JP2725605B2 - Manufacturing method of printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a printed wiring board in which conductor patterns on both front and back surfaces are connected by a conductor plating layer on a hole wall.

[0002]

2. Description of the Related Art Conventionally, Japanese Patent Application Laid-Open No. 61-107788 discloses a method of providing a printed wiring board material of this kind at a low cost and manufacturing a printed wiring board cheaply, quickly and easily. According to this conventional technique, as shown in FIG. 14, holes 2 are provided at reference grid points of a substrate 1 and the wall surfaces of all the holes 2 are
A conductive plating layer 3 is formed on the entire surface of the front and back surfaces to form a universal substrate for a printed wiring board. An etching resist is printed on this universal substrate to form a conductor plating layer 3 on the wall surface of the required hole 2 and a conductor pattern 4 on both front and back surfaces. The remaining portion is etched to manufacture a printed wiring board.

As another example, a ceramic wiring board having through holes suitable for mounting a hybrid IC and an LSI and a method of manufacturing the same are disclosed in Japanese Patent Application Laid-Open No. 61-229.
No. 389. In this conventional technique, as shown in FIG. 15, a hole 2 is provided at a reference grid point of a ceramic substrate 1 and a hole filling material 7 made of an electrically insulating material is provided in an unnecessary hole 2.
After filling, a conductor plating layer 3 is formed on the wall surface of the required hole 2 and on both front and back surfaces, and this is etched to form a conductor pattern 4.
To manufacture a printed wiring board. Here, as a method of filling the filling material 7, a technique of filling the filling material 7 made of a photosensitive resin into all the holes 2 and then opening the necessary holes 2 by exposure and development processing is also disclosed.

[0004]

In this conventional method using a universal substrate having a conductor plating layer formed on the entire wall surface and both front and back surfaces of the holes, the holes are formed at all positions of the reference grid points. In addition, since a conductor pattern cannot be formed at a position overlapping with a hole other than a necessary hole, there is a disadvantage that a wiring density is reduced.

On the other hand, in the method using a ceramic substrate, holes are formed inexpensively using a general-purpose mold on the ceramic substrate.
For example, when applied to a substrate made of glass epoxy resin, polyimide resin, phenol resin, or the like, in the case of a substrate having a thickness of about 1 mm to 2 mm, it is difficult to punch a hole having a diameter less than the thickness with a mold, so that There is a disadvantage that holes cannot be formed and the wiring density is reduced.

An object of the present invention is to provide a method of manufacturing a printed wiring board having high versatility and capable of obtaining high-density wiring.

[0007]

Means for Solving the Problems To solve this problem,
The method of manufacturing a printed wiring board according to the first aspect of the present invention includes the steps of: regularly forming a small-diameter hole having a thickness of about the thickness of the thin plate on a grid in the thin plate; and filling the hole with a filling material. A step of forming a substrate having the holes filled with the hole-filling material and laminating by laminating and laminating a plurality of the thin plates with an adhesive, and peeling the hole-filling material of the substrate from the holes to open the holes; wherein the step, further comprising the step of forming a plated conductor on both sides of the substrate and wall surfaces of the hole conductor plating layer
And

[0008]

[0009]

[0010]

A step of forming a small-diameter opening in the thin plate;
And lay out the glass fibers in parallel and put it in the right angle resin
It is also possible to use a step of fixing with a band group.

Further, the step of opening the hole includes at least one of the following steps.

(A) A step of forming a conductor plating layer on the entire surface of the substrate, and a step of removing the conductor plating layer at the position of the opening by etching and removing the filling material using the conductor plating layer as a mask.

(B) A step of printing a resin on the entire surface of the substrate except for the positions of the holes to be opened, and a step of peeling the filling material using the resin as a mask.

(C) a step of filling the hole-filling material into holes other than the holes that are opened after the hole-filling material of the substrate is once peeled off.

Further, the step of forming the conductor plating layer includes at least one of the following steps.

(A) A step of forming a conductor plating layer on the hole walls and the entire surface of the substrate, and a step of printing and etching an etching resist to form a conductor pattern.

[0018] (b) a step of printing a plating registry reverse version of the pattern of the conductive pattern, forming a conductive pattern performs conductor plated hole wall and the entire surface of the substrate to the plating resist as a mask.

