TW201428908A - 晶片埋入式印刷電路板及應用印刷電路板之半導體封裝及其製造方法 - Google Patents

晶片埋入式印刷電路板及應用印刷電路板之半導體封裝及其製造方法 Download PDF

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TW201428908A
TW201428908A TW102138387A TW102138387A TW201428908A TW 201428908 A TW201428908 A TW 201428908A TW 102138387 A TW102138387 A TW 102138387A TW 102138387 A TW102138387 A TW 102138387A TW 201428908 A TW201428908 A TW 201428908A
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semiconductor package
base substrate
electronic component
circuit board
printed circuit
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TW102138387A
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English (en)
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TWI602270B (zh
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Suk-Chang Hong
Jung-Soo Byun
Sang-Kab Park
Kwang-Seop Youm
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Samsung Electro Mech
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Abstract

本發明係揭露一種晶片埋入式印刷電路板、與應用印刷電路板之半導體封裝以及晶片埋入式印刷電路板之製造方法。利用晶片埋入式印刷電路板之半導體封裝係包括上與下半導體封裝，具有堆疊式封裝層疊結構，其中下半導體封裝包括基底基材，基底基材包括預定的電路圖案形成於其中；電子元件，電性連接於電路圖案且埋入於基底基材之中，使得電子元件之一表面曝露於基底基材之上表面；以及散熱體，設置於電子元件之曝露表面上，以消散由電子元件所產生的熱至外部。本發明可製造出具有優異的散熱功能之半導體封裝，且可增加產品之可靠度。

Description

晶片埋入式印刷電路板及應用印刷電路板之半導體封裝及 其製造方法
本發明係有關於一種晶片埋入式(chip-embedded)印刷電路板(Printed Circuit Board,PCB)，使用此印刷電路板之半導體封裝，以及印刷電路板之製造方法，且更特別地，係有關於一種晶片埋入式印刷電路板，在印刷電路板之一部分的表面上提供散熱單元，散熱單元對應於埋入印刷電路板中之晶片，以增強散熱功能，利用此印刷電路板之半導體封裝，以及晶片埋入式印刷電路板之製造方法。
由於電子產品(例如手機與類似者)已經變為多功能，連接性與溝通頻率已有所增加，並且雙核心、四核心、或類似者係應用於印刷電路板中，需解決應用處理器(Application Processor,AP)封裝之散熱問題。
第1圖繪示根據先前技術之一實施例的半導體封裝，其具有堆疊式封裝層疊(Package on package,PoP)結構。
