200835409 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種防止蝕刻劑侵蝕鋁基板之電路板 製程，特別是指一種簡化電路板生產流程，於蝕刻過程中 加入銘保護藥劑，得以保護鋁基板不被蝕刻到不需蝕刻的 地方，簡化生產印刷電路板製程，縮短電路板製程所需時 間。 【先前技術】 按，印刷電路板廣泛地應用於各種電子領域上，是一 種不可或缺的電子組件。透過電路板的設置，將插接於電 路板上之各個電子零組件的功能結合起來，得以發揮整體 效能。 一 請參閱第1圖所示，一般傳統鋁基板生產製程，主要 係包含下列步驟： 係先於鋁基板上鑽設印刷孔，該印刷孔供以定位使 • 用； 於鋁基板表面進行線路表面處理刷磨，增加表面粗糙 度及清潔； ^ 再於鋁基板上壓印乾膜及保護膠，乾膜係用於影像轉 移曝光使用，保護膠保護鋁基板在蝕刻過程中，不被蝕刼 液侵蝕到不需蝕刻的地方； x ^將鋁基板進行影像轉移作業，利用曝光顯影方式，使 ί鋁基板上形成所需的預設線路圖案，而將不需之鋼面裸 露； 5 200835409 再將鋁基板置入餘刻液中，將不需要的銅面部分蚀刻 掉，經由上述方式，即完成銘基板之線路層； 再以化學藥劑或加熱方式去除黏附於線路層上的乾 膜； 並將钕刻完成之銘基板進行二次鑽孔，此次鑽孔作業 係於鋁基板上鑽設電子零件之插接孔，再將上述的複數插 接孔進行防焊處理，並佈設文字及表面處理，將保護膠剝 去，即為一習用鋁基板之電路板製程。 _ 如上所述為一般標準的印刷電路板製程，其相環之製 作流程過於繁複，增加製作的不便以及耗費工時，尤其為 了保濩鋁基板不需蝕刻的部分，以保護膜覆蓋該處增加製 作工¥，但實際操作下來，即使有保護膜保護铭基板，仍 然於保護膜周邊渗入餘刻液，使得銘基板姓刻後，周邊還 出現被蝕刻的痕跡，因而影響電路板的功用。 •再者，_後的銘大都殘留於餘刻液内，如果使用相 籲同的姓刻液來進行電路板餘刻，會產生無法預期的後果， 殊不理想。 【發明内容】 爰疋本毛月之主要目的，旨在提供一種防止钱刻劑 侵触基板之電路板製程，將銘保護藥劑加入餘刻液中’ 不需要貼保護膠於銘基板上，簡化電路板製程，並保護銘 基板不受餘刻液侵餘。 本I月之人目的，旨在提供一種防止兹刻劑侵姓鋁 基板之電路板衣粒，透過銘保護藥劑的加入，使得整體銘 6 200835409200835409 IX. Description of the Invention: [Technical Field] The present invention relates to a circuit board process for preventing an etchant from eroding an aluminum substrate, and more particularly to a simplified circuit board production process, which is protected by adding a protective agent during the etching process. The aluminum substrate is not etched to a place where etching is not required, which simplifies the process of producing a printed circuit board and shortens the time required for the board process. [Prior Art] Press, printed circuit boards are widely used in various electronic fields and are an indispensable electronic component. Through the board's setup, the functions of the various electronic components plugged into the board are combined to achieve overall performance. As shown in Figure 1, the conventional aluminum substrate production process mainly includes the following steps: drilling a printing hole on an aluminum substrate, the printing hole is provided for positioning; and the wiring surface is performed on the surface of the aluminum substrate. Handle brushing to increase surface roughness and cleanness; ^ Embed dry film and protective glue on aluminum substrate, dry film is used for image transfer exposure, protective rubber protects aluminum substrate during etching, and is not etched Erosion to the place where no etching is required; x ^Image transfer operation of the aluminum substrate, using the exposure development method to form the desired preset line pattern on the ί aluminum substrate, and leaving the steel surface unnecessary; 5 200835409 The aluminum substrate is placed in the residual liquid to etch away the unnecessary copper surface portion, and the circuit layer of the substrate is completed by the above method; and the dry film adhered to the circuit layer is removed by chemical or heating; The engraved substrate is subjected to secondary drilling. The drilling operation is to drill the insertion holes of the electronic components on the aluminum substrate, and then the above-mentioned plurality of insertion holes are solder-proofed and laid. Text and surface treatment, the protective adhesive is stripped, which is a circuit board process for a conventional aluminum substrate. _ As described above, it is a general standard printed circuit board process, and the production process of the phase ring is too complicated, which increases the inconvenience of production and labor, especially in order to protect the portion of the aluminum substrate that does not need to be etched, and the protective film covers