The method of manufacturing a printed wiring board of the second invention, indicia
The shape of the printed wiring board divided vertically by dividing the hole into grooves
In thin plate, creating a plurality of Hosoban having grooves filled with filling material in the groove. This groove is perpendicular to the longitudinal direction of the thin plate
There are multiple bands in the direction. Align the grooves with multiple thin plates
The hole is filled with a filling material by bonding to form a hole.
Creating a loaded substrate. Then, the method includes a step of peeling the hole filling material of the substrate from the hole to open the hole, and a step of plating a conductor on the hole wall and both the front and back surfaces of the substrate to form a conductor plating layer. Here, the step of forming the substrate includes at least one of the following steps.

(A) The thin plate is waved in the longitudinal direction of the thin plate.
Of forming a thin plate with irregularities and grooves
And filling the hole with the filling material.
A process in which a plurality of sheets are stacked and adhered .

(B) A step of printing a hole filling material on a thin plate to form a parallel convex pattern, and a step of applying a resin to the thin plate, bonding a plurality of sheets, and laminating.

In addition, the step of opening the hole includes at least one of the following steps.

(A) A step of forming a conductor plating layer over the entire surface of the substrate, and a step of removing the conductor plating layer at the position of the hole to be opened by etching and removing the filling material using the conductor plating layer as a mask.

(B) A step of printing a resin on the entire surface of the substrate except for the positions of the holes to be opened, and a step of peeling the filling material using the resin as a mask.

(C) a step of filling the hole-filling material into holes other than the holes that are opened after the hole-filling material on the substrate is once peeled off.

Further, the step of forming the conductor plating layer includes at least one of the following steps.

(A) A step of forming a conductor plating layer on the hole wall and the entire surface of the substrate, and a step of printing and etching an etching resist to form a conductor pattern.

(B) A step of printing a plating resist having a reverse pattern of the conductor pattern and a step of forming a conductor pattern by plating the hole walls and the entire surface of the substrate using the plating resist as a mask.

According to a third aspect of the present invention, there is provided a method for manufacturing a printed wiring board, comprising: forming a conductive pattern on a substrate having holes filled with a hole filling material; and forming a hole filled with the holes filling material at positions corresponding to the substrate and the holes. A step of creating a substrate filled with the hole-filling material in the stacked holes by laminating and bonding thin plates having alternately, and a step of peeling the hole-filling material of the substrate from the hole and opening the hole. Forming a conductor plating layer by plating a conductor on both sides of the hole wall and the substrate. Here, the step of opening the hole includes the following steps.

(A) A step of forming a conductive plating layer on the entire surface of the substrate, and a step of removing the conductive plating layer at the position of the opening hole by etching and removing the filling material using the conductive plating layer as a mask.

The step of forming the conductor plating layer includes the following steps.

(A) A step of forming a conductor plating layer on the hole wall and the entire surface of the substrate, and a step of printing and etching an etching resist to form a conductor pattern.

A method of manufacturing a printed wiring board according to a fourth aspect of the present invention includes a step of forming a conductive pattern on a substrate having holes filled with a hole filling material, and a step of printing and coating a resin on portions other than the holes to be opened of the substrate. And a step of peeling the filling material from the hole using the resin as a mask and opening the hole, and a step of further forming a conductor pattern on the surface of the resin. Here, the step of forming the conductor plating layer includes the following steps.

(A) A step of forming a conductor plating layer on the hole walls and the entire surface of the substrate, and a step of printing and etching an etching resist to form a conductor pattern.

According to a fifth aspect of the present invention, there is provided a printed wiring board manufacturing method in which a plurality of thin plates having holes at opposing positions are bonded and laminated, and a substrate is formed in which the laminated holes are filled with a conductive filling material. A step of etching the surface of the conductive filling material other than the front and back conduction holes and filling the surface with the electrically insulating filling material, and plating a conductor over the entire surface of the substrate and connecting to the conductive filling material. Forming a conductive plating layer to be formed.