如第1圖所繪示，先前技術之半導體封裝具有堆疊式封裝層疊結構，其中電子元件(應用處理器晶片或類似者)112和122係被封裝材料(molding material)113和123或類似者所塗佈。並且，可利用基板111與121之中的樹脂(resin)埋入(buried)電子元件112與122。
因此，從電子元件112與122所產生的熱無法順利地消散，導致裝置故障或品質降低。在第1圖中，分別地，標號110表示上半導體封裝，標號120表示下半導體封裝。
本發明之目的係用以提供晶片埋入式印刷電路板、利用印刷電路板之半導體封裝與晶片埋入式印刷電路板之製造方法，此晶片埋入式印刷電路板係有效地消散由埋入於電路板中之晶片所產生的熱。
根據本發明之一實施例，提供晶片埋入式印刷電路板包括：基底基材，包括預定的電路圖案形成於其中；電子元件，電性連接於電路圖案並埋入基底基材中，使得電子元件之一表面曝露於基底基材之一上表面；以及散熱體，設置於電子元件之一曝露表面上，以消散由電子元件所產生的熱至外部。
基底基材可更包括導孔結構，此導孔結構形成於基底基材之中並連接電路圖案，且基底基材更包括球型焊墊，此球 型焊墊形成於基底基材之上表面上，且連接於導孔結構，並作為另外的印刷電路板或半導體封裝之電性連接。
散熱體可由具有優異的導熱性與導電性之材料所製成。
可使用銅、鋁、或其合金作為散熱體之材料。
散熱體可由具有優異的散熱性質之金屬(例如鋁)所組成，且球型焊墊可由與散熱體不同之金屬(例如銅、金、鉑、或類似者)所組成，並具有優異的導電性。
散熱體可由鋁所組成，且球型焊墊可由銅、金、鉑之任一金屬所組成。
基底基材可更包括電路保護絕緣材料，此電路保護絕緣材料形成於電路圖案之間，並曝露於基底基材上與設置有散熱體之一表面相對的表面。
可使用抗焊劑作為電路保護絕緣材料。
根據本發明之另一實施例，使用晶片埋入式印刷電路板以提供半導體封裝，此半導體封裝包括：下半導體封裝，設置於具有堆疊式封裝層疊結構之半導體封裝之下部分中以作為基底；且上半導體封裝堆疊於下半導體封裝之上，以與下半導體封裝一起建構具有堆疊式封裝層疊結構之整體的單積體半導體封裝，其中下半導體封裝包括基底基材，此基底基材包括預定電路圖案形成於其中；電子元件電性連接於電路圖案且埋入於基底基材之中，使得電子元件之一表面曝露於基底基材之上表面；以及散熱體設置於電子元件之曝露表面上，以消散由電子元件所產生的熱至外部。
基底基材可更包括導孔結構，此導孔結構形成於基底基材之中並連接電路圖案，且基底基材更包括球型焊墊，此球型焊墊形成於基底基材之上表面上，且連接於導孔結構，並作為另外的印刷電路板或半導體封裝之電性連接。
散熱體可由具有優異的導熱性與導電性之材料所組成。
可使用銅、鋁、或其合金作為散熱體之材料。
散熱體可由具有優異的散熱性質之金屬(如鋁)所組成，且球型焊墊可由與散熱體不同之金屬(如銅、金、鉑、或其相似者)所組成，並具有優異的導電性。
散熱體可由鋁所組成，且球型焊墊可由銅、金、和鉑其中之任一金屬所組成。
基底基材可更包括電路保護絕緣材料，此電路保護絕緣材料形成於電路圖案之間，並曝露於基底基材上與設置有散熱體之表面相對的表面。
可使用抗焊劑作為電路保護絕緣材料。
根據本發明之另一實施例，提供製造晶片埋入式印刷電路板之方法，此製造方法包括：將電子元件結合至散熱體之一表面；在散熱體之一表面形成絕緣層，以埋入電子元件；形成電路圖案，電路圖案在絕緣層中電性連接電子元件；以及蝕刻散熱體以形成接觸於電子元件之散熱圖案。
形成絕緣層與電路圖案之步驟可執行複數次。
製造方法可更包括：形成球型焊墊，此球型焊墊電性連接於絕緣層上的電路圖案之至少一部分。
當散熱圖案形成時，可同時形成球型焊墊。
