングが容易であるだけでなく、地汚れを起こす懸
念がない等操作性に優れている。
In an intaglio plate having a plate surface formed of an ink repellent resin, ink is filled only in the cells,
Not only is inking easy, but there is no risk of soiling, so it has excellent operability.

【0028】[0028]

【実施例】【Example】

(実施例1)本発明を銅層のエッチングに適用し、所要
の回路パターンを具備するプリント回路基板を得た一実
施例を、第1の実施例として図1および図2に基づいて
説明する。
(Embodiment 1) An embodiment in which the present invention is applied to etching of a copper layer to obtain a printed circuit board having a required circuit pattern will be described as a first embodiment with reference to FIGS. 1 and 2. .

【0029】先ず、印刷に使用した凹版1の製法を説明
すると、例えば板厚0.3mm、600mm四方のステ
ンレス鋼板からなる凹版基板2の片面に、従来周知の手
法によって、例えばフィルム状レジストであるネガ型フ
ォトレジスト(例えば、デュポン社製リストン101
0、膜厚25μm)を所定の温度、圧力で帖着、この帖
着したフォトレジストに紫外線を所望のパターンで照射
し、未露光部を現像によって除去し、露光した部分のフ
ォトレジスト4がパターン状に片面に残存する凹版基板
21を最初に得た(工程A1)。
First, a method of manufacturing the intaglio plate 1 used for printing will be described. For example, a film resist is formed on one surface of an intaglio plate substrate 2 made of a stainless steel plate having a plate thickness of 0.3 mm and 600 mm by a conventionally known method. Negative photoresist (for example, Liston 101 manufactured by DuPont)
0, film thickness 25 μm) at a predetermined temperature and pressure, and the photoresist thus adhered is irradiated with ultraviolet rays in a desired pattern, the unexposed portion is removed by development, and the exposed photoresist 4 is patterned. First, the intaglio substrate 21 that remained on one side like a plate was obtained (step A1).

【0030】次に、工程A1で得た凹版基板21を図示
しないニッケルめっき液に浸漬し、ニッケル板を陽極に
繋ぎ、凹版基板21を陰極に繋いでニッケルめっき層5
を、フォトレジスト4によって囲繞形成された凹部に、
例えば9.5μmの厚さに形成し、その後水洗して乾燥
し、凹版基板22を得た(工程A2)。なお、めっきが
不要な部分、例えば凹版基板21の側面や裏面には図示
しないマスキングを施してめっき液に浸漬し、不要部に
ニッケルめっきが形成されないようにした。
Next, the intaglio substrate 21 obtained in step A1 is dipped in a nickel plating solution (not shown), the nickel plate is connected to the anode, the intaglio substrate 21 is connected to the cathode, and the nickel plating layer 5 is formed.
In the concave portion surrounded by the photoresist 4,
For example, the intaglio substrate 22 was formed to a thickness of 9.5 μm, then washed with water and dried to obtain an intaglio substrate 22 (step A2). Incidentally, a portion not requiring plating, for example, a side surface or a back surface of the intaglio substrate 21 was masked (not shown) and immersed in a plating solution so that nickel plating was not formed at an unnecessary portion.

【0031】工程A2で得た凹版基板22をナフトキノ
ンジアジドの図示しない所定の剥離液に浸漬してフォト
レジスト4を除去し、水洗・乾燥し、ニッケルめっき層
5のみがパターン状に片面に形成された凹版基板23を
得た(工程A3)。
The intaglio substrate 22 obtained in step A2 is dipped in a predetermined stripping solution of naphthoquinone diazide (not shown) to remove the photoresist 4, washed with water and dried to form only the nickel plating layer 5 on one surface in a pattern. An intaglio board 23 was obtained (step A3).

【0032】さらに、工程A3で得た凹版基板23の表
面に金属接着用のプライマー6(例えば、東芝シリコー
ン社製ME−121)を所定の方法に従い、従来周知の
手法でスピンコートした後乾燥させ、ニッケルめっき層
5が囲繞形成する凹部に、シリコーンゴム(例えば、東
芝シリコーン社製TSE−3450)に硬化剤を規定量
加えて室温硬化可能にした室温硬化型シリコーンゴム7
を、ドクター8で扱いて充填し、室内に所定時間(例え
ば、48時間)放置してこれを硬化させ、凹版基板24
を得た(工程A4)。
Further, the surface of the intaglio substrate 23 obtained in step A3 is spin-coated by a conventionally known method with a primer 6 for metal adhesion (for example, ME-121 manufactured by Toshiba Silicone Co., Ltd.) according to a predetermined method, and then dried. A room temperature curable silicone rubber 7 which is curable at room temperature by adding a specified amount of a curing agent to a silicone rubber (for example, TSE-3450 manufactured by Toshiba Silicone Co., Ltd.) in the concave portion formed by the nickel plating layer 5.
Are treated by the doctor 8 and filled, and left in a room for a predetermined time (for example, 48 hours) to be cured, and then the intaglio substrate 24
Was obtained (step A4).

【0033】そして、工程A4で得た凹版基板24の表
面に接着力を有する適宜のテープ、例えばセロテープ9
を貼り付けてこれを引き剥がすと、セロテープ9に接着
したニッケルめっき層5が凹版基板2から剥がれて、室
温硬化型シリコーンゴム7がパターン状に片面に形成さ
れた凹版基板25を得た(工程A5)。
Then, a suitable tape having an adhesive force on the surface of the intaglio substrate 24 obtained in step A4, for example, cellophane tape 9 is used.
Was attached and peeled off, the nickel plating layer 5 adhered to the cellophane tape 9 was peeled off from the intaglio substrate 2 to obtain an intaglio substrate 25 having a room temperature curable silicone rubber 7 formed on one side in a pattern (step A5).

【0034】さらに、工程A5で得た凹版基板25の表
面に硬化インキ離型性樹脂の一つである塩素化ポリオレ
フィン(例えば、山陽国策パルプ社製スーパークロン8
22)のトルエン希釈液を乾燥後の膜厚が、例えば4μ
mとなるようにスプレーコートし、この固化した塩素化
ポリオレフィンを、例えば120℃で加熱融解して基板
表面との密着性を高め、室温硬化型シリコーンゴム7の
上の塩素化ポリオレフィンを前工程A5と同様にセロテ
ープ等を貼り付けて引き剥がすことにより、セル11を
囲繞する版表面が室温硬化型シリコーンゴム7から構成
され、セル底面が塩素化ポリオレフィン10の硬化イン
キ離型性樹脂によって形成されている凹版1を作成した
(工程A6)。
Furthermore, on the surface of the intaglio substrate 25 obtained in step A5, a chlorinated polyolefin (for example, Sanyo Kokusaku Pulp Co., Ltd. Super Clone 8), which is one of the cured ink releasing resins, is formed.
The film thickness after drying the toluene diluted solution of 22) is, for example, 4 μm.
m is spray-coated, and the solidified chlorinated polyolefin is heated and melted at, for example, 120 ° C. to enhance the adhesion to the substrate surface, and the chlorinated polyolefin on the room temperature curable silicone rubber 7 is pre-processed A5. Similarly, the cell surface surrounding the cell 11 is composed of room temperature curable silicone rubber 7 and the cell bottom surface is formed of a cured ink release resin of chlorinated polyolefin 10 by sticking a cellophane tape or the like and peeling it off. An intaglio plate 1 was prepared (step A6).