A method of manufacturing a printed wiring board according to a sixth aspect of the present invention is a method of manufacturing a printed wiring board, comprising: bonding and laminating a plurality of thin plates each having a hole at a position facing each other; Manufacturing a substrate filled with, a step of filling the holes other than the front and back conduction holes with an electrically insulating filling material, and a conductor for plating a conductor over the entire surface of the substrate and connecting to the conductive filling material Forming a plating layer.

[0037]

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 (a) to 1 (d) are partially perspective views and sectional views showing a first embodiment of the present invention in the order of steps for explaining the first embodiment. FIGS. 2 (a) to 2 (d) show the present invention. FIG. 3 is a cross-sectional view illustrating a first embodiment in the order of steps. In the first embodiment of the present invention, first, as shown in FIG.
A thin plate 6 of an epoxy resin, a polyimide resin, or a phenol resin having a thickness of about 4 mm is punched out with a mold to form a hole 2 having a diameter substantially equal to the thickness of the thin plate. The thin plate 6 can be formed by punching out a thin plate of ceramics with a mold before curing, or can be formed by pouring glass or a resin liquid into a mold and curing it. It can also be manufactured by exposure and development.

Next, as shown in FIG. 1B, a hole filling material 7 is applied and filled into the hole 2 of the thin plate 6 with a squeegee and then cured. The filling material 7 is a thermosetting type ink which can be stripped of a solvent after being cured (alkali peeling type rosin knitting male resin, rosin knitting phenol resin,
(Acrylic copolymer, styrene / maleic resin, etc.) and heat cured. Further, these resins can be cured by irradiating ultraviolet rays using an ultraviolet-curable filling material 7 in which an acrylate monomer, a photopolymerization initiator, and a sensitizer are added. As the other filling agent 7, a solution in a solvent such as polyvinyl chloride or polyacrylonitrile, synthetic amide, or cellulose acetate can be filled and dried and solidified. Next, as shown in FIG. 1C, an adhesive 8 (an adhesive of an epoxy resin system, a phenol resin system, a polyimide resin system, or the like) is printed on the thin plate 6 prepared in this manner, laminated, and bonded. Then, a substrate 1 is prepared. Alternatively, the thin plate 6 may be formed from a semi- cured resin, the thin plates 6 may be laminated, and heated and pressed by a press device to bond and cure to form the substrate 1. The substrate 1 can also be obtained by laminating thin plates 6 having holes 2 at opposing positions with an adhesive 8 and filling the laminated holes 2 with a filling material 7.

Next, as shown in FIG. 1D, copper is deposited on the surface of the substrate 1 to a thickness of several microns, and then the substrate 1 is immersed in an electroless copper plating bath having the composition shown below. Is coated with a copper plating layer 3-1 of several microns on both sides.

Copper sulfate 0.06 mol / l EDTA 0.12 mol / l HCHO 0.3 mol / l NaOH 0.35 mol / l Additive proper amount Plating solution temperature 72 ° C, pH 12.4 Was immersed in an electrolytic copper plating bath having the following composition, and the current density was 10 amps / 6.45 cm ² ,
The conductor plating layer 3 is formed by performing plating and covering the copper plating layer 3-2 having a thickness of about 25 μm.

Copper 22-38 g / l Pyrophosphate 150-250 g / l Nitrate 5-10 g / l Ammonia 1-3 g / l Orthophosphate 10-13 oz / gal or less Next, as shown in FIG. Next, an etching resist having a window formed at the position of the opening 2 is printed on both the front and back surfaces of the substrate 1. The etching resist is formed by screen printing or by exposing and developing a photosensitive resist (such as RISTON 1015 manufactured by EI Dupont). Thereafter, the substrate 1 is immersed in a ferric chloride solution to etch the copper conductor plating layer 3. Next, as shown in FIG.
Using the copper conductor plating layer 3 as a mask, the hole-filling material 7 exposed from this is dissolved and peeled to open the hole 2. If the filling material 7 is filling ink, the hole 2 is opened by dissolving and dissolving with a sodium hydroxide solution of about 2 to 3%. When the filling material 7 is polyvinyl chloride, it is a VC-VDC copolymer or the like, and when the filling material 7 is polyacrylonitrile, it is cresol or formic acid.
In the case of synthetic polyamide, formic acid amide is used, and in the case of cellulose acetate, acetone or a mixed solution of ethyl alcohol and ethyl ether is used for dissolution and peeling. Next, as shown in FIG. 2C, the substrate 1 is immersed in an electroless copper plating bath to cover a copper plating layer 3-1 (not shown) of several microns, and then immersed in an electrolytic copper plating bath. Density 10 amps / 6.45c
A copper plating layer 3-3 of about 25 μm is coated on both the front and back surfaces of the substrate 1 and the wall surface of the hole 2 by plating for 106 minutes at m ² to form a conductor plating layer 3.