根據本發明之另一實施例，提供製造晶片埋入式印刷電路板之方法，包括：製備基底基材，此基底基材具有預定電路圖案形成於其中；部分移除基底基材之上部分以形成凹槽，經由凹槽曝露電路圖案之一部分；將電子元件插入於凹槽中，使得電子元件電性連接於電路圖案；在基底基材之上表面之上以及電子元件之曝露表面之上形成散熱體；且在電子元件之曝露表面上蝕刻散熱體以形成散熱圖案。
方法可更包括：形成球型焊墊，球型焊墊電性連接於基底基材上之電路圖案的至少一部分。
當形成散熱圖案時，同時形成球型焊墊。
110、310‧‧‧上半導體封裝
111、121、311‧‧‧基材
112、122‧‧‧電子元件
113、123‧‧‧封裝材料
120、320‧‧‧下半導體封裝
301‧‧‧散熱體
301p‧‧‧球型焊墊
302、312‧‧‧電子元件
303‧‧‧基底基材
303h‧‧‧導孔
303c‧‧‧凹槽
304‧‧‧電路圖案
305‧‧‧電路保護絕緣材料
313‧‧‧封裝體
第1圖繪示根據先前技術之具有堆疊式封裝層疊結構之半導體封裝之一實驗例的示意圖。
第2圖繪示根據本發明之一實施例之晶片埋入式印刷電路板之結構的示意圖。
第3圖繪示根據本發明之一實施例之使用晶片埋入式印刷電路板之半導體封裝之結構的示意圖。
第4圖繪示根據本發明之一實施例之製造晶片埋入式印刷電路板之方法之半導體封裝之製程流程圖。
第5A圖至第5K圖依序地繪示根據本發明之一實施例之依據製造晶片埋入式印刷電路板之方法之印刷電路板之製程示意 圖。
第6圖繪示根據本發明之另一實施例之製造晶片埋入式印刷電路板之方法之製程流程圖。
第7A圖至第7K圖依序地繪示根據本發明之另一實施例之依據製造晶片埋入式印刷電路板之方法之製造印刷電路板之製程示意圖。
本說明書和權利要求中所使用之術語和用語不應被解釋為一般或字典的含義，為了描述自己發明的最佳模式，基於本發明人能夠適當地定義術語概念的原則，而應該被理解為達成本發明的技術理念之意義與概念。
整篇說明書當中，除非有相反之明確描述，用語「包括(comprise)」與其變化應被理解為意指包括所述元件，而非排除其他元件。此外，本說明書所述之術語「模組」、與「單元」意指處理至少一功能與操作之單元，並可藉由硬體元件或軟體元件以及其之結合而實行。
本發明之實施例將參照附圖做詳細地描述。
第2圖係繪示根據本發明之一實施例之晶片埋入式印刷電路板之結構。
參閱第2圖，根據本發明之一實施例之晶片埋入式印刷電路板係包括基底基材303、電子元件302與散熱體301。
基底基材303包括在其中之預定的電路圖案304。基底基材303可具有單層結構或多層結構。
電子元件302可電性連接於電路圖案304，且可埋入基底基材303中，如此電子元件302之一表面係從基底基材303之上表面曝露出來。此處，電子元件302可以是半導體晶片、積體電路晶片或相似者。
散熱體301可設置於電子元件302所曝露出之表面，且消散由電子元件302所產生的熱至外部。
此處，基底基材303可更包括導孔結構(導孔結構係整體地連接於電路圖案304，故並沒有標示符號)，導孔結構連接於電路圖案304，且基底基材303更包括球型焊墊301p，其形成於基底基材303之上表面之上並連接於導孔結構，且用以與另外的印刷電路板或半導體封裝電性連接。
並且，散熱體301可由具有優異的導熱性與導電性之材料所製成。
此處，可使用銅(Cu)、鋁(Al)、或其合金(alloy)作為散熱體301之材料。
並且，散熱體301可由具有優異的散熱性質之金屬(例如鋁)所製成，且球型焊墊301p可由金屬(例如銅、金、鉑、或相似者)所組成，此金屬不同於散熱體301之金屬，且具有優異的導電性。
此處，散熱體301可由鋁所組成，且球型焊墊301p 可由銅、金、和鉑其中之任一金屬所組成。
並且，基底基材303可更包括電路保護絕緣材料(circuit protecting insulating material)305形成於電路圖案304之間，電路保護絕緣材料305曝露於基底基材303之一表面，此表面相對於基底基材303之上設置有散熱體301之表面。
