JPH03280416A - Resist pattern forming method - Google Patents

Resist pattern forming method

Info

Publication number
JPH03280416A
JPH03280416A JP8162490A JP8162490A JPH03280416A JP H03280416 A JPH03280416 A JP H03280416A JP 8162490 A JP8162490 A JP 8162490A JP 8162490 A JP8162490 A JP 8162490A JP H03280416 A JPH03280416 A JP H03280416A
Authority
JP
Japan
Prior art keywords
ink
hardened
resist pattern
substrate
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8162490A
Other versions
JPH0648677B2 (en
Inventor
Akira Okazaki
Original Assignee
G T C:Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by G T C:Kk filed Critical G T C:Kk
Priority to JP2081624A priority Critical patent/JPH0648677B2/en
Publication of JPH03280416A publication Critical patent/JPH03280416A/en
Publication of JPH0648677B2 publication Critical patent/JPH0648677B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

Links

Abstract

PURPOSE: To make it possible to form a fine resist pattern having suitable thickness accurately, clearly and efficiently at low cost by a method wherein viscous ink is filled in the line recesses of a printing plate, the ink on the region other than the line recesses is removed by a doctor, the ink in the recesses is hardened, and it is transferred to the substrate, whereon a thin film transistor(TFT) will be formed, which is the material to be printed.
CONSTITUTION: Line recesses 2 and 2 are formed on the corresponding resist pattern in order to form a TFT semiconductor film on a printing plate 1, ultraviolet ray hardenable ink 3 is applied on the surface, unnecessary ink is removed by scraping with a doctor, and the ink 3 is left only in the line recesses. Then, when the ink is hardened by projecting ultraviolet rays, the innermost part of the line recesses 2 is turned to a completely hardened part 3c, and the part which comes in contact with outside air becomes an incompletely hardened layer part 3b in a viscous state. Subsequently, after the printing plate 1 has been aligned to the TFT substrate 7 on which a p-Si film 6 is formed, both of them are closely fixed, rolled and when the hardened ink 3 is transferred to the substrate 7, the resist pattern can be reproduced in a highly precise manner. Moreover, an adhesive or viscous film or a photoresist can be applied to the substrate in advance.
COPYRIGHT: (C)1991,JPO&Japio
JP2081624A 1990-03-29 1990-03-29 The method of forming a resist pattern Expired - Fee Related JPH0648677B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2081624A JPH0648677B2 (en) 1990-03-29 1990-03-29 The method of forming a resist pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2081624A JPH0648677B2 (en) 1990-03-29 1990-03-29 The method of forming a resist pattern

Publications (2)

Publication Number Publication Date
JPH03280416A true JPH03280416A (en) 1991-12-11
JPH0648677B2 JPH0648677B2 (en) 1994-06-22

Family

ID=13751487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2081624A Expired - Fee Related JPH0648677B2 (en) 1990-03-29 1990-03-29 The method of forming a resist pattern

Country Status (1)

Country Link
JP (1) JPH0648677B2 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6274412B1 (en) * 1998-12-21 2001-08-14 Parelec, Inc. Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays
US6732643B2 (en) 2001-11-07 2004-05-11 Lg. Philips Lcd Co., Ltd. Method for forming pattern using printing process
US6875704B2 (en) 2002-12-18 2005-04-05 Lg.Philips Lcd Co., Ltd. Method for forming pattern using printing process
US6940578B2 (en) 2002-12-18 2005-09-06 Lg.Philips Lcd Co., Ltd. Method for fabricating liquid crystal display device
US7098988B2 (en) 2002-12-27 2006-08-29 Lg.Philips Lcd Co., Ltd. Method of fabricating liquid crystal display device
JP2006251071A (en) * 2005-03-08 2006-09-21 Dainippon Screen Mfg Co Ltd Method for forming resist pattern
US7140296B2 (en) 2002-12-27 2006-11-28 Lg.Philips Lcd Co., Ltd. Method for forming pattern of liquid crystal display device
US7169517B2 (en) 2002-12-27 2007-01-30 Lg Philips Lcd Co., Ltd. Method of fabricating a color filter in liquid crystal display device without using a photo mask
JP2007059668A (en) * 2005-08-25 2007-03-08 Fuji Electric Device Technology Co Ltd Manufacturing method of semiconductor device
US7243599B2 (en) 2002-12-27 2007-07-17 Lg Philips Lcd Co., Ltd. Method of fabricating color filter in display device
US8105762B2 (en) 2002-12-18 2012-01-31 Lg Display Co., Ltd. Method for forming pattern using printing process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5830758A (en) * 1981-08-18 1983-02-23 Canon Inc Electrophotographic receptor
JPH0183468U (en) * 1987-11-19 1989-06-02
JPH01148358A (en) * 1987-12-04 1989-06-09 Nec Corp Roller applicator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5830758A (en) * 1981-08-18 1983-02-23 Canon Inc Electrophotographic receptor
JPH0183468U (en) * 1987-11-19 1989-06-02
JPH01148358A (en) * 1987-12-04 1989-06-09 Nec Corp Roller applicator

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6274412B1 (en) * 1998-12-21 2001-08-14 Parelec, Inc. Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays
US6732643B2 (en) 2001-11-07 2004-05-11 Lg. Philips Lcd Co., Ltd. Method for forming pattern using printing process
US6875704B2 (en) 2002-12-18 2005-04-05 Lg.Philips Lcd Co., Ltd. Method for forming pattern using printing process
US6940578B2 (en) 2002-12-18 2005-09-06 Lg.Philips Lcd Co., Ltd. Method for fabricating liquid crystal display device
US8105762B2 (en) 2002-12-18 2012-01-31 Lg Display Co., Ltd. Method for forming pattern using printing process
US7098988B2 (en) 2002-12-27 2006-08-29 Lg.Philips Lcd Co., Ltd. Method of fabricating liquid crystal display device
US7140296B2 (en) 2002-12-27 2006-11-28 Lg.Philips Lcd Co., Ltd. Method for forming pattern of liquid crystal display device
US7169517B2 (en) 2002-12-27 2007-01-30 Lg Philips Lcd Co., Ltd. Method of fabricating a color filter in liquid crystal display device without using a photo mask
US7243599B2 (en) 2002-12-27 2007-07-17 Lg Philips Lcd Co., Ltd. Method of fabricating color filter in display device
US7362405B2 (en) 2002-12-27 2008-04-22 Lg.Philips Lcd Co., Ltd. Method of fabricating liquid crystal display device
JP2006251071A (en) * 2005-03-08 2006-09-21 Dainippon Screen Mfg Co Ltd Method for forming resist pattern
JP2007059668A (en) * 2005-08-25 2007-03-08 Fuji Electric Device Technology Co Ltd Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JPH0648677B2 (en) 1994-06-22

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