Next, as shown in FIG. 2D, an etching resist is printed on both the front and back surfaces of the copper conductor plating layer 3, and then the substrate 1 is immersed in a ferric chloride solution to form the copper conductor plating layer 3. Is etched to form a conductor pattern 4.

FIGS. 3A to 3E are sectional views showing a second embodiment of the present invention in the order of steps for explaining the same. In the second embodiment of the present invention, first, as shown in FIG.
The substrate 1 in which the holes 2 are filled with the filling material 7 is prepared by the same steps as those of the first embodiment shown in FIGS. Next, as shown in FIG. 3 (b), a resin 14 such as an epoxy resin, a polyimide resin, or a phenol resin is printed on the entire surface of the substrate 1 except for the portions where the holes 2 are opened on the front and rear surfaces by screen printing. I do. Alternatively, a photocurable resin may be adhered to the substrate 1 as the resin 14, and the pattern may be exposed and developed to cover the substrate 1.

Next, as shown in FIG.
Using the mask 4 as a mask, the exposed filling material 7 is
In the same process as in the first embodiment shown in FIG. Next, as shown in FIG.
3C, the conductor plating layer 3 was formed on both the front and back surfaces of the substrate 1 and the wall surface of the hole 2 by the same process as in the first embodiment shown in FIG.
As shown in (e), the conductor plating layer 3 is etched to form a conductor pattern 4. The second embodiment has the advantage that only one conductor plating step is required.

FIGS. 4A to 4D are sectional views showing a third embodiment of the present invention in the order of steps for explaining the third embodiment. In the third embodiment of the present invention, first, as shown in FIG.
The substrate 1 in which the holes 2 are filled with the filling material 7 is prepared by the same steps as those of the first embodiment shown in FIGS. Then the hole
In selectively forming a filling portion of the filling material 7, a hole is filled.
The resist that resists the peeling process of the metal 7 is metal plating or
Requires special resist such as strong cured resin resist
Because of the problem, selective removal of the filling material 7 is not performed first.
The entire filling material 7 is dissolved and peeled off. Next, as shown in FIG. 4C, a substrate 1 is prepared in which the holes 2 other than the holes 2 to be opened are filled with the filling material 7 by screen printing. Also, after dissolving and removing the filling material 7, a photosensitive dry film resist is adhered, exposed and developed to cover the hole 2 to be opened, and the remaining holes 2 are filled with the filling material 7 with a squeegee, and then the dry film resist is removed. The substrate 1 can also be formed by peeling. Next, as shown in FIG.
In the same steps as in the first embodiment shown in FIGS. 1C and 1D, the conductor plating layer 3 is formed on the front and back surfaces of the substrate 1 and the wall surface of the hole 2 and etched to form the conductor pattern 4. The third embodiment has an advantage that a simple structure without using the resin 14 can be obtained.

FIGS. 5A to 5C are sectional views showing a fourth embodiment of the present invention in the order of steps for explaining the fourth embodiment. In the fourth embodiment of the present invention, first, as shown in FIG.
The holes 2 are formed in the same steps as in the second embodiment shown in FIGS.
A substrate 1 having an opening is formed. Next, as shown in FIG. 5B, the plating resist 15 is applied to the reverse pattern of the conductor pattern.
(Such as Nopco Cure F from San Nopco Co., Ltd.). Next, as shown in FIG. 5C, the conductor pattern 4 is immersed in an electroless copper plating bath for several hours to form a copper plating thickness of about 25 μm. In the fourth embodiment, since the electroless copper plating is performed, there is an advantage that the conductor plating layer 3 can be formed at a deep position of the small-diameter hole 2 of the substrate 1 with the same plating thickness as the surface.