the area. The production worker ¥, but in practice, even if there is a protective film to protect the name substrate, the residual liquid is infiltrated around the protective film, so that the name of the substrate is etched, and the etched trace appears on the periphery, thus affecting the function of the circuit board. • In addition, the _ after the _ remains in the residual liquid, if you use the same name of the engraving to carry out the remaining circuit board, it will have unpredictable consequences, which is not ideal. [Summary of the Invention] The main purpose of the 毛本毛月 is to provide a circuit board process for preventing money engraving agents from invading the substrate, and adding the protective agent to the residual liquid, which does not require a protective glue on the substrate, simplifying the circuit. The board process and protect the substrate from the residual liquid. The purpose of this I month is to provide a circuit board granule that prevents the engraving agent from invading the aluminum substrate, and through the addition of the Ming protection agent, the overall Ming 6 200835409
基板製程簡化，而可加快電路板製作速率，有助於節省製 作成本之目的者。 I 為達上述之目的，本發明係為一種於鋁基板製作時， 在#刻過程中加入銘保遵藥劑，得以使得銘基板受銘保護 藥劑的保護，避免钱刻液侵餘到不該侵餘的地方。 於可行實施例中，本發明係包含下列步驟，預先準備 一鋁基板，將鋁基板材料進行鑽孔，鑽設複數孔洞，以刷 輪刷磨增加鋁基板表面粗糙度及清潔，以網版印刷方式將 ⑩油墨依佈線圖案塗佈於銘基板銅面上，油墨乾燥後形成一 保護膜於鋁基板之銅面上，保護所需之銅面，使不需保護 之銅面裸露，待上述線路圖案佈設完成後，進行蝕刻，使 鋁基板表面形成預設之線路層，再將上述鋁基板進行後置 處理作業，經由上述步驟即完成鋁基板之電路板製作，其 特徵在於： 將上述I呂基板置入蚀刻液内進行姓刻，同時加入銘保 護藥劑，上述鋁保護藥劑保護鋁基板不被蝕刻液侵蝕到不 需侵钱的地方。 其中’上述所鑽設之複數孔洞為印刷孔及電子插接 孑L 。 於可行實施例中，上述蝕刻液成分為硫酸Sulfuric acid(100-300 g/L)，雙氧水 hydrogen peroxide(200-300 g/L )，並於姓刻液加入鋁保護添加劑（ι〇—50 g/L)。 於較佳實施例中，上述鋁保護藥劑成份為因應鋁基板 厚度、餘刻時間及其他不同條件下，具有以下四種調配比 7 200835409 例： 一、 聚丙醇（polypropylene glycol) 0.2-4%，分子 量為600-1000，十二烧基苯石黃酸鈉（Sodium Lauryl Sulfate) 0· 05-0· 1〇/〇。 二、 聚乙醇（polyethylene glycol )0· 2-4%，分子 量為600-2000，十二燒基苯石黃酸銨（Ammonia Laureth Sulfate) 0·05-0·1% 〇 三、 聚乙醇（polyethylene glycol )0· 1 -2%，分子 馨畺為 600-2000，聚丙醇（polypropylene glycol )0· 1-2%， 刀子量為600-1000，十二烧基苯石黃酸納（Sodium Lauryl Sulfate) 〇·05-0·1%。 四、 聚乙醇（polyethylene glycol ) 0· 1 -2%，分子 里為 -2000 ’ 聚丙醇（polypropylene glycol )0· 1 -2%， 刀子畺為600 -1000,十二烧基苯石黃酸銨（Ammonia LaurethThe substrate process is simplified, which speeds up the board fabrication rate and helps to save manufacturing costs. For the purpose of the above, the present invention is a method for adding an insole to the inscription during the process of making an aluminum substrate, so that the substrate can be protected by the protective agent, and the money engraving is prevented from invading. The rest of the place. In a feasible embodiment, the present invention comprises the following steps: preparing an aluminum substrate in advance, drilling the aluminum substrate material, drilling a plurality of holes, and brushing the wheel to increase the surface roughness and cleaning of the aluminum substrate, and printing by screen printing The method applies 10 inks according to the wiring pattern on the copper surface of the inscription substrate, and the ink is dried to form a protective film on the copper surface of the aluminum substrate to protect the copper surface required, so that the copper surface without protection is exposed, and the above-mentioned line is to be After the pattern layout is completed, etching is performed to form a predetermined circuit layer on the surface of the aluminum substrate, and then the aluminum substrate is subjected to a post-processing operation, and the circuit board of the aluminum substrate is completed through the above steps, wherein: The substrate is placed in the