TW201440171A - 半導體裝置之製造方法 - Google Patents

半導體裝置之製造方法 Download PDF

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Publication number
TW201440171A
TW201440171A TW103104997A TW103104997A TW201440171A TW 201440171 A TW201440171 A TW 201440171A TW 103104997 A TW103104997 A TW 103104997A TW 103104997 A TW103104997 A TW 103104997A TW 201440171 A TW201440171 A TW 201440171A
Authority
TW
Taiwan
Prior art keywords
gate electrode
film
insulating film
region
semiconductor device
Prior art date
Application number
TW103104997A
Other languages
English (en)
Chinese (zh)
Inventor
平野有一
三原龍善
塚本惠介
Original Assignee
瑞薩電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞薩電子股份有限公司 filed Critical 瑞薩電子股份有限公司
Publication of TW201440171A publication Critical patent/TW201440171A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/013—Manufacturing their source or drain regions, e.g. silicided source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0221—Manufacture or treatment of FETs having insulated gates [IGFET] having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended-drain MOSFETs [EDMOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H10D30/603—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs  having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H10D30/694—IGFETs having charge trapping gate insulators, e.g. MNOS transistors characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/696—IGFETs having charge trapping gate insulators, e.g. MNOS transistors characterised by the shapes, relative sizes or dispositions of the gate electrodes having at least one additional gate, e.g. program gate, erase gate or select gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/017—Manufacture or treatment using dummy gates in processes wherein at least parts of the final gates are self-aligned to the dummy gates, i.e. replacement gate processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0135—Manufacturing their gate conductors
    • H10D84/0142—Manufacturing their gate conductors the gate conductors having different shapes or dimensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0147—Manufacturing their gate sidewall spacers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H10P95/062—

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Semiconductor Memories (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Non-Volatile Memory (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW103104997A 2013-04-08 2014-02-14 半導體裝置之製造方法 TW201440171A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013080783A JP2014204041A (ja) 2013-04-08 2013-04-08 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW201440171A true TW201440171A (zh) 2014-10-16

Family

ID=51654727

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103104997A TW201440171A (zh) 2013-04-08 2014-02-14 半導體裝置之製造方法

Country Status (4)

Country Link
US (1) US20140302646A1 (enExample)
JP (1) JP2014204041A (enExample)
CN (1) CN104103594A (enExample)
TW (1) TW201440171A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6026914B2 (ja) * 2013-02-12 2016-11-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US9496276B2 (en) * 2013-11-27 2016-11-15 Taiwan Semiconductor Manufacturing Co., Ltd. CMP fabrication solution for split gate memory embedded in HK-MG process
US9276005B1 (en) * 2014-12-04 2016-03-01 Silicon Storage Technology, Inc. Non-volatile memory array with concurrently formed low and high voltage logic devices
JP6518485B2 (ja) * 2015-03-30 2019-05-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6450624B2 (ja) * 2015-03-30 2019-01-09 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6556601B2 (ja) * 2015-11-11 2019-08-07 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
EP3179514B1 (en) * 2015-12-11 2024-01-24 IMEC vzw Transistor device with reduced hot carrier injection effect
JP6683488B2 (ja) * 2016-02-03 2020-04-22 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2017139375A (ja) * 2016-02-04 2017-08-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6613183B2 (ja) * 2016-03-22 2019-11-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US10276587B2 (en) * 2016-05-27 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. NVM memory HKMG integration technology
JP6591347B2 (ja) * 2016-06-03 2019-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6787798B2 (ja) * 2017-01-19 2020-11-18 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US11037830B2 (en) * 2019-10-14 2021-06-15 Renesas Electronics Corporation Method of manufacturing semiconductor device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004084314A1 (ja) * 2003-03-19 2004-09-30 Fujitsu Limited 半導体装置とその製造方法
US7220650B2 (en) * 2004-04-09 2007-05-22 Taiwan Semiconductor Manufacturing Co., Ltd. Sidewall spacer for semiconductor device and fabrication method thereof
US20060046523A1 (en) * 2004-08-25 2006-03-02 Jack Kavalieros Facilitating removal of sacrificial layers to form replacement metal gates
US7394155B2 (en) * 2004-11-04 2008-07-01 Taiwan Semiconductor Manufacturing Co., Ltd. Top and sidewall bridged interconnect structure and method
JP2009302269A (ja) * 2008-06-13 2009-12-24 Renesas Technology Corp 半導体装置の製造方法および半導体装置
US8536007B2 (en) * 2012-02-22 2013-09-17 Freescale Semiconductor, Inc. Non-volatile memory cell and logic transistor integration
US9006045B2 (en) * 2013-03-11 2015-04-14 Globalfoundries Inc. Transistor including a gate electrode extending all around one or more channel regions

Also Published As

Publication number Publication date
US20140302646A1 (en) 2014-10-09
CN104103594A (zh) 2014-10-15
JP2014204041A (ja) 2014-10-27

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