HK1219385A1 - A method for forming an outer-layer circuit on a circuit board - Google Patents

A method for forming an outer-layer circuit on a circuit board

Info

Publication number
HK1219385A1
HK1219385A1 HK16107205.8A HK16107205A HK1219385A1 HK 1219385 A1 HK1219385 A1 HK 1219385A1 HK 16107205 A HK16107205 A HK 16107205A HK 1219385 A1 HK1219385 A1 HK 1219385A1
Authority
HK
Hong Kong
Prior art keywords
forming
circuit
circuit board
layer
layer circuit
Prior art date
Application number
HK16107205.8A
Other languages
Chinese (zh)
Inventor
柯明喜
Original Assignee
Magnum Opus Global Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magnum Opus Global Tech Ltd filed Critical Magnum Opus Global Tech Ltd
Publication of HK1219385A1 publication Critical patent/HK1219385A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
HK16107205.8A 2015-11-13 2016-06-21 A method for forming an outer-layer circuit on a circuit board HK1219385A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510777595.6A CN105338752B (en) 2015-11-13 2015-11-13 A kind of wiring board outer-layer circuit manufacturing process

Publications (1)

Publication Number Publication Date
HK1219385A1 true HK1219385A1 (en) 2017-03-31

Family

ID=55288917

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16107205.8A HK1219385A1 (en) 2015-11-13 2016-06-21 A method for forming an outer-layer circuit on a circuit board

Country Status (3)

Country Link
CN (1) CN105338752B (en)
HK (1) HK1219385A1 (en)
TW (1) TW201717720A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106961797A (en) * 2017-04-06 2017-07-18 昆山苏杭电路板有限公司 Silver paste grouting base plate processing method
CN106993378A (en) * 2017-05-04 2017-07-28 东莞联桥电子有限公司 A kind of pcb board selective surface handling process
CN108834324A (en) * 2018-07-11 2018-11-16 江西景旺精密电路有限公司 A kind of internal layer LDI fast processing method
CN109511235A (en) * 2018-12-25 2019-03-22 东莞美维电路有限公司 The production method for the selective jack panel that a kind of hole VIP hole copper requires
CN112312668A (en) * 2020-10-26 2021-02-02 江西志浩电子科技有限公司 Manufacturing method for producing outer-layer circuit by using photosensitive ink
TWI814215B (en) * 2022-01-19 2023-09-01 大陸商芯愛科技（南京）有限公司 A manufacturing method of circuit layer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG79242A1 (en) * 1997-11-10 2001-03-20 Gen Electric Process for promoting chemical adhesion of legend inks using ultra-violet light
CN101197462B (en) * 2006-12-07 2011-05-25 上海英内电子标签有限公司 Production method for RFID etching aluminum antenna
CN101621895B (en) * 2008-06-30 2011-05-25 比亚迪股份有限公司 Manufacture method of soft circuit board
CN104941863B (en) * 2015-06-03 2017-11-17 喜健环球科技有限公司 A kind of full-automatic horizontal filling painting formula pcb board unicoater

Also Published As

Publication number Publication date
CN105338752B (en) 2018-10-26
CN105338752A (en) 2016-02-17
TW201717720A (en) 2017-05-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20221112