此處，可利用抗焊劑(solder resist)作為電路保護絕緣材料305。
第3圖係繪示根據本發明之一實施例之使用晶片埋入式印刷電路板之半導體封裝結構之示意圖。
參閱第3圖，根據本發明之一實施例之使用晶片埋入式印刷電路板之半導體封裝，包括下半導體封裝320與上半導體封裝310。
下半導體封裝320係設置於半導體封裝之下部分中作為基底，其中半導體封裝具有堆疊式封裝層疊結構。
上半導體封裝310係堆疊於下半導體封裝320之上，以與下半導體封裝320一同建構具有堆疊式封裝層疊結構之整體的積體半導體封裝(integrated semiconductor package)。
此處，下半導體封裝320包括基底基材303、電子元件302以及散熱體301，基底基材303包括預定電路圖案304形成於其中，電子元件302電性連接於電路圖案304且埋入基底基材303之中，如此電子元件302之一表面係曝露於基底基材303之上表面，散熱體301設置於曝露電子元件302的表面上，以消 散由電子元件302所產生的熱至外部。
此處，基底基材303可更包括導孔結構(導孔結構係整體地連接於電路圖案304，但並未標示符號)，連接於電路圖案304，且基底基材303更包括球型焊墊301p形成於基底基材303之上表面並連接於導孔結構，且作為另外的印刷電路板或半導體封裝之電性連結。
並且，散熱體301可由具優異的導熱性與導電性之材料製成。
此處，可利用銅、鋁、或其合金作為散熱體301之材料。
而且，散熱體301可由具有優異的散熱性質之金屬(例如鋁)製成，且球型焊墊301p可由金屬(例如銅、金、鉑、或相似者)所製成，此金屬不同於散熱體301所使用之金屬，且具有優異的導電性。
此處，散熱體301可由鋁所製成，且球型焊墊301p可由銅、金、和鉑其中之任一金屬所製成。
並且，基底基材303可更包括電路保護絕緣材料305形成於電路圖案304之間，電路保護絕緣材料305曝露於基底基材303之一表面，此表面係相對於基底基材303上方設置有散熱體301之表面。
此處，可利用抗焊劑作為電路保護絕緣材料305。
在第3圖中，分別地，標號311表示基材，標號312 表示電子元件，以及標號313表示封裝體(molding member)。
在下文中，將描述根據本發明之一實施例的製造晶片埋入式印刷電路板之製程。
第4圖係為根據本發明之一實施例，繪示製造晶片埋入式印刷電路板之製程的流程圖。第5A圖至第5K圖係根據本發明之一實施例，依序地繪示依據晶片埋入式印刷電路板製造方法之製程的示意圖。
參閱第4圖以及第5A圖至第5K圖，根據本發明之一實施例之晶片埋入式印刷電路板的製造方法，首先，將電子元件302結合於散熱體301之一表面(步驟S401、第5A圖、和第5B圖)。此處，為了結合電子元件302，可使用黏著劑(adhesive)、樹脂(resin)、或相似者。
當完成電子元件302之結合時，先將絕緣材料塗佈於結合電子元件302的散熱體301，以形成絕緣層303(此處，在基材製造完成之後，絕緣層在製造過程中形成基底基材，因此絕緣層與基底基材標示為相同標號303)，如此電子元件302被埋入(buried)，且此後在絕緣層303之中形成導孔303h，而使得電子元件302與散熱體301經由導孔而曝露(步驟S402、第5C圖)。
爾後，將導電材料填充於導孔303h，且形成電性連接於導孔303h(例如電性連接於電子元件302)之第一電路圖案304(步驟S403、第5D圖)。
此後，形成絕緣層303、形成導孔303h與填充導孔 並形成電路圖案304之步驟係重複地以堆疊之方式執行(步驟S404、第5E圖至第5J圖)。
