HK1219385A1 - 種線路板外層線路成形方法 - Google Patents

種線路板外層線路成形方法

Info

Publication number
HK1219385A1
HK1219385A1 HK16107205.8A HK16107205A HK1219385A1 HK 1219385 A1 HK1219385 A1 HK 1219385A1 HK 16107205 A HK16107205 A HK 16107205A HK 1219385 A1 HK1219385 A1 HK 1219385A1
Authority
HK
Hong Kong
Prior art keywords
forming
circuit
circuit board
layer
layer circuit
Prior art date
Application number
HK16107205.8A
Other languages
English (en)
Inventor
柯明喜
Original Assignee
Magnum Opus Global Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magnum Opus Global Tech Ltd filed Critical Magnum Opus Global Tech Ltd
Publication of HK1219385A1 publication Critical patent/HK1219385A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
HK16107205.8A 2015-11-13 2016-06-21 種線路板外層線路成形方法 HK1219385A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510777595.6A CN105338752B (zh) 2015-11-13 2015-11-13 一种线路板外层线路成形方法

Publications (1)

Publication Number Publication Date
HK1219385A1 true HK1219385A1 (zh) 2017-03-31

Family

ID=55288917

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16107205.8A HK1219385A1 (zh) 2015-11-13 2016-06-21 種線路板外層線路成形方法

Country Status (3)

Country Link
CN (1) CN105338752B (zh)
HK (1) HK1219385A1 (zh)
TW (1) TW201717720A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106961797A (zh) * 2017-04-06 2017-07-18 昆山苏杭电路板有限公司 银浆灌孔基板加工方法
CN106993378A (zh) * 2017-05-04 2017-07-28 东莞联桥电子有限公司 一种pcb板选择性表面处理工艺
CN108834324A (zh) * 2018-07-11 2018-11-16 江西景旺精密电路有限公司 一种内层ldi快速加工方法
CN109511235A (zh) * 2018-12-25 2019-03-22 东莞美维电路有限公司 一种vip孔孔铜要求的选择性塞孔板的制作方法
CN112312668A (zh) * 2020-10-26 2021-02-02 江西志浩电子科技有限公司 一种使用感光油墨生产外层线路的制作方法
TWI814215B (zh) * 2022-01-19 2023-09-01 大陸商芯愛科技（南京）有限公司 線路層之製法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG79242A1 (en) * 1997-11-10 2001-03-20 Gen Electric Process for promoting chemical adhesion of legend inks using ultra-violet light
CN101197462B (zh) * 2006-12-07 2011-05-25 上海英内电子标签有限公司 Rfid蚀刻铝天线的制造方法
CN101621895B (zh) * 2008-06-30 2011-05-25 比亚迪股份有限公司 一种柔性线路板的制造方法
CN104941863B (zh) * 2015-06-03 2017-11-17 喜健环球科技有限公司 一种全自动水平灌涂式pcb板双面涂布机

Also Published As

Publication number Publication date
TW201717720A (zh) 2017-05-16
CN105338752B (zh) 2018-10-26
CN105338752A (zh) 2016-02-17

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20221112