PL3389341T3 - Płytka obwodu drukowanego oprawy oświetleniowej i sposób wytwarzania płytki obwodu drukowanego oprawy oświetleniowej - Google Patents

Płytka obwodu drukowanego oprawy oświetleniowej i sposób wytwarzania płytki obwodu drukowanego oprawy oświetleniowej

Info

Publication number
PL3389341T3
PL3389341T3 PL18166318T PL18166318T PL3389341T3 PL 3389341 T3 PL3389341 T3 PL 3389341T3 PL 18166318 T PL18166318 T PL 18166318T PL 18166318 T PL18166318 T PL 18166318T PL 3389341 T3 PL3389341 T3 PL 3389341T3
Authority
PL
Poland
Prior art keywords
circuit board
luminaire circuit
manufacturing
luminaire
board
Prior art date
Application number
PL18166318T
Other languages
English (en)
Inventor
Harri Mattila
Original Assignee
Teknoware Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teknoware Oy filed Critical Teknoware Oy
Publication of PL3389341T3 publication Critical patent/PL3389341T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B44/00—Circuit arrangements for operating electroluminescent light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/32—Pulse-control circuits
    • H05B45/325—Pulse-width modulation [PWM]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
PL18166318T 2017-04-10 2018-04-09 Płytka obwodu drukowanego oprawy oświetleniowej i sposób wytwarzania płytki obwodu drukowanego oprawy oświetleniowej PL3389341T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20175331A FI127768B (fi) 2017-04-10 2017-04-10 Valaisinkortti ja menetelmä valaisinkortin valmistamiseksi
EP18166318.8A EP3389341B1 (en) 2017-04-10 2018-04-09 Luminaire circuit board and method for manufacturing a luminaire circuit board

Publications (1)

Publication Number Publication Date
PL3389341T3 true PL3389341T3 (pl) 2019-12-31

Family

ID=61913095

Family Applications (1)

Application Number Title Priority Date Filing Date
PL18166318T PL3389341T3 (pl) 2017-04-10 2018-04-09 Płytka obwodu drukowanego oprawy oświetleniowej i sposób wytwarzania płytki obwodu drukowanego oprawy oświetleniowej

Country Status (5)

Country Link
US (1) US10690331B2 (pl)
EP (1) EP3389341B1 (pl)
ES (1) ES2734923T3 (pl)
FI (1) FI127768B (pl)
PL (1) PL3389341T3 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200037628A (ko) * 2018-10-01 2020-04-09 삼성전자주식회사 디스플레이 장치 및 그 제조방법
DE102019105031B4 (de) * 2019-02-27 2022-03-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zum Ersatz von mindestens einem Chip

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5309336A (en) * 1991-02-06 1994-05-03 Millennia Corporation Universal connector and automotive cigarette lighter assemblies and rechargeable flashlight incorporating same
US20090129077A1 (en) * 1995-06-26 2009-05-21 Jlj, Inc. Series-wired led light string with unidirectional shunts
US6354715B1 (en) * 1998-01-26 2002-03-12 Bison Sportslights, Inc. Flashlight
US6561673B2 (en) * 2001-05-14 2003-05-13 Integrated Power Components, Inc. Decorative light string with storage compartment for replacement components
US20100109538A1 (en) * 2005-02-23 2010-05-06 Mei-Ling Peng Continuous current control circuit modules of series string bulbs type
JP2006303283A (ja) 2005-04-22 2006-11-02 Fujikura Ltd 発光ダイオード実装フレキシブル配線板
WO2008036873A2 (en) 2006-09-21 2008-03-27 Cree Led Lighting Solutions, Inc. Lighting assemblies, methods of installing same, and methods of replacing lights
US7549786B2 (en) 2006-12-01 2009-06-23 Cree, Inc. LED socket and replaceable LED assemblies
US7851981B2 (en) * 2006-12-22 2010-12-14 Seasonal Specialties, Llc Visible perception of brightness in miniature bulbs for an ornamental lighting circuit
GB2469794B (en) * 2009-04-24 2014-02-19 Photonstar Led Ltd High colour quality luminaire
US8511851B2 (en) * 2009-12-21 2013-08-20 Cree, Inc. High CRI adjustable color temperature lighting devices
KR101064146B1 (ko) * 2010-02-26 2011-09-16 박재순 표면 실장형 발광유니트 어레이, 이의 리페어 방법 및 리페어용 발광유니트
DE102012223945A1 (de) 2012-12-20 2014-07-10 Tridonic Jennersdorf Gmbh LED-Modul mit LED-Chip Gruppen
JP6065586B2 (ja) 2012-12-28 2017-01-25 日亜化学工業株式会社 発光装置及びその製造方法
AT13884U1 (de) 2013-03-28 2014-11-15 Zumtobel Lighting Gmbh Leiterplatte mit Leuchtdioden
CN204739513U (zh) 2015-06-13 2015-11-04 林云师 一种led节能应急灯

Also Published As

Publication number Publication date
EP3389341A1 (en) 2018-10-17
FI20175331A1 (fi) 2018-10-11
US10690331B2 (en) 2020-06-23
EP3389341B1 (en) 2019-06-19
ES2734923T3 (es) 2019-12-12
FI127768B (fi) 2019-02-15
US20180292073A1 (en) 2018-10-11

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