etching liquid for the surname, and the protective agent is added. The aluminum protective agent protects the aluminum substrate from being etched by the etching liquid to a place where no money is invaded. The plurality of holes drilled in the above are the printing holes and the electronic plugs 孑L. In a feasible embodiment, the etchant component is sulfuric acid Sulfuric acid (100-300 g/L), hydrogen peroxide (200-300 g/L), and an aluminum protective additive (ι〇-50 g) is added to the surname. /L). In a preferred embodiment, the aluminum protective agent component has the following four blending ratios according to the thickness of the aluminum substrate, the remaining time, and other different conditions. 7 200835409 Example: 1. Polypropylene glycol 0.2-4%, The molecular weight is 600-1000, sodium sulphate (Sodium Lauryl Sulfate) 0·05-0·1〇/〇. 2. Polyethylene glycol 0· 2-4%, molecular weight 600-2000, Ammonia Laureth Sulfate 0.05-0·1% 〇3, Polyethylene (polyethylene) Glycol ) 0· 1 -2%, molecular menthol is 600-2000, polypropylene glycol 0· 1-2%, knife amount is 600-1000, sodium lauryl sulphate ) 〇·05-0·1%. 4. Polyethylene glycol 0·1 -2%, -2000 in the molecule 'polypropylene glycol 0. 1 -2%, knife 畺 600-1000, 12-alkyl benzoate (Ammonia Laureth
Sulfate) 〇· 〇5-0· 1%。 • 於另一可行實施例中，形成線路圖案蝕刻前之作業， 除γ 、Sulfate) 〇· 〇5-0· 1%. • In another possible embodiment, the operation of forming the line pattern before etching, except γ,
、以網版印刷方式來塗佈外，亦可於鋁基板上壓印乾 膜)X 建，以影像轉移曝光及影像呈現顯影，再進行蝕刻作業， 採立出零件間連線的線路層，以上述線路層製作方式，因 制用光孥方式，可使線路層相間的佈線更加精密，有助於 I作線路更為精密的電路基板。 於可行實施例中，該鋁基板為單面板或雙面板之一。 學較佳實施例中，上述後置處理作業係將鋁基板以化 朱涮或加熱去除線路層上的保護膜，並於複數孔洞進行 8 200835409 防焊處理，佈設文字圖案於鋁基板上，接著進行表面處理， 即完成銘基板之電路板製作。 【實施方式】 茲為便於貴審查委員能更進一步對本發明之構 造、使用及其特徵有更深一層，明確、詳實的認識與瞭解， 爰舉出較佳之實施例，配合圖式詳細說明如下： 首先請參閱第2圖所示，本發明係為一種防止蝕刻劑 侵蝕鋁基板之電路板製程，係於蝕刻過程中加入鋁保護藥 • 劑，得以使整體製程簡化。 於可行實施例中，該製程包含以下步驟： (A )預先準備一銘基板材料，於銘基板上進行鑽孔 作業，使鋁基板具有複數孔洞； (B) 將上述銘基板以刷輪刷磨增加表面粗糙度及清 潔，得以使保護膜與鋁基板表面緊密結合； (C) 以網版印刷將預設線路圖案之油墨印刷於鋁基 φ 板上，待油墨乾燥後形成一保護膜於預保護之銅面，使不 需之銅面裸露； (D )再將!呂基板置入I虫刻液内，並加入!呂保護藥劑 於内，得以保護铭基板不被侵钱到不需侵姓的部分； (E)完成蝕刻後，便形成所需之線路層於鋁基板上， 再將上述鋁基板進行後置處理作業，得以完成一鋁基板之 電路板製程。 其中，鋁基板上所鑽之孔洞係印刷時使用之固定孔及 9 200835409 電子零件的插接孔。 於可行實施例中，後置作業包括：將敍刻完成之銘基 板，以化學藥劑將線路層上的保護膜去除，並於紹基板上 之孔洞進行防焊處理，再塗佈文字圖案及表面處理，即完 成鋁基板之電路板製作。 於可行實施例中’預先準備—裁切完成之㈣板，於 銘基板上進行鑽孔，鑽出印刷孔洞及零件插接孔等複數孔 洞0 ⑩ ⑽基板表面進行刷磨處理，使得銅面微粗化及清 >糸’增加與保護膜的密著的效果。 接著製作鋁基板之線路層，係以網版印刷方式將油墨 佈設於鋁基板上，網版上之圖案係為線路圖案，使得油墨 k佈於鋁基板王現出所需之線路圖案，待油墨乾燥後形成 一保護膜於銅面上，使不需要的銅面露出，並以蝕刻液去 除，蝕刻過程可以將鋁基板置入蝕刻溶劑中，並加入鋁保 _ 濩藥劑，上述鋁保護藥劑係可保護鋁基板不受餘刻液侵钮 到不需侵钱的地方。 經由上述作業，蝕刻液將不需之銅層蝕去，剩下的銅 面便形成鋁基板之線路層，接著將鋁基板置入剝膜槽，去 除歹4留於銅面上的保護膜，留下待焊孔洞，再將防焊漆層 覆盍於佈没線路上’這樣佈線就不會接觸到電鍛的部分。 再於I呂基板上印刷各零件的位置及文字，並進行表面 處理，便完成銘基板之電路板製作。 於可行實施例中，該鋁基板為單面板或雙面板之一。 200835409 於可行實施例中，上述蝕刻液成分為硫酸Sulfuric acid(100-300 g/L) ’ 雙氧水 hydrogen peroxide(200-300 g/L)，並於蝕刻液加入鋁保護添加劑（i〇—5〇 g/L)。 於較佳實施例中，上述鋁保護藥劑成份為因應鋁基板 厚度、#刻時間及其他不同條件下，具有以下四種調配比 例： 一、 聚丙醇（polypropylene glycol) 0.2-4%，分子 量為600-1000，十二烷基苯磺酸鈉（Sodium Lauryl • Sulfate) 0· 05-0· 1%。 二、 聚乙醇（polyethylene glycol )0· 2-4%，分子 $為 600-2000，十二烧基苯磺酸銨（Ammonia Laureth Sulfate) 0· 05-0.1%。 三、 聚乙醇（polyethylene glycol ) 0· 1 -2% ,分子 !為 600-2000，聚丙醇（polypropylene glycol )0· 1-2%， 分子量為600-1000，十二烧基苯磺酸納（Sodium Lauryl 壽 Sulfate) 〇· 05-0· 1〇/〇。 