FIGS. 6A to 6D are cross-sectional views showing a fifth embodiment of the present invention in the order of processes. In the fifth embodiment of the present invention, first, as shown in FIG.
A hole 2 having a diameter about the same thickness as that of a glass fiber cloth or a natural fiber paper having a thickness of about 0.01 mm is punched out in a lattice shape by a press. Next, as shown in FIG. 6B, the cloth 16 is impregnated with a resin 17 such as a thermosetting epoxy resin or a polyimide resin or a phenol resin.
The substrate 1 is formed by stacking a plurality of the resin layers 17 by heating and curing and integrally forming the resin.

Next, as shown in FIG. 6C, a hole filling material 7 is screen-printed and filled in the holes 2 other than the holes 2 to be opened in the substrate 1. Next, as shown in FIG.
The copper plating layer 3 is formed on both the front and back surfaces of the substrate 1 and the wall surface of the hole 2 in the same steps as in the first embodiment shown in FIGS. The conductor patterns 4 on both front and back sides are formed.

In the fifth embodiment, since the substrate 1 is formed by impregnating the resin 17 into the entire cloth 16, there is an advantage that deformation such as warpage of the substrate 1 due to cooling and shrinkage of the resin 17 is small.

FIG. 7 is a perspective view of a substrate used in the sixth embodiment of the present invention. In the sixth embodiment of the present invention, first, FIG.
As shown in the figure, the group of the first glass fibers 18-1 is arranged in parallel, the group of the second glass fibers 18-2 is arranged at right angles to the first glass fiber 18-1, and the second Glass fiber 1
8-2, that is, the first glass fiber 18-1
The group of the third glass fibers 18-3 is arranged at a position overlapping the group. Similarly, the fourth group of glass fibers 18 and the fifth group
A glass lattice 19 is formed by alternately stacking groups of glass fibers 18 and groups of sixth glass fibers 18 at right angles. The glass grid 19 is impregnated with the resin 17, and a high-speed airflow is blown through the glass grid 19 vertically.
After the holes 7 are blown off to form the holes 2, the resin 17 is thermally cured to form the substrate 1. In FIG. 6 (c),
In the same process as in the fifth embodiment shown in FIG.
Thereafter, a conductor plating layer 3 is formed on both the front and back surfaces of the substrate 1 and the wall surfaces of the holes 2 and etched to form a conductor pattern 4. The sixth embodiment has an advantage that the wiring density can be further increased because the wall 2 of the hole 2 can be formed as a high-density hole 2 having only one glass fiber 18 and a resin 17 as a thin wall.

FIG. 8 is an exploded perspective view of a substrate used in the seventh embodiment of the present invention. In the seventh embodiment of the present invention, first,
As shown in FIG. 8, a group of glass fibers 18 are arranged in parallel, and a band group of resin 20 is printed at right angles to the group of glass fibers 18 and semi-cured to form a thin plate 6. The hole 2 of this thin plate 6
The filling material 7 is filled by screen printing and hardened in the same process as in the first embodiment shown in FIG. Next, the adhesive 8 is printed on the thin plate 6 thus formed, and the thin plate 6 is overlapped and bonded so that the glass fibers 18 are overlapped at right angles to each other.
Next, in the same steps as in the first embodiment shown in FIGS. 2A to 2D, the conductor pattern 4 and the conductor plating layer 3 are formed on the wall surfaces of the holes 2 on both the front and back surfaces of the substrate 1.

In the seventh embodiment, since the thin plate 6 in which the group of the glass fibers 18 is fixed with the resin 20 is used, there is an advantage that the lamination is easy.

FIGS. 9A to 9C are sectional views showing the order of steps for explaining the eighth embodiment of the present invention. In the eighth embodiment of the present invention, first, as shown in FIG.
In the same steps as in the first embodiment shown in (a) to (d),
Filling material 7 into hole 2 having a diameter of about 0.4 to 0.05 mm
A substrate 1 having a thickness of about 1 to 0.1 mm filled with is formed, and a conductor plating layer 3 is formed on both front and back surfaces.