【0035】上記のようにして作成した凹版1の一使用
例を以下に説明すると、先ず最初にセル11に紫外線硬
化インキ(例えば、東洋インキ社製FD−黒)を図示し
ないインキングロール等によって供給し、これに紫外線
を照射してセル内のインキ12を硬化させた(工程A
7)。
An example of use of the intaglio plate 1 prepared as described above will be described below. First, an ultraviolet curing ink (for example, FD-black manufactured by Toyo Ink Co., Ltd.) is applied to the cell 11 by an inking roll or the like not shown. The ink 12 in the cell was cured by supplying it and irradiating it with ultraviolet rays (step A).
7).

【0036】一方、ガラスや高分子樹脂等からなる被印
刷物基板13の片面に、被エッチング層として銅層14
を例えば10μmの厚さに被覆して準備した被印刷物1
5の表面に、例えばポジ型のフォトレジスト4a(例え
ば、東京応化社製OFPR800)とアクリル系の粘着
剤16(例えば、ダイアボンド工業社製DA672)と
を順次積層して印刷に備えた(工程A8)。
On the other hand, a copper layer 14 as an etching target layer is formed on one surface of the substrate 13 to be printed, which is made of glass or polymer resin.
To be printed 1 prepared by coating with a thickness of 10 μm, for example
For example, a positive photoresist 4a (for example, OFPR800 manufactured by Tokyo Ohka Co., Ltd.) and an acrylic adhesive 16 (for example, DA672 manufactured by Diabond Industry Co., Ltd.) were sequentially laminated on the surface of No. 5 to prepare for printing (step. A8).

【0037】そして、上記のように準備した凹版1と被
印刷物15とを、硬化したインキ12と粘着剤16とが
接するように対向設置して加圧密着した後、凹版1と被
印刷物15とを引き離すと、セル11内で硬化していた
インキ12は粘着剤16に取られて被印刷物15の側に
全て転移した(工程A9)。
Then, the intaglio 1 and the material to be printed 15 prepared as described above are placed so as to face each other so that the cured ink 12 and the pressure sensitive adhesive 16 are in contact with each other and pressure-bonded thereto, and then the intaglio 1 and the material to be printed 15 are placed. When the ink was separated, the ink 12 that had hardened in the cells 11 was taken up by the adhesive 16 and was all transferred to the side of the printing material 15 (step A9).

【0038】インキ12が転移した被印刷物15の表面
に紫外線を照射し、インキ12によって遮光されていな
い部分のフォトレジスト4aを、粘着剤16を透過した
紫外線で露光した後、インキ12と粘着剤16とを図示
しないトルエン等の溶剤によって除去し、さらに露光し
た部分のフォトレジストを現像液に浸漬して除去するこ
とで、被エッチング層である銅層14の上に未露光部の
フォトレジスト4aをパターン状に残存形成することが
できた(工程A10)。
The surface of the material 15 to which the ink 12 is transferred is irradiated with ultraviolet rays to expose the photoresist 4a, which is not shielded by the ink 12, with the ultraviolet rays that have passed through the adhesive 16, and then the ink 12 and the adhesive are applied. 16 is removed by a solvent such as toluene (not shown), and the exposed portion of the photoresist is removed by immersing it in a developing solution to remove the unexposed portion of the photoresist 4a on the copper layer 14 as the layer to be etched. Could be formed in a pattern (step A10).

【0039】銅層14の上に未露光部のフォトレジスト
4aがパターン状に残存した被印刷物15の表面に、図
示しない鉄液をスプレーして銅層14の露出部分をエッ
チングして除去した後、水洗・乾燥し、さらにフォトレ
ジスト4aを剥離液を用いて除去することによって、被
印刷物基板13の片面に銅層14による所要の回路パタ
ーンが形成された印刷加工物17を得ることができた
(工程A11)。なお、線幅は最少部分で30μmであ
ったが、鮮明に形成されていた。
After the unexposed portion of the photoresist 4a on the copper layer 14 is left in a pattern, the surface of the material to be printed 15 is sprayed with an unillustrated iron solution to etch and remove the exposed portion of the copper layer 14. By washing with water, drying, and removing the photoresist 4a with a stripping solution, a printed product 17 having a desired circuit pattern formed by the copper layer 14 on one surface of the substrate 13 for printing was obtained. (Step A11). The line width was 30 μm at the minimum, but it was clearly formed.

【0040】(実施例2)プラズマディスプレイパネル
の隔壁形成に本発明を適用した一実施例を、第2の実施
例として以下に説明する。
(Embodiment 2) An embodiment in which the present invention is applied to the formation of barrier ribs of a plasma display panel will be described below as a second embodiment.

【0041】なお、プラズマディスプレイパネルの隔壁
とは、図4に符号30で示したように、対向設置される
2枚のガラス基板31の間に設置されて、ガラス基板間
の間隔を一定に支持すると共に、放電領域を限定するも
のであり、材質的には黒色顔料を含んだガラスであり、
現在は主にスクリーン印刷により形成されている。
The partition wall of the plasma display panel is installed between two glass substrates 31 facing each other as indicated by reference numeral 30 in FIG. In addition, the discharge area is limited, and the material is glass containing a black pigment,
Currently, it is mainly formed by screen printing.

【0042】図中、32は表面マスク、33は透明電
極、34は蛍光体、35はニッケル陰極、36は誘電
体、37は第3電極であり、上方の31は前面板、下方
の31はは背面板を示す。
In the figure, 32 is a surface mask, 33 is a transparent electrode, 34 is a phosphor, 35 is a nickel cathode, 36 is a dielectric, 37 is a third electrode, and 31 is an upper plate and 31 is a lower plate. Indicates the back plate.