四、 聚乙醇（polyethylene glycol) 0.1 -2%，分子 置為 600-2000，聚丙醇（polypropylene glycol )0· 1-2%， 分子量為600-1000,十二烧基苯磺酸銨（Ammonia LaurethIn addition to coating by screen printing, it is also possible to emboss a dry film on an aluminum substrate. X is built, image transfer exposure and image development are developed, and etching is performed to form a wiring layer connecting the parts. According to the above-mentioned circuit layer manufacturing method, the wiring between the circuit layers can be made more precise by the use of the diaphragm method, which contributes to the circuit board which is more precise in the circuit. In a possible embodiment, the aluminum substrate is one of a single panel or a double panel. In a preferred embodiment, the post-processing operation is to remove the protective film on the circuit layer by using an aluminum substrate or heating, and perform a solder mask on the multiple holes in 200838409, and arrange the text pattern on the aluminum substrate, and then The surface treatment is performed, that is, the circuit board of the Ming substrate is completed. [Embodiment] In order to facilitate the review committee to further understand, understand, and understand the structure, use, and features of the present invention, a preferred embodiment will be described with reference to the following detailed description: Referring to Fig. 2, the present invention is a circuit board process for preventing an etchant from eroding an aluminum substrate, and an aluminum protective agent is added during the etching process to simplify the overall process. In a possible embodiment, the process comprises the following steps: (A) preparing a substrate material in advance, performing a drilling operation on the substrate to make the aluminum substrate have a plurality of holes; (B) brushing the above-mentioned substrate with a brush wheel Increasing the surface roughness and cleaning, so that the protective film is tightly bonded to the surface of the aluminum substrate; (C) printing the ink of the preset line pattern on the aluminum-based φ plate by screen printing, and forming a protective film after the ink is dried Protect the copper surface, so that the copper surface is not needed; (D) Put the Lu substrate into the I insect engraving solution, and add it to the Lu protection agent to protect the substrate from being invaded to no invasion. The part of the last name; (E) After the etching is completed, the desired circuit layer is formed on the aluminum substrate, and the aluminum substrate is post-processed to complete the circuit board process of the aluminum substrate. Among them, the holes drilled on the aluminum substrate are the fixing holes used for printing and the insertion holes of the electronic parts of 200835409. In a feasible embodiment, the post-installation operation comprises: removing the substrate on which the engraving is completed, removing the protective film on the circuit layer with a chemical agent, and performing anti-welding treatment on the holes on the substrate, and then coating the text pattern and surface. Processing, that is, completing the circuit board fabrication of the aluminum substrate. In the feasible embodiment, 'pre-prepared-cut the finished (four) board, drill holes on the Ming substrate, drill a plurality of holes such as printing holes and part insertion holes, and 10 10 (10) the surface of the substrate is brushed to make the copper surface slightly The roughening and clearing >糸' increase the adhesion to the protective film. Then, the circuit layer of the aluminum substrate is prepared, and the ink is disposed on the aluminum substrate by screen printing, and the pattern on the screen is a line pattern, so that the ink k is disposed on the aluminum substrate to display the desired line pattern, and the ink is to be inked. After drying, a protective film is formed on the copper surface, the unnecessary copper surface is exposed, and is removed by an etching solution. The aluminum substrate is