Next, an etching resist is printed on the substrate 1 and the conductive plating layer 3 is etched using the resist as a mask to form a conductive pattern 4. At this time, the filling material 7 of the substrate 1 is left as it is. Next, as shown in FIG. 9B, a plurality of substrates 1 and thin plates 6 of a resin in a semi-cured state filled with a filling material 7 are alternately stacked, and are heated and pressed by a press device to be cured. Next, as shown in FIG.
In the same steps as in the first embodiment shown in (b) to (d), the conductor plating layer 3 is provided on the wall surface of the hole 2 and the conductor pattern 4 is provided on both front and back surfaces.
To form The eighth embodiment has an advantage that a multilayer printed wiring board having a small-diameter hole 2 can be easily formed.

FIGS. 10A to 10C are sectional views showing a ninth embodiment of the present invention in the order of steps for explaining the ninth embodiment. In the ninth embodiment of the present invention, first, as shown in FIG.
In the same process as in the eighth embodiment shown in (a), a hole filling material 7 is filled in a hole 2 having a diameter of about 0.4 to 0.05 mm, and a conductive pattern 4 is formed on both front and back surfaces. 1m
The substrate 1 having a thickness of about m is manufactured. Next, FIG.
As shown in (1), the resin 14 is printed and coated on the entire surface except the portion where the hole 2 is opened by screen printing. Here, the filling material 7 is printed by screen printing so as to overlap the filling material 7 in the portion where the hole 2 is opened, and then the resin 1 is applied to the entire other surface.
4 can also be printed.

Next, as shown in FIG.
The hole-filling material 7 at the portion exposed from is peeled off to open the hole 2,
The conductor plating layer 3 is formed on the wall surface of the hole 2 and on both front and back surfaces of the resin 14.
To form An etching resist is printed on both front and back surfaces, and the conductor plating layer 3 is etched to form a conductor pattern 4. The ninth embodiment has an advantage that a multilayer printed wiring board can be easily formed because a press device is unnecessary.

FIGS. 11A and 11B are sectional perspective views showing a tenth embodiment of the present invention in the order of steps for explaining the tenth embodiment. In the tenth embodiment of the present invention, first, as shown in FIG. 11A, the width is about 2 to 0.1 mm and the thickness is 0.2 to 0.1 mm.
A resin thin plate of about 05 mm was created, and a jig having convex parts was pressed against this at a pitch of about several millimeters to 0.1 mm, pressed and bent into a wavy uneven shape of several mm to 0.1 mm pitch. A thin plate 22 is created. The thin plate 22 can form irregularities by transferring the shape of the mold before hardening the ceramic thin plate 6, and can also form irregularities by digging a groove with a jig having convex parts of equal pitch. Alternatively, irregularities can be formed by pouring glass or resin liquid into a mold and curing it. Next, on both sides of the thin plate 22, the filling material 7
With a squeegee. Next, as shown in FIG. 11 (b), the adhesive 8 is printed on
To form a substrate 1 having a side surface perpendicular to the surface of the thin plate 22 and filled with the filling material 7. Next, FIG.
(D) to the first embodiment shown in FIG. 2 (b), FIG. 3 (b),
The hole 2 is opened in the same process as in the second embodiment shown in FIG. 4C or the third embodiment shown in FIGS.
The first embodiment shown in (c) and (d) or FIG.
A conductor pattern 4 is formed in the same process as in the fourth embodiment shown in FIG. The tenth embodiment has an advantage that a crack fault in the hole 2 hardly occurs because there is no adhesive layer in the middle of the hole 2.

FIGS. 12A to 12C are sectional perspective views showing the eleventh embodiment of the present invention in the order of steps for explaining the same. In the eleventh embodiment of the present invention, first, as shown in FIG. 12A, the width is about 2 to 0.1 mm and the thickness is 0.2 to 0.1 mm.
A thin plate 22 having a thickness of about 05 mm is formed, and a hole filling material 7 is applied to the thin plate 22 to a thickness of about 0.2 to 0.05 mm. next,
As shown in FIG. 12 (b), the hole filling material 7 of the thin plate 22 is scraped in the longitudinal direction with a jig having a convex portion at a pitch of about several mm to 0.1 mm, and filled with a pitch of several mm to 0.1 mm. A thin plate 22 having a pattern of the material 7 is manufactured. Next, as shown in FIG. 12C, a resin 23 is applied to the thin plate 22 and a large number of the thin plates 22 are adhered to each other. The substrate 1 is prepared.
Next, in the same process as in the eleventh embodiment, the holes 2 are opened to form the conductor patterns 4 to form a printed wiring board. The eleventh embodiment has an advantage that the manufacturing is simple because no mold is used.