【0043】隔壁30を形成するインキは、一般的には
ガラス粉末・黒色顔料・焼成すると完全に燃えてしまう
バインダ樹脂(主としてアクリル系樹脂)・溶剤より成
っていて、従来法であるスクリーン印刷で所要の厚さ
(120μm程度)を得るためには、数回以上の重ね印
刷を行うことが必要であった。
The ink for forming the partition walls 30 is generally composed of glass powder, a black pigment, a binder resin (mainly an acrylic resin) that completely burns when fired, and a solvent. In order to obtain the required thickness (about 120 μm), it was necessary to perform overprinting several times or more.

【0044】この実施例2では凹版の基板として、厚さ
0.3mm、450mm四方の通常のアンバー材を使用
した。アンバー材を用いた理由は、熱膨張率を小さくし
て印刷精度を高めるためである。
In Example 2, as the intaglio substrate, a normal amber material having a thickness of 0.3 mm and a length of 450 mm was used. The reason for using the amber material is to reduce the coefficient of thermal expansion and improve the printing accuracy.

【0045】なお、実施例2における凹版の製法と印刷
要領は、図1・図2に示した実施例1と重複する部分が
多いので、以下の説明は図3と共に図1・図2の一部を
用いて行った。また、図1・図2で説明した部分と同一
の機能部分には図3においても同一の符号を付し、理解
を容易とした。
The production method and printing procedure of the intaglio plate in the second embodiment mostly overlap with those of the first embodiment shown in FIGS. 1 and 2. Therefore, the following description will be made with reference to FIGS. Part. Further, the same functional portions as those explained in FIGS. 1 and 2 are designated by the same reference numerals in FIG. 3 to facilitate understanding.

【0046】この実施例2においては、凹版基板2の片
面に所要のパターンのニッケルめっき層5を、図示しな
いめっき用ドライフィルム(例えば、東洋インキ社製リ
オドライDFS特注品、膜厚150μm)を用いて形成
し、さらに、このドライフィルムを除去してニッケルめ
っき部が凸部となる構成の凹版基板23を作成した(工
程B1)。
In the second embodiment, a nickel plating layer 5 having a required pattern is formed on one surface of the intaglio substrate 2 by using a dry film for plating (not shown) (for example, custom-made Rio Dry DFS manufactured by Toyo Ink Co., Ltd., film thickness 150 μm). Then, the dry film was removed to prepare an intaglio substrate 23 having a nickel-plated portion as a protrusion (step B1).

【0047】そして、凹版基板23の表面に前記のプラ
イマー6を所定の方法に従い全面にスプレーコートした
後乾燥させ、この上に硬化インキ離型性樹脂の一つであ
る加湿硬化性シリコーン樹脂18(例えば、東芝シリコ
ーン社製XS66−A6847)を硬化後の膜厚が約5
μmになるようにスプレーコートし、加湿硬化して版深
130μmの凹版1を得た(工程B2)。
Then, the primer 6 is spray-coated on the entire surface of the intaglio substrate 23 according to a predetermined method and then dried, and a wet curable silicone resin 18 (which is one of the cured ink releasable resins) is formed thereon. For example, Toshiba Silicone XS66-A6847) has a film thickness of about 5 after curing.
It was spray-coated so as to have a thickness of μm, and was humidified and cured to obtain an intaglio plate 1 having a plate depth of 130 μm (step B2).

【0048】印刷に使用するインキとしては、触媒硬化
型アクリル系樹脂(例えば、丸本工業社製アクリフィッ
クス)をバインダ成分とし、ガラス粉末・黒色顔料をこ
の用途に使用されるスクリーンインキと同程度含有する
ものを用い、使用直前に所定の硬化触媒を規定量添加し
て攪拌し、凹版1のセル11にドクタリングによって充
填し、室内に所定時間放置してインキ12を硬化させた
(工程B3)。
As the ink used for printing, a catalyst-curable acrylic resin (for example, Acryfix manufactured by Marumoto Kogyo Co., Ltd.) is used as a binder component, and glass powder / black pigment is used to the same extent as the screen ink used for this purpose. Just before use, a prescribed amount of a prescribed curing catalyst was added and stirred, and the cells 11 of the intaglio 1 were filled with a doctor ring and left in a room for a prescribed time to cure the ink 12 (step B3). ).

【0049】セル11内でインキ12が硬化した凹版1
と、硬化剤を添加したアクリル系の粘着剤16を表面に
塗布した被印刷物としてのガラス基板31とを位置合わ
せして対向設置し、加圧・密着して硬化が完了するのを
待ち、両者を引き剥がすとセル11内で硬化した全ての
インキ12が、粘着剤16に取られてガラス基板31の
側に転移した(工程B4)。
Intaglio 1 in which ink 12 is cured in cell 11
And a glass substrate 31 as a material to be printed on the surface of which an acrylic adhesive 16 to which a curing agent has been applied are aligned and faced to each other. When peeled off, all the ink 12 cured in the cell 11 was taken by the adhesive 16 and transferred to the glass substrate 31 side (step B4).

【0050】インキ12が転移したガラス基板31を、
従来技術と同様に図示しない焼成炉に入れて例えば50
0℃で70分間加熱したところ、粘着剤16は燃焼し、
インキ12中の燃焼しない成分が焼成した固形物がガラ
ス基板31の表面に密着して残り、線幅80μm、高さ
120μmの隔壁30が1回の印刷によって形成された
(工程B5)。
The glass substrate 31 on which the ink 12 is transferred is
As in the prior art, for example, 50
When heated at 0 ° C. for 70 minutes, the adhesive 16 burns,
The solid matter obtained by burning the non-combustible component of the ink 12 remained in close contact with the surface of the glass substrate 31, and the partition wall 30 having a line width of 80 μm and a height of 120 μm was formed by one printing (step B5).

【0051】また、図5に示した工程に従って凹版を形
成することもできる。すわわち、ガラス基板31にポリ
ビニルアルコール等の水溶性樹脂51を乾燥膜厚が、例
えば20μmとなるようにスピンコートし、この上にポ
ジ形のプリント基版用厚膜用のフォトレジスト(例え
ば、ヘキストジャパン社製AZ4903)を乾燥膜厚
が、例えば8μmとなるようにスピンコートし、これに
所要のパターンで紫外線を照射し、キシレンとイソプロ
ピルアルコールとの混合系現像液に浸漬して、露光され
た部分のフォトレジストを除去し、露光されなかった部
分のフォトレジスト4を残して所要のパターンを片面に
有する母型基板41を先ず作成する(工程C1)。
Further, the intaglio can be formed according to the process shown in FIG. That is, a glass substrate 31 is spin-coated with a water-soluble resin 51 such as polyvinyl alcohol so that the dry film thickness is, for example, 20 μm, and a positive type photoresist for thick film for a printing substrate (for example, , AZ4903 manufactured by Hoechst Japan Co., Ltd. is spin-coated so that the dry film thickness is, for example, 8 μm, and this is irradiated with ultraviolet rays in a required pattern, immersed in a mixed developing solution of xylene and isopropyl alcohol, and exposed. The photoresist in the exposed portion is removed, and the master substrate 41 having a desired pattern on one surface is first formed by leaving the photoresist 4 in the unexposed portion (step C1).