placed in an etching solvent by an etching process, and an aluminum protective agent is added, and the aluminum protective agent system is added. It can protect the aluminum substrate from the engraved liquid to the place where it does not need to invade the money. Through the above operation, the etching liquid will be etched away from the unnecessary copper layer, and the remaining copper surface will form a circuit layer of the aluminum substrate, and then the aluminum substrate is placed in the stripping groove to remove the protective film of the crucible 4 remaining on the copper surface. Leave the hole to be welded, and then cover the solder resist layer on the cloth line. This way, the wiring will not touch the part of the electric forging. Then, the position and characters of each part are printed on the Ilu substrate, and the surface treatment is performed to complete the circuit board production of the substrate. In a possible embodiment, the aluminum substrate is one of a single panel or a double panel. 200835409 In a feasible embodiment, the etchant component is sulfuric acid Sulfuric acid (100-300 g/L) 'hydrogen peroxide (200-300 g/L), and an aluminum protective additive (i〇-5〇 is added to the etching solution) g/L). In a preferred embodiment, the aluminum protective agent has the following four blending ratios in accordance with the thickness of the aluminum substrate, the etching time, and other conditions: 1. Polypropylene glycol 0.2-4%, molecular weight 600 -1000, sodium laurylbenzene sulfonate (Sodium Lauryl • Sulfate) 0·05-0· 1%. 2. Polyethylene glycol 0· 2-4%, molecular weight: 600-2000, ammonium sulfonate sulfonate (Ammonia Laureth Sulfate) 0· 05-0.1%. 3. Polyethylene glycol 0·1 -2%, molecular! 600-2000, polypropylene glycol 0· 1-2%, molecular weight 600-1000, sodium dodecylbenzenesulfonate ( Sodium Lauryl Shou Sulfate) 〇· 05-0· 1〇/〇. 4. Polyethylene glycol 0.1 -2%, molecular weight 600-2000, polypropylene glycol 0· 1-2%, molecular weight 600-1000, ammonium dodecylbenzenesulfonate (Ammonia Laureth)
Sulfate) 〇·05-0·1%。 請參第3圖所示，為本發明之相同概念之另一實施 例，上述鋁基板形成線路圖案蝕刻前之作業，除了以網版 印刷方式來塗佈外，亦可於鋁基板上壓印乾膜，以影像轉 移曝光及影像呈現顯影，使得鋁基板上之銅面呈現出預設 11 200835409 線路圖案，使不需之銅面裸露，再進行蝕刻作業，將裸銅 餘刻’得以建立出零件間連線的線路層，以上述線路層製 ，方式’因採用光學方式’可使線路層相間的佈線更力:精 密’有助於製作線路更為精密的電路基板。 上述影像成形方式，係先在鋁基板上壓印乾臈，使光 線透過工作底片照雜基板，將光_轉，顯像完畢後 仍留在銅面上的阻劑’則為線路表面的阻劑圖案，再將銘 基板進行餘刻，便可形成線路層。Sulfate) 〇·05-0·1%. Referring to FIG. 3, in another embodiment of the same concept of the present invention, the operation of forming the circuit pattern before the aluminum substrate is etched may be performed on the aluminum substrate in addition to the screen printing method. The dry film is image-exposure-exposed and image-developed, so that the copper surface on the aluminum substrate exhibits a preset 11 200835409 circuit pattern, so that the copper surface is not required to be exposed, and then the etching operation is performed, and the bare copper remains can be established. The circuit layer connecting the parts is made of the above-mentioned circuit layer. The method of 'optical method' can make the wiring between the circuit layers more powerful: precision 'helps to make circuit boards with more precise lines. In the above image forming method, the dry film is first embossed on the aluminum substrate, so that the light passes through the working film to illuminate the substrate, and the light-turning, and the resist remaining on the copper surface after the image forming is the resistance of the line surface. The pattern of the agent, and then engraving the substrate, can form a circuit layer.