FIGS. 13A to 13D are sectional views showing a twelfth embodiment of the present invention in the order of steps for explaining the twelfth embodiment. In the twelfth embodiment of the present invention, first, as shown in FIG.
A plurality of thin plates having holes at opposing positions are laminated by bonding, and the laminated holes are filled with a filling material. In the present embodiment, a conductive filling material 7-1 such as a copper paste is used as a filling material, and a substrate 1 filled with the conductive filling material 7-1 is prepared. Next, as shown in FIG.
Then, the conductive filling material 7-1 in the holes 2 other than the front and back conduction holes 2-1 is etched.

Next, as shown in FIG. 13 (c), an electrically insulating filling material 7-2 such as ink for filling the holes 2 of the etched conductive filling material 7-1 is filled. Next, FIG.
As shown in FIG. 2, a conductor pattern 4 is formed by processing in the same manner as in the first embodiment shown in FIGS. The twelfth embodiment has the advantage that the current capacity of the conductor conducting between the front and back can be increased.

The thirteenth embodiment of the present invention first
A hole filling material is filled in the stacked holes in the same process as in the twelfth embodiment shown in FIG. In this embodiment, the conductive filler 7 such as copper paste or silver paste is used as the filler.
-1, a substrate 1 filled with the conductive filling material 7-1 is prepared. Next, in the same process as that of the second embodiment shown in FIG. 3 (b), an electric insulating material such as an epoxy resin, a polyimide resin, or a phenol resin is formed on both the front and back surfaces of the substrate 1 except for a portion conducting between the front and back surfaces. Resin 14 is printed and coated. Next, processing is performed in the same manner as in the first embodiment shown in FIGS. 2C and 2D to form a conductor pattern 4 by forming a conductor plating layer 3 on both the front and back surfaces of the substrate 1. The thirteenth embodiment has an advantage that the steps of etching the conductive filling material 7-1 and filling the insulating filling material 7-2 are eliminated, and the procedure is simple.

[0063]

As described above, the present invention mainly uses a synthetic resin as a main component because it mainly uses a punching process by a printing technique without using a mechanical process such as a cutting process using a drill or a punching process using a die. Even if a substrate is used, it is possible to form small-diameter holes sufficiently smaller than the thickness of the substrate at a high density, and it is possible to realize a high-density wiring.

[Brief description of the drawings]

FIGS. 1 (a) to 1 (d) are a partial cross-sectional perspective view and a cross-sectional view illustrating a first embodiment of the present invention in the order of steps for explaining the same.

FIGS. 2A to 2D are cross-sectional views showing a first embodiment of the present invention in the order of steps for explaining the first embodiment.

3 (a) to 3 (e) are cross-sectional views shown in the order of steps for explaining a second embodiment of the present invention.

FIGS. 4A to 4D are cross-sectional views shown in the order of steps for explaining a third embodiment of the present invention.

FIGS. 5A to 5C are cross-sectional views illustrating a fourth embodiment of the present invention in the order of steps for explaining the same.

FIGS. 6A to 6D are cross-sectional views illustrating a fifth embodiment of the present invention in the order of steps for explaining the same.

FIG. 7 is a perspective view of a substrate used in a sixth embodiment of the present invention.

FIG. 8 is an exploded perspective view of a substrate used in a seventh embodiment of the present invention.

FIGS. 9A to 9C are cross-sectional views shown in the order of steps for explaining an eighth embodiment of the present invention.

FIGS. 10A to 10C are cross-sectional views showing a ninth embodiment of the present invention in the order of steps for explaining the ninth embodiment.

FIGS. 11 (a) and 11 (b) are cross-sectional perspective views showing a tenth embodiment of the present invention in the order of steps for explaining the tenth embodiment.