【0052】次に、小量の水を湿し水として母型基板4
1に塗布し、インキングローラでシランカップリング材
を添加した硬化インキ離型性樹脂インキを供給してフォ
トレジスト4のパタ−ンの上に硬化インキ離型性樹脂イ
ンキ43の層を形成し、これを硬化させて型取り母型4
4を作成する(工程C2)。
Next, a small amount of water is used as dampening water and the mother substrate 4 is used.
1 and then the cured ink releasable resin ink containing the silane coupling material is supplied by the inking roller to form a layer of the cured ink releasable resin ink 43 on the pattern of the photoresist 4. , This is hardened and mold making master 4
4 is created (step C2).

【0053】ここで、硬化インキ離型性樹脂インキと
は、硬化インキ離型性樹脂を溶剤に溶解したり、エマル
ジョン状態にしてインキングローラでインキング可能に
したものを云う。また、硬化させる方法としては、紫外
線硬化、熱融解凝固、2液硬化等、硬化インキ離型性樹
脂に適合した各種方法を用いる。
Here, the hardened ink releasing resin ink means the ink in which the hardened ink releasing resin is dissolved in a solvent or made into an emulsion state so that it can be inked by an inking roller. Further, as a method for curing, various methods suitable for a cured ink release resin such as ultraviolet curing, heat melting coagulation and two-component curing are used.

【0054】水溶性樹脂51の表面が親水性でフォトレ
ジスト4が撥水性であるので、母型基板41の上の小量
の水は水溶性樹脂51の表面部分のみに載る。この状態
で硬化インキ離型性樹脂インキ43を供給すると、撥水
性のフォトレジスト4の部分にのみ硬化インキ離型性樹
脂インキ43が付着する。つまりオフセット印刷版への
インキ供給と同一のメカニズムである。
Since the surface of the water-soluble resin 51 is hydrophilic and the photoresist 4 is water repellent, a small amount of water on the master substrate 41 is placed only on the surface portion of the water-soluble resin 51. When the cured ink release resin ink 43 is supplied in this state, the cured ink release resin ink 43 adheres only to the water-repellent photoresist 4 portion. In other words, it has the same mechanism as the ink supply to the offset printing plate.

【0055】次に、厚さ5mmのガラス製の凹版基板2
の表面に金属接着用のプライマー6(例えば東芝シリコ
ーン社製ME−121)を塗布し、この上に厚さ1m
m、幅20mmのステンレス鋼板4枚で140mm四方
の枠45を作り、シリコーンゴム(例えば、東芝シリコ
−ン社製TSE−3466)に所定の硬化剤10%を添
加混合したものを注入し、その上に型取り母型44を載
せ、所定時間放置して室温硬化型シリコーンゴム7を硬
化させ、型取りした(工程C3)。
Next, a glass intaglio substrate 2 having a thickness of 5 mm
A primer 6 for metal adhesion (for example, ME-121 manufactured by Toshiba Silicone Co., Ltd.) is applied to the surface of the above, and a thickness of 1 m is applied on the primer.
A frame 45 of 140 mm square is made from four stainless steel sheets each having a width of 20 mm and a width of 20 mm, and a mixture of silicone rubber (for example, TSE-3466 manufactured by Toshiba Silicone Co., Ltd.) to which 10% of a predetermined curing agent is added and mixed is injected. A mold making master 44 was placed on the mold, and left for a predetermined time to cure the room temperature curable silicone rubber 7 and mold it (step C3).

【0056】枠45を外し、室温硬化型シリコーンゴム
7に型取りをした状態で、アルカリ性水系現像液(例え
ば、ヘキストジャパン社製AZ400K)に浸漬し、充
分時間をかけて水溶性樹脂51を溶解するとガラス基板
31が外れ、さらに浸漬を続けるとフォトレジスト4が
除去されて、フォトレジスト4にインキングされて硬化
していた紫外線硬化インキ43が、室温硬化型シリコー
ンゴム7によって囲繞形成されたセル11の底面に配設
され、セル11の底面に硬化インキ離型性樹脂層を備え
た凹版1が形成された(工程C4)。このようにして形
成した凹版1は、線巾5μmのパターンの周辺部にギザ
ギザがなく、微細なパターンを印刷するのに適してい
た。
The frame 45 is removed, and the room temperature curable silicone rubber 7 is modeled and dipped in an alkaline aqueous developer (eg, AZ400K manufactured by Hoechst Japan) to dissolve the water-soluble resin 51 for a sufficient time. Then, the glass substrate 31 is removed, and when the immersion is continued, the photoresist 4 is removed, and the UV curable ink 43 that has been inked and hardened in the photoresist 4 is surrounded by the room temperature curable silicone rubber 7 and formed into a cell. The intaglio 1 provided on the bottom surface of the cell 11 and provided with the cured ink releasing resin layer was formed on the bottom surface of the cell 11 (step C4). The intaglio plate 1 thus formed had no jagged edges around the pattern having a line width of 5 μm and was suitable for printing a fine pattern.

【0057】また、図6に示したように、凹版基板2の
片面に一様な厚さに形成した硬化インキ離型性樹脂52
の上に、撥インキ性樹脂53による凸部を所要のパター
ンに形成して凹版1を作成しても良い。この構成の凹版
は、例えば撥インキ性樹脂53を光硬化型のシリコーン
樹脂等で形成すれば簡単に作成することができる。
Further, as shown in FIG. 6, a cured ink releasing resin 52 formed on one surface of the intaglio substrate 2 to have a uniform thickness.
The intaglio 1 may be prepared by forming a convex portion of the ink-repellent resin 53 in a desired pattern on the above. The intaglio plate having this structure can be easily produced by forming the ink-repellent resin 53 with a photocurable silicone resin or the like.

【0058】すなわち、撥インキ性樹脂53を、先ず硬
化インキ離型性樹脂52の上に例えばスピンコート等し
て一様な膜厚に形成し、この撥インキ性樹脂53をパタ
ーン露光して未硬化部を除去すれば、下層に配置した硬
化インキ離型性樹脂52が露出して、版表面が撥インキ
性樹脂53、セル11の底面が硬化インキ離型性樹脂5
2である凹版が形成される。
That is, the ink-repellent resin 53 is first formed on the cured ink releasable resin 52 by, for example, spin coating to form a uniform film thickness, and the ink-repellent resin 53 is not pattern-exposed. When the cured portion is removed, the cured ink releasing resin 52 disposed in the lower layer is exposed, the plate surface is the ink repellent resin 53, and the bottom surface of the cell 11 is the cured ink releasing resin 5.
An intaglio that is 2 is formed.