合八ΓΓί為正光阻贼負緣劑，正光_係照射後 =解’而負光阻劑沒有經過照射就會分解，並搭配工作 氐使用，於影像轉移作業時，可作不同照射方式。 夺像路圖案佈設於鋁基板之方式，為網版印刷及 2移轉方式，主要目岐將保護膜佈設於職線路圖荦 _面上’使不要的銅層露出’而可讓裸銅被_液飯去 本發明主要藉由在蝕刻過程中，鋁保護藥劑的加入， 2鋁基板於_過料，轉㈣難夠㈣銘基板， 刻到不需_的部分，而可省去㈣需佈設及拆 2護膠純基板上的製程，有助於域鍾製作 並減少額外的製作成本。 電可以—次完成’而不需分次鑽孔，簡化紹基板 之目I:&加陕電路板製作速率，有助於節省製作成本 <目的者。 高The combination of ΓΓ ΓΓ 为 is a positive photoresist thief negative edge agent, positive light _ after irradiation = solution and the negative photoresist will be decomposed without irradiation, and used in conjunction with work ,, in the image transfer operation, can be used for different illumination methods. The way of capturing the image of the road is arranged on the aluminum substrate, which is the screen printing and the 2 transfer method. The main purpose is to lay the protective film on the 线路 _ surface to make the unnecessary copper layer exposed, and the bare copper can be _Liu rice to the present invention mainly by the addition of aluminum protective agent during the etching process, 2 aluminum substrate in the _ over material, turn (four) difficult enough (four) Ming substrate, engraved to the part that does not need _, but can be omitted (four) need to be laid And the process of removing the 2 glue on the pure substrate helps the field clock to be produced and reduces the additional production cost. The electricity can be completed in one operation without the need for separate drilling, which simplifies the substrate I: & Adding the circuit board production rate, which helps to save production costs. high
^者，基板之電路板主要應用於大功率、大電流、 又门力耗之處’具有優異的散熱性，實現電路組裝 12 200835409 的可靠性和長壽命性，而可搭配LED應用，提供其優異的 散熱效率。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾，皆 仍應含括於本發明申請專利範圍内。 【圖式簡單說明】 第1圖，係習用鋁基板製程之流程示意圖； _ 第2圖，係本發明之製作流程示意圖； 第3圖，係本發明另一實施例之製作流程示意圖。 【主要元件符號說明】 A· ·於鋁基板材料上鑽孔 B··表面處理刷磨 C· ·網版印刷油墨形成保護膜 D· ·餘刻過程加入銘保護藥劑 E··後置處理作業 13^, the board of the substrate is mainly used in high power, high current, and door power consumption' with excellent heat dissipation, to achieve the reliability and long life of the circuit assembly 12 200835409, and can be used with LED applications to provide Excellent heat dissipation efficiency. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All should still be included in the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic flow chart of a conventional aluminum substrate process; _ 2 is a schematic diagram of a manufacturing process of the present invention; and FIG. 3 is a schematic view showing a manufacturing process of another embodiment of the present invention. [Description of main component symbols] A··Drilling on aluminum substrate material B··Surface treatment brushing C··Screen printing ink to form protective film D··Residual process adding Ming protection agent E·· Post processing operation 13