換言之，如第5E圖所繪示，第二次地將絕緣材料塗佈於絕緣層303與形成於其上之第一電路圖案304，以堆疊之方式形成絕緣層303。並且如第5F圖所繪示，在絕緣層303之中形成導孔303h(由於是相同之絕緣層故以相同之標號表示)，而使得第一電路圖案304經由導孔而曝露。
此後，如第5G圖中所繪示，在導孔303h中填充導電材料，並同時形成第二電路圖案304(由於係與第一電路圖案連接為一電路圖案，故以相同標號表示)。
此後，如第5H圖所示，第三次地將絕緣材料塗佈於絕緣層303，與包括形成於其中之第二電路圖案304，以堆疊之形式形成絕緣層303，使得第二電路圖案埋入其中。並且此後，如第5I圖中所繪示，在堆疊的絕緣層303中形成導孔303h，而經由導孔303h曝露出第二電路圖案304。
此後，如第5J圖所示，將導電材料塗佈於導孔303h，並同時形成第三電路圖案304。
此處，根據製造基材之說明，在本發明之一實施例中係重複地執行形成絕緣層、形成導孔與填充導孔且形成電路圖案之製程步驟。為了方便起見，假定重複地執行上述製程三次。
當完成第三電路圖案304，如第5K圖中所繪示，蝕刻散熱體301，以形成散熱圖案(例如：散熱體301直接與電子元 件302接觸的部分)對應於電子元件302與導孔303h，以及形成球型焊墊301p(步驟S405)。此處，若散熱圖案與球型焊墊301p由相同材料所製成，則同時地圖案化散熱圖案與球型焊墊301p，若散熱圖案與球型焊墊301p由不同的材料所製成，則球型焊墊301p係與散熱圖案分開圖案化。
此處，較佳地，方法可更包括一步驟(S406)，使用電路保護絕緣材料305於絕緣層303曝露的表面，以保護電路圖案304。此處，可利用抗焊劑作為電路保護絕緣材料305。
此處，塗佈電路保護絕緣材料305之製程以及形成散熱圖案與球型焊墊301p之製程可同時執行，或者可先執行使用電路保護絕緣材料305之製程。
並且，可使用熱固性樹脂(thermosetting resin)作為用於形成絕緣層303之絕緣材料。
此處，熱固性樹脂包括環氧樹脂(epoxy resin)、氨基樹脂(amino resin)、酚樹脂(phenol resin)、尿素樹脂(urea resin)、三聚氰胺樹脂(melamine resin)、不飽和聚酯樹脂(unsaturated polyester resin)、聚氨酯樹脂(polyurethane resin)、聚醯亞胺樹脂(polyimide resin)、或類似者。
並且，可使用乾蝕刻(dry etching)形成導孔303h。
此處，可使用準分子雷測(excimer laser)或基於二氧化碳雷射之製程方法進行乾蝕刻。
並且，可使用金、鋁、銅、或其相似者作為導電材 料，以用於填充導孔303h並形成電路圖案304。
並且，為了以導電材料填充導孔303h並形成電路圖案304，可使用電解電鍍法(electrolytic plating method)與利用光罩(mask)之光微影技術(photolithography)。
並且，可使用具有優異的導熱性與導電性之材料，以形成散熱體301。
此處，可利用銅、鋁、或其合金作為散熱體301之材料。
並且，散熱體301可利用具有優異的散熱性質之金屬(例如鋁)所製成，且球型焊墊301p可由金屬(例如銅、金、鉑、或類似者)所製成，此金屬不同於散熱體301之金屬，並具有優異的導電性。
在此例中，散熱體301可由鋁所製成，且球型焊墊301p可由銅、金、和鉑其中之任一金屬所製成。
第6圖係為根據本發明之另一實施例，繪示製造晶片埋入式印刷電路板之製程的流程圖。第7A圖至第7K圖係根據本發明之另一實施例，依序地繪示依據晶片埋入式印刷電路板製造方法之製程的示意圖。
參閱第6圖，根據本發明另一實施例之晶片埋入式印刷電路板的製造方法，首先，製備基底基材303(在製造基材之製程中對應於絕緣層303，故與絕緣層303標示為相同標號)基底基材303具有形成於其中之預定電路圖案304。此處，製備基 底基材303與形成於其中之預定電路圖案304之製程將參照第7A圖至第7H圖進行詳細地描述。