【0059】また、図7に示したように、凹版基板2の
片面に一様な厚さに形成した硬化インキ離型性樹脂52
の上に、粘着剤16と撥インキ性樹脂53との積層部に
よる凸部を所要のパターンに形成して、凹版1とするこ
とも可能である。
Further, as shown in FIG. 7, a cured ink releasing resin 52 formed on one surface of the intaglio substrate 2 to have a uniform thickness.
It is also possible to form a convex portion by a laminated portion of the pressure sensitive adhesive 16 and the ink repellent resin 53 on the above in a desired pattern to form the intaglio 1.

【0060】この構成の凹版1は、硬化インキ離型性樹
脂52の上に例えば光硬化型の粘着剤とシリコーン樹脂
等からなる撥インキ性樹脂とを、スピンコート等してそ
れぞれ一様な膜厚に積層し、撥インキ性樹脂の上から光
硬化型の粘着剤をパターン露光して粘着剤を部分的に硬
化させ、所要の溶剤に浸漬して溶剤を撥インキ性樹脂に
浸透させてから、撥インキ性樹脂を擦り現像し、溶解し
た粘着剤と共にその上の撥インキ性樹脂を除去すると、
下層に配置した硬化インキ離型性樹脂52が露出して、
版表面が撥インキ性樹脂53、セル11の底面が硬化イ
ンキ離型性樹脂52である凹版が形成される。
The intaglio plate 1 having this structure has a uniform film formed by spin-coating a cured ink releasable resin 52 with, for example, a photocurable adhesive and an ink repellent resin such as a silicone resin. After stacking thickly, the photo-curable adhesive is pattern-exposed on the ink-repellent resin to partially cure the adhesive, and then immersed in the required solvent to allow the solvent to penetrate into the ink-repellent resin. , If the ink repellent resin is rubbed and developed, and the ink repellent resin on it is removed together with the dissolved adhesive,
The cured ink release resin 52 disposed in the lower layer is exposed,
An intaglio plate is formed in which the plate surface is the ink repellent resin 53 and the bottom surface of the cell 11 is the cured ink release resin 52.

【0061】また、図8に示したように、凹版基板2の
片面に所要のパターンに金属やフォトレジストからなる
凸部形成材によって凸部54を所要のパターンに形成
し、この凸部上面にシリコーン樹脂やテフロン樹脂等か
らなる撥インキ性樹脂53の層を形成し、凸部54によ
って囲繞形成される凹部55に硬化インキ離型性樹脂5
2を配設して凹版1とすることも可能である。なお、こ
の構成の凹版は、撥インキ性樹脂53を設けない構成と
することも可能である。
Further, as shown in FIG. 8, a convex portion 54 is formed in a required pattern on one surface of the intaglio substrate 2 by a convex portion forming material made of metal or photoresist and formed on the upper surface of the convex portion. A layer of an ink repellent resin 53 made of a silicone resin, a Teflon resin, or the like is formed, and a cured ink release resin 5 is formed in a concave portion 55 surrounded by the convex portion 54.
It is also possible to dispose 2 to form the intaglio 1. In addition, the intaglio plate having this configuration may be configured without the ink-repellent resin 53.

【0062】この構成の凹版1は、凹部55に硬化イン
キ離型性樹脂52が溶融した液を供給した後固化させる
方法によって形成される。凹部55のみに液を供給する
方法としては、ドクタリングの他、凸部形成材54を撥
溶液性とした後、ロールインキング、ドクタリングで供
給する方法がある。
The intaglio plate 1 having this structure is formed by a method in which the liquid in which the cured ink releasing resin 52 is melted is supplied to the recess 55 and then solidified. As a method of supplying the liquid only to the concave portion 55, there is a method of supplying the liquid by using a roll inking or a doctor ring after the convex forming material 54 is made liquid repellent in addition to the doctor ring.

【0063】凸部54を撥溶液性とする方法としては、
凸部にシリコーン樹脂、テフロン樹脂等の撥溶液樹脂層
を配設するか、クロム等の親水性金属とする(トライメ
タル凹版)又は親水性樹脂層を形成する方法がある。凸
部54に親水性樹脂の層を設ける方法としては、凹部5
5にインキをドクタリングで供給し、次に親水性樹脂の
溶液を全面に供給し、これを固化させた後、凹部55の
インキを親水性インキを溶解しない溶剤で溶解する方法
がある。シリコーン樹脂、テフロン樹脂等の撥溶液樹脂
も同様にして形成できる。固化する方法としては、樹脂
を重合させる方法を採用しても良い。
As a method for making the convex portion 54 liquid-repellent,
There is a method of disposing a solution-repellent resin layer such as a silicone resin or a Teflon resin on the convex portion, or using a hydrophilic metal such as chromium (trimetal intaglio), or forming a hydrophilic resin layer. As a method of providing the hydrophilic resin layer on the convex portion 54, the concave portion 5
There is a method in which the ink is supplied to No. 5 by doctoring, the solution of the hydrophilic resin is then supplied to the entire surface, and the solution is solidified, and then the ink in the recess 55 is dissolved with a solvent that does not dissolve the hydrophilic ink. Solution-repellent resins such as silicone resins and Teflon resins can be similarly formed. As a method for solidifying, a method of polymerizing a resin may be adopted.

【0064】また、図9に示したように、凹版基板2の
片面に接着剤や粘着剤16の層を介して硬化インキ離型
性樹脂52を設け、この表面に凸部54と凹部55とを
所要のパターンの形成し、凸部54の上にシリコーン樹
脂やテフロン樹脂等の撥インキ性樹脂53の層を形成し
て凹版1とすることも可能である。なお、この構成の凹
版は、撥インキ性樹脂53、凹版基板2、粘着剤16を
設けない構成とすることも可能である。
Further, as shown in FIG. 9, a cured ink releasing resin 52 is provided on one surface of the intaglio substrate 2 via a layer of adhesive or pressure sensitive adhesive 16, and a convex portion 54 and a concave portion 55 are formed on this surface. It is also possible to form a desired pattern and form a layer of ink-repellent resin 53 such as silicone resin or Teflon resin on the convex portion 54 to form the intaglio 1. In addition, the intaglio plate having this configuration may be configured without the ink-repellent resin 53, the intaglio substrate 2, and the adhesive 16.