FIGS. 12 (a) to 12 (c) are cross-sectional perspective views shown in the order of steps for explaining an eleventh embodiment of the present invention.

FIGS. 13A to 13D are cross-sectional views illustrating a twelfth embodiment of the present invention in the order of steps for explaining the twelfth embodiment.

FIG. 14 is a cross-sectional view illustrating an example of a conventional method for manufacturing a printed wiring board.

FIG. 15 is a cross-sectional view illustrating another example of a conventional method for manufacturing a printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 hole 2-1 Front and back conduction hole 3 Conductor plating layer 3-1, 3-2, 3-3 Copper plating layer 4 Conductor pattern 6 Thin plate 7 Filler 7-1 Conductive filler 7-2 Electrical insulation filler Material 8 Adhesive 14, 17, 20, 23 Resin 15 Plating resist 16 Cloth 18 Glass fiber 18-1 First glass fiber 18-2 Second glass fiber 18-3 Third glass fiber 19 Glass lattice 22 Thin plate

Claims (9)

(57) [Claims] 1. A step of regularly forming a small-diameter hole having a thickness of about the thickness of a thin plate in a thin plate, a step of filling a hole filling material into the hole, and bonding the plurality of thin plates with an adhesive. Forming a substrate having the holes filled and filled with the hole-filling material, and laminating the hole-filling material of the substrate from the holes to open the holes; Plating a conductor on both sides of the substrate to form a conductor plating layer. 2. The step of forming a small-diameter hole in the thin plate,
2. The method for manufacturing a printed wiring board according to claim 1, further comprising a step of arranging the glass fibers in parallel and fixing each of the glass fibers with a group of resin bands in a perpendicular direction. 3. A step of forming a conductor pattern on a substrate having holes filled with a filling material, and bonding a thin plate having holes filled with the filling material at positions corresponding to the holes between a plurality of substrates. Forming a substrate in which the hole filling material is filled in the laminated holes, and a step of peeling the hole filling material of the substrate from the hole to open the hole; and forming a wall surface of the hole and the substrate. Forming a conductor plating layer by conducting conductor plating on both front and back surfaces. 4. A step of regularly forming a small-diameter hole having a thickness of about the thickness of the thin plate in a thin plate, a step of filling a hole filling material in the hole, and laminating and bonding a plurality of the thin plates. A step of forming a substrate having the small-diameter holes laminated and filled with the hole-filling material, a step of forming a conductor pattern on the substrate, and printing and coating a resin on portions of the substrate other than the holes to be opened. a step of the steps of the portion other than the holes opening in the substrate resin by printing coated, a step of opening the stripped pores the filling material to the resin as a mask from the holes, and the surface of the resin Forming a conductor plating layer on the wall surface of the hole. 5. The step of forming a hole includes forming a conductor plating layer on the entire surface of the substrate, etching the conductor plating layer at the position of the hole to be removed, and stripping the filling material using the conductor plating layer as a mask. claim 1 or claim 3 a method of manufacturing a printed wiring board according to characterized in that a step of. 6. The method according to claim 1, wherein the step of opening the hole includes a step of printing a resin on the entire surface of the substrate other than the position of the hole to be opened, and a step of peeling off the filling material using the resin as a mask. A method for manufacturing a printed wiring board according to claim 1 . 7. The method according to claim 1, wherein the step of opening the hole includes the step of filling the hole filling material into holes other than the hole that is opened at the mark where the hole filling material on the substrate has been completely removed. A method for manufacturing a printed wiring board according to claim 3 . 8. The method according to claim 1, wherein the step of forming the conductor plating layer includes a step of forming the conductor plating layer on the hole walls and the entire surface of the substrate, and a step of printing and etching an etching resist to form a conductor pattern. claim 1, claim 3 or claim 4 method of manufacturing a printed wiring board, wherein. 9. The step of forming the conductor plating layer includes the step of printing a plating resist having a reverse pattern of the conductor pattern, and plating the conductor on the hole wall and the entire surface of the substrate using the plating resist as a mask to form the conductor pattern. claim 1, claim 3 or claim, characterized in that a step of forming
5. The method for producing a printed wiring board according to item 4 .