首先，形成具有預定絕緣材料的第一絕緣層303，且形成第一導孔303h於第一絕緣層303中(步驟S601)。
接著，如第7B圖中所示，以導電材料填充導孔303h，且同時在絕緣層303之表面上形成電性連接於導孔之第一電路圖案304(步驟S602)。
此後，形成絕緣層303、形成導孔303h與填充導孔並形成電路圖案304之步驟係以堆疊之方式重複地執行多次(步驟S603，第7C圖至第7H圖)。
換言之，如第7C圖所繪示，第二次地將絕緣材料施用於絕緣層303與形成於其上之第一電路圖案304，以堆疊之方式形成絕緣層303。並且如第7D圖所繪示，在絕緣層303之中形成導孔303h(由於是相同之絕緣層故以相同之標號表示)，而使得第一電路圖案304經由導孔而曝露。
此後，如第7E圖中所繪示，在導孔303h中填充導電材料，並同時形成第二電路圖案304(由於係與第一電路圖案連接為一電路圖案，故以相同標號表示)。
此後，如第7F圖所示，第三次地將絕緣材料施用於絕緣層303與包括形成於其中之第二電路圖案304，以堆疊之形式形成絕緣層303，使得第二電路圖案304埋入其中。並且此後，如第7G圖中所繪示，在堆疊的絕緣層303中形成導孔303h，而 經由導孔曝露出第二電路圖案304。
此後，如第7H圖所示，將導電材料填充於導孔303h，並同時地形成第三電路圖案304。
此處，如上述之案例(第5A圖至第5K圖)，根據製造基材之說明，在本發明之實施例中係將形成絕緣層、形成導孔、與填充導孔且形成電路圖案之製程步驟重複地執行多次。為了方便起見，假定重複地執行上述製程三次。
當完成第三電路圖案304之形成，部分移除基底基材303之上部分，以形成凹槽而曝露出電路圖案304之一部分。換言之，如第7I圖中所示，具有預定尺寸之凹槽303c係形成於絕緣層303之一表面中，使電子元件可插入其中(步驟S604)。
此後，如第7J圖中所示，在凹槽303c中放置電子元件302，使得電子元件302電性連接於電路圖案304，以及此後，在絕緣層303之整個表面上形成散熱體301(例如，在基底基材303之上表面以及電子元件302曝露之表面之上)(步驟S605)。
此後，如第7K圖中所示，蝕刻散熱體301，以形成散熱圖案(例如：散熱體301直接與電子元件302接觸的部分)對應於電子元件302與導孔303h，以及形成球型焊墊301p(步驟S606)。此處，若散熱圖案與球型焊墊301p由相同材料所製成，則同時地圖案化散熱圖案與球型焊墊301p，若散熱圖案與球型焊墊301p由不同的材料所製成，則球型焊墊301p係與散熱圖案分開圖案化。
此處，較佳地，方法可更包括一步驟(S607)，使用電路保護絕緣材料305於絕緣層303曝露的表面，以保護電路圖案304。
此處，可利用抗焊劑作為電路保護絕緣材料305。
並且，可使用熱固性樹脂作為用於形成絕緣層303之絕緣材料。
此處，熱固性樹脂包括環氧樹脂、氨基樹脂、酚樹脂、尿素樹脂、三聚氰胺樹脂、不飽和聚酯樹脂、聚氨酯樹脂、聚醯亞胺樹脂、或類似者。
並且，可使用乾蝕刻形成導孔303h。
此處，可使用準分子雷測或基於二氧化碳雷射之製程方法進行乾蝕刻。
並且，可使用金、鋁、銅、或其相似者作為導電材料，以用於填充導孔303h並形成電路圖案304。
並且，為了以導電材料填充導孔303h並形成電路圖案304，可使用電解電鍍法與利用光罩之光微影技術。
並且，可使用具有優異的導熱性與導電性之材料，以形成散熱體301。
此處，可利用銅、鋁、或其合金作為散熱體301之材料。
並且，散熱體301可利用具有優異的散熱性質之金屬(例如鋁)所製成，且球型焊墊301p可由金屬(例如銅、金、鉑、 或類似者)所製成，該金屬不同於散熱體301之金屬，並具有優異的導電性。