【0065】この構成の凹版は、パターンエッチング・
パターンめっき・フォトレジストパターンニング等によ
って凹凸部が逆になったネガ状凹版を先ず形成し、加熱
溶融や溶剤溶解等して流動可能にした硬化インキ離型性
樹脂を、ネガ状凹版の凹部に流し込んで固化させたり、
塑性加工可能な状態に例えば加熱した硬化インキ離型性
樹脂をネガ状凹版にプレスすることで、セル11となる
凹部55を硬化インキ離型性樹脂52によって形成する
ことも可能である。
The intaglio having this structure is formed by pattern etching.
First, a negative intaglio in which the irregularities are reversed by pattern plating, photoresist patterning, etc. is formed, and a cured ink release resin that is made flowable by heat melting, solvent dissolution, etc. is placed in the concave of the negative intaglio. Pouring and solidifying,
It is also possible to form the recesses 55 to be the cells 11 by the cured ink release resin 52 by pressing a heated cured ink release resin into a negative intaglio plate in a plastically workable state.

【0066】そして、凸部54の端面にシリコーン樹脂
・テフロン樹脂等からなる撥インキ性樹脂53を配設す
れば凹版1とすることができる。
The ink-repellent resin 53 made of silicone resin, Teflon resin or the like is provided on the end surface of the convex portion 54 to form the intaglio 1.

【0067】なお、硬化インキ離型性樹脂52からなる
凸部54の端面に、シリコーン樹脂・テフロン樹脂等か
らなる撥インキ性樹脂53を配設する方法としては、図
9に示した凹版1の作成要領等が利用される。
As a method of disposing the ink-repellent resin 53 made of silicone resin, Teflon resin or the like on the end surface of the convex portion 54 made of the cured ink releasing resin 52, the intaglio 1 shown in FIG. The preparation procedure is used.

【0068】ところで、セル11の少なくとも底面に配
設する硬化インキ離型性樹脂52としては、ポリオレフ
ィン樹脂・変性ポリオレフィン樹脂・ポリエチレンオキ
シド樹脂・メラミン樹脂・加水硬化型シリコーン樹脂
等、印刷用の油性インキを受容することができ、且つ、
硬化したインキが比較的容易に剥離し得る樹脂が適宜選
択して使用される。
By the way, as the cured ink releasable resin 52 disposed on at least the bottom surface of the cell 11, a printing oil-based ink such as a polyolefin resin, a modified polyolefin resin, a polyethylene oxide resin, a melamine resin, or a hydrosetting silicone resin is used. Can accept and
A resin that allows the cured ink to be peeled off relatively easily is appropriately selected and used.

【0069】[0069]

【発明の効果】以上説明した様に本発明の凹版は、セル
の少なくとも底面が硬化インキ離型性樹脂によって形成
されているので、セルに供給したインキをセル内で硬化
させても、インキがセル内に密着することがない。この
ため、被印刷物の表面と版表面とを密着した後、被印刷
物の表面と版表面とを引き離せば、セル内で硬化してい
たインキは、被印刷物の表面の粘着剤に取られて被印刷
物の側に全て転移する。
As described above, in the intaglio plate of the present invention, since at least the bottom surface of the cell is formed by the cured ink releasing resin, even if the ink supplied to the cell is cured in the cell, the ink remains There is no close contact with the cell. Therefore, after the surface of the substrate to be printed and the plate surface are adhered to each other, if the surface of the substrate to be printed and the plate surface are separated, the ink that has been cured in the cells is taken up by the adhesive on the surface of the substrate to be printed. All is transferred to the side of the printing material.

【0070】そして、インキが凹版から被印刷物の側に
転移する時には、インキは硬化していてダレることがな
いので、微細なパターンが形状良く形成できるだけでな
く、重ね印刷でなければ従来得られなかったような厚さ
のパターンも、1回の印刷で得ることができるようにな
った。
When the ink is transferred from the intaglio to the side of the printing material, the ink is hardened and does not drip, so that a fine pattern can be formed in a good shape, and it can be obtained conventionally unless overprinting. It became possible to obtain a pattern with such a thickness as never before by printing once.

【0071】また、版表面を撥インキ性樹脂によって形
成した凹版においては、インキがセルにのみ充填される
ので、インキングが容易であるだけでなく、地汚れを起
こす懸念がない等、操作性に優れていると云った特長が
ある。
In an intaglio plate having the plate surface made of an ink repellent resin, ink is filled only in the cells, so that inking is easy and there is no fear of causing scumming. There is a feature that is said to be excellent.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例1における凹版製造法の説明図である。FIG. 1 is an explanatory diagram of an intaglio manufacturing method according to a first embodiment.

【図2】実施例1における印刷法の説明図である。FIG. 2 is an explanatory diagram of a printing method according to the first embodiment.

【図3】実施例2の説明図である。FIG. 3 is an explanatory diagram of a second embodiment.

【図4】プラズマディスプレイパネルの断面説明図であ
る。
FIG. 4 is a cross-sectional explanatory diagram of a plasma display panel.

【図5】凹版の作成要領を示す説明図である。FIG. 5 is an explanatory diagram showing a procedure for making an intaglio plate.

【図6】凹版の他の構成を示す説明図である。FIG. 6 is an explanatory diagram showing another configuration of the intaglio plate.

【図7】凹版の他の構成を示す説明図である。FIG. 7 is an explanatory diagram showing another configuration of the intaglio plate.

【図8】凹版の他の構成を示す説明図である。FIG. 8 is an explanatory diagram showing another configuration of the intaglio plate.

【図9】凹版の他の構成を示す説明図である。FIG. 9 is an explanatory diagram showing another configuration of the intaglio plate.

【符号の説明】[Explanation of symbols]

1 凹版 2・21・22・23・24・25 凹版基板 4・4a フォトレジスト 5 ニッケルめっき層 6・6a プライマー 7 室温硬化型シリコーンゴム 8 ドクター 9 セロテープ 10 塩素化ポリオレフィン 11 セル 12 インキ 13 被印刷物基板 14 銅層 15 被印刷物 16 粘着剤 17 印刷加工物 18 加湿硬化性シリコーン樹脂 30 隔壁 31 ガラス基板 41 母型基板 42 アマニ油系インキ 43 硬化インキ離型性樹脂インキ 44 型取り母型 45 枠 51 水溶性樹脂 52 硬化インキ離型性樹脂 53 撥インキ性樹脂 54 凸部 55 凹部 1 Intaglio 2, 21, 22, 23, 24, 25 Intaglio Substrate 4, 4a Photoresist 5 Nickel Plating Layer 6, 6a Primer 7 Room Temperature Curable Silicone Rubber 8 Doctor 9 Cellotape 10 Chlorinated Polyolefin 11 Cell 12 Ink 13 Printed Substrate 14 Copper Layer 15 Printed Material 16 Adhesive 17 Printed Product 18 Humidifying Curable Silicone Resin 30 Partition 31 Glass Substrate 41 Master Mold Substrate 42 Linseed Oil Ink 43 Cured Ink Releasing Resin Ink 44 Mold Taking Master 45 Frame 51 Water-soluble Resin 52 Cured ink Releasing resin 53 Ink repellent resin 54 Convex portion 55 Recessed portion

Claims (12)

【特許請求の範囲】[Claims] 【請求項1】セルの少なくとも底面が硬化インキ離型性
樹脂によって形成されたことを特徴とする凹版。
1. An intaglio plate characterized in that at least the bottom surface of the cell is formed of a cured ink releasing resin.
【請求項2】セルを囲繞形成する版表面が撥インキ性樹
脂によって形成された請求項1記載の凹版。
2. The intaglio plate according to claim 1, wherein the plate surface surrounding the cells is formed of an ink repellent resin.
【請求項3】硬化インキ離型性樹脂がポリオレフィン樹
脂・変性ポリオレフィン樹脂・ポリエチレンオキシド樹
脂・メラミン樹脂・加水硬化型シリコーン樹脂等から選
択された樹脂からなる請求項1または2記載の凹版。
3. The intaglio according to claim 1 or 2, wherein the cured ink release resin comprises a resin selected from polyolefin resin, modified polyolefin resin, polyethylene oxide resin, melamine resin, hydrolyzable silicone resin and the like.
【請求項4】セルの少なくとも底面に硬化インキ離型性
樹脂を配設して形成した凹版のセルに、硬化促進可能な
インキを供給してセル内で硬化させ、この版表面と被印
刷物の表面に配設した粘着剤とを密着した後、粘着剤を
硬化させるかそのままの硬度で被印刷物と凹版とを引き
離し、セル内で硬化したインキを硬化した粘着剤の粘着
力または硬化しないそのままの粘着剤の粘着力によって
被印刷物に転移させることを特徴とする凹版を用いた印
刷方法。
4. An ink capable of accelerating curing is supplied to an intaglio cell formed by disposing a cured ink release resin on at least the bottom surface of the cell and is cured in the cell, and the surface of the plate and the object to be printed. After making close contact with the pressure-sensitive adhesive provided on the surface, the pressure-sensitive adhesive is cured or the printing material and the intaglio are separated with the same hardness, and the ink cured in the cell has the adhesive force of the cured adhesive or is not cured. A printing method using an intaglio, which is characterized in that it is transferred to an object to be printed by the adhesive force of an adhesive.
【請求項5】セルの少なくとも底面に硬化インキ離型性
樹脂を配設して形成した凹版のセルに、硬化促進可能な
インキを供給してセル内で硬化させ、さらに粘着性イン
キを硬化したインキの上に供給し、この版表面と被印刷
物の面または被印刷物の表面に配設した粘着剤とを重
ね、粘着剤を被印刷物と密着させた後、粘着剤を硬化さ
せるかそのままの硬度で被印刷物と凹版とを引き離し、
セル内で硬化したインキと粘着剤を被印刷物に転移させ
ることを特徴とする凹版を用いた印刷方法。
5. An ink capable of accelerating curing is supplied to an intaglio cell formed by disposing a cured ink release resin on at least the bottom surface of the cell to cure the ink in the cell, and the adhesive ink is further cured. It is supplied on top of the ink, and the plate surface and the adhesive on the surface of the material to be printed or on the surface of the material to be printed are overlapped, and after the adhesive is brought into close contact with the material to be printed, the adhesive is cured or the hardness is maintained as it is. Separate the substrate and intaglio with
A printing method using an intaglio, which comprises transferring an ink cured in a cell and an adhesive to a material to be printed.
【請求項6】凹版基板の上面に配設した未硬化の撥イン
キ性樹脂層に、凸部を片面に有する母型基板の凸部上に
硬化インキ離型性樹脂層を剥離可能に配設して形成した
型取り母型の硬化インキ離型性樹脂層を合わせて密着型
取りし、撥インキ性樹脂層の硬化後、母型基板を除去し
て凹版が形成された請求項4または5記載の印刷方法。
6. An uncured ink repellent resin layer disposed on the upper surface of an intaglio substrate, and a cured ink releasable resin layer releasably disposed on the convex portion of a master substrate having a convex portion on one surface. 6. The intaglio plate is formed by removing the mother substrate after curing the ink-releasing resin layer of the mold master formed by the above method and curing the ink-repellent resin layer. Printing method described.
【請求項7】凹版基板の片面に硬化インキ離型性樹脂層
を配設し、この上に光硬化型シリコーン樹脂層を設け、
この光硬化型シリコーン樹脂層をパターン露光して所要
部を硬化させた後、未硬化部を除去し、撥インキ性樹脂
を光硬化型シリコーン樹脂層によって構成すると共に、
下層に配設した硬化インキ離型性樹脂層を露出して凹版
が形成された請求項4または5記載の印刷方法。
7. A cured ink releasable resin layer is provided on one surface of an intaglio substrate, and a photocurable silicone resin layer is provided thereon.
After pattern-exposing this photocurable silicone resin layer to cure the required portion, the uncured portion is removed, and the ink repellent resin is constituted by the photocurable silicone resin layer,
The printing method according to claim 4 or 5, wherein an intaglio plate is formed by exposing the cured ink release resin layer provided in the lower layer.
【請求項8】凹版基板の片面に硬化インキ離型性樹脂層
を配設し、この上に光硬化性粘着剤層を設け、さらにこ
の光硬化性粘着剤層の上にシリコーン樹脂層を設け、こ
のシリコーン樹脂層の上からパターン露光して光硬化性
粘着剤層の所要部を硬化させた後、光硬化性粘着剤層の
未硬化部をその表層部のシリコーン樹脂と共に除去し、
撥インキ性樹脂をシリコーン樹脂層によって構成すると
共に、下層に配設した硬化インキ離型性樹脂層を露出し
て凹版が形成された請求項4または5記載の印刷方法。
8. A cured ink releasable resin layer is provided on one surface of an intaglio substrate, a photocurable pressure sensitive adhesive layer is provided thereon, and a silicone resin layer is further provided on the photocurable pressure sensitive adhesive layer. , After pattern exposure from above the silicone resin layer to cure the required portion of the photocurable pressure-sensitive adhesive layer, the uncured portion of the photocurable pressure-sensitive adhesive layer is removed together with the silicone resin of the surface layer portion,
6. The printing method according to claim 4, wherein the ink-repellent resin is composed of a silicone resin layer, and the cured ink release resin layer provided in the lower layer is exposed to form an intaglio plate.
【請求項9】凹版基板の凹部に供給した硬化インキ離型
性樹脂の液を固化して、セルの少なくとも底面に配設す
る硬化インキ離型性樹脂が形成された請求項4または5
記載の印刷方法。
9. A cured ink releasable resin to be disposed on at least the bottom surface of the cell is formed by solidifying a liquid of the cured ink releasable resin supplied to the concave portion of the intaglio substrate.
Printing method described.
【請求項10】凹凸部を逆に形成したネガ状凹版の版表
面に、未硬化の硬化インキ離型性樹脂を密着させて型取
りした後、ネガ状凹版を除去し、硬化インキ離型性樹脂
の凸部端面に撥インキ性樹脂を配設して凹版が形成され
た請求項4または5記載の印刷方法。
10. The negative ink intaglio plate is formed by reversing the concavo-convex portion on the plate surface of the negative ink intaglio plate. The printing method according to claim 4 or 5, wherein an intaglio plate is formed by disposing an ink-repellent resin on the end surface of the convex portion of the resin.
【請求項11】硬化インキ離型性樹脂がポリオレフィン
樹脂・変性ポリオレフィン樹脂・ポリエチレンオキシド
樹脂・メラミン樹脂・加水硬化型シリコーン樹脂等から
選択された樹脂からなる請求項4〜10何れかに記載の
印刷方法。
11. The printing according to claim 4, wherein the cured ink releasable resin comprises a resin selected from polyolefin resin, modified polyolefin resin, polyethylene oxide resin, melamine resin, hydrolyzable silicone resin and the like. Method.
【請求項12】凹版基板の片面に硬化インキ離型性シリ
コーン樹脂層を配設し、これを加湿硬化してこの上にシ
リコーン樹脂接着用プライマーを塗布し、さらにこのプ
ライマーの上に紫外線硬化型シリコーン樹脂層を設け、
この紫外線硬化型シリコーン樹脂層をパターン露光して
所要部を硬化させた後、未硬化部を除去し、撥インキ性
樹脂を紫外線硬化型シリコーン樹脂層によって構成する
と共に、下層に配設した硬化インキ離型性シリコーン樹
脂層を露出して凹版が形成された請求項4または5記載
の印刷方法。
12. A cured ink releasable silicone resin layer is provided on one surface of an intaglio substrate, the cured ink is moisturized and cured, and a silicone resin adhesion primer is applied on the cured ink resin layer. Provide a silicone resin layer,
The UV-curable silicone resin layer is pattern-exposed to cure the required portion, and then the uncured portion is removed, and the ink-repellent resin is constituted by the UV-curable silicone resin layer and the cured ink disposed in the lower layer. The printing method according to claim 4, wherein the releasable silicone resin layer is exposed to form an intaglio plate.
JP15312394A 1994-06-13 1994-06-13 Intaglio and printing method using the intaglio Expired - Fee Related JP3503198B2 (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
JP15312394A JP3503198B2 (en) 1994-06-13 1994-06-13 Intaglio and printing method using the intaglio

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JPH07329441A true JPH07329441A (en) 1995-12-19
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001264962A (en) * 2000-03-17 2001-09-28 Dainippon Printing Co Ltd Offset printing plate
JP2009056624A (en) * 2007-08-30 2009-03-19 Toppan Printing Co Ltd Printing plate, its forming method, and method of forming printed matter
JP2009066963A (en) * 2007-09-14 2009-04-02 Toppan Printing Co Ltd Printing plate, its manufacturing method, and method for manufacturing printed matter
JP2009078426A (en) * 2007-09-26 2009-04-16 Toppan Printing Co Ltd Printing plate, method for producing the same, and method for producing printed matter
JP2010094807A (en) * 2008-09-19 2010-04-30 Think Laboratory Co Ltd Heating roller with recessed part
JP2012009562A (en) * 2010-06-23 2012-01-12 Taiyo Yuden Co Ltd Method and apparatus for generating unbaked conductor layer print sheet for laminated electronic component
JP2017074718A (en) * 2015-10-15 2017-04-20 日立マクセル株式会社 Photogravure offset printing intaglio and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054464A (en) * 1991-06-28 1993-01-14 Dainippon Printing Co Ltd Manufacture of intaglio printing plate for micro-pattern printing
JPH05139065A (en) * 1991-11-19 1993-06-08 Matsushita Electric Ind Co Ltd Intaglio for printing and method for offset printing using the same
JPH05309963A (en) * 1992-05-14 1993-11-22 Matsushita Electric Ind Co Ltd Intaglio for printing and method for printing
JPH05309962A (en) * 1992-05-14 1993-11-22 Matsushita Electric Ind Co Ltd Intaglio for printing and preparation thereof and method for printing
JPH0647895A (en) * 1992-07-29 1994-02-22 Toyo Shigyo Kk Precise printing method and precise printer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054464A (en) * 1991-06-28 1993-01-14 Dainippon Printing Co Ltd Manufacture of intaglio printing plate for micro-pattern printing
JPH05139065A (en) * 1991-11-19 1993-06-08 Matsushita Electric Ind Co Ltd Intaglio for printing and method for offset printing using the same
JPH05309963A (en) * 1992-05-14 1993-11-22 Matsushita Electric Ind Co Ltd Intaglio for printing and method for printing
JPH05309962A (en) * 1992-05-14 1993-11-22 Matsushita Electric Ind Co Ltd Intaglio for printing and preparation thereof and method for printing
JPH0647895A (en) * 1992-07-29 1994-02-22 Toyo Shigyo Kk Precise printing method and precise printer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001264962A (en) * 2000-03-17 2001-09-28 Dainippon Printing Co Ltd Offset printing plate
JP2009056624A (en) * 2007-08-30 2009-03-19 Toppan Printing Co Ltd Printing plate, its forming method, and method of forming printed matter
JP2009066963A (en) * 2007-09-14 2009-04-02 Toppan Printing Co Ltd Printing plate, its manufacturing method, and method for manufacturing printed matter
JP2009078426A (en) * 2007-09-26 2009-04-16 Toppan Printing Co Ltd Printing plate, method for producing the same, and method for producing printed matter
JP2010094807A (en) * 2008-09-19 2010-04-30 Think Laboratory Co Ltd Heating roller with recessed part
JP2012009562A (en) * 2010-06-23 2012-01-12 Taiyo Yuden Co Ltd Method and apparatus for generating unbaked conductor layer print sheet for laminated electronic component
JP2017074718A (en) * 2015-10-15 2017-04-20 日立マクセル株式会社 Photogravure offset printing intaglio and manufacturing method thereof

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