在此例中，散熱體301可由鋁所製成，且球型焊墊301p可由銅、金、和鉑其中之任一金屬所製成。
根據本發明之實施例，在印刷電路板與半導體封裝之案例中，由於電子元件係埋入於印刷電路板中，使得電子元件之一表面曝露於印刷電路板之外，以及設置散熱體，使散熱體直接接觸於埋入式電子元件之曝露表面，以有效地消散由電子元件產生的熱至外部。
並且，由於使用具有前述結構之半導體埋入式印刷電路板作為下半導體封裝，且於下半導體封裝之上堆疊上半導體封裝，以形成整體的單積體半導體封裝(integrated single semiconductor package)、可製造具有優異的散熱功能之半導體封裝，以增加產品之可靠度。
雖然已揭露本發明之實施例以說明用途，本發明所屬技術領域中之通常知識者，在不脫離所附之申請專利範圍中所揭露的本發明之精神和範圍內，當可作各種之修改、添加與替換。於是，該些修改、添加與替換應屬於本發明之範疇內。
301‧‧‧散熱體
302‧‧‧電子元件
303‧‧‧基底基材
304‧‧‧電路圖案
301p‧‧‧球型焊墊
305‧‧‧電路保護絕緣材料

Claims (23)

  1. 一種晶片埋入式印刷電路板，包括：一基底基材，包括預定的複數個電路圖案形成於其中；一電子元件，電性連接於該些電路圖案，且埋入該基底基材之中，使得該電子元件之一表面係曝露於該基底基材之一上表面；以及一散熱體，設置於該電子元件之一曝露表面上，以消散由該電子元件所產生的熱至外部。
  2. 如申請專利範圍第1項所述之晶片埋入式印刷電路板，其中該基底基材更包括一導孔結構，該導孔結構形成於該基底基材之中並連接該些電路圖案，且該基底基材更包括一球型焊墊，該球型焊墊形成於該基底基材之一上表面上，且連接於該導孔結構，並作為一另外的印刷電路板或一半導體封裝之電性連接。
  3. 如申請專利範圍第1項所述之晶片埋入式印刷電路板，其中該散熱體係由具有優異的導熱性及導電性之材料所組成。
  4. 如申請專利範圍第3項所述之晶片埋入式印刷電路板，其中該散熱體係由銅、鋁、或其合金所組成。
  5. 如申請專利範圍第2項所述之晶片埋入式印刷電路板，其中該散熱體係由具有優異的散熱性質之金屬所組成，且該球型焊墊係由與該散熱體不同之金屬所組成，並具有優異的導電性。
  6. 如申請專利範圍第5項所述之晶片埋入式印刷電路板，其中該散熱體係由鋁所組成，該球型焊墊係由銅、金、鉑其中之任 一金屬所組成。
  7. 如申請專利範圍第1項所述之晶片埋入式印刷電路板，其中該基底基材更包括一電路保護絕緣材料，該電路保護絕緣材料形成於該些電路圖案之間，並曝露於該基底基材上與設置有該散熱體之一表面相對的表面。
  8. 如申請專利範圍第7項所述之晶片埋入式印刷電路板，其中該電路保護絕緣材料係為抗焊劑。
  9. 一種使用晶片埋入式印刷電路板之半導體封裝，該半導體封裝包括：一下半導體封裝，設置於一半導體封裝之一下部分中以作為基底，該半導體封裝具有堆疊式封裝層疊結構；以及一上半導體封裝，堆疊於該下半導體封裝之上，以與該下半導體封裝一起構建具有堆疊式封裝層疊結構之一整體的單積體半導體封裝，其中該下半導體封裝包括：一基底基材，包括預定的複數個電路圖案形成於其中；一電子元件，電性連接於該些電路圖案且埋入於該基底基材中，使得該電子元件之一表面係曝露於該基底基材之一上表面；以及一散熱體，設置於該電子元件之一曝露表面上，以消散從該電子元件所產生的熱至外部。
  10. 如申請專利範圍第9項所述之半導體封裝，其中該基底 基材更包括一導孔結構，該導孔結構形成於該基底基材之中並連接該些電路圖案，且該基底基材更包括一球型焊墊，該球型焊墊形成於該基底基材之一上表面上，且連接於該導孔結構，並作為一另外的印刷電路板或一半導體封裝之電性連接。
  11. 如申請專利範圍第9項所述之半導體封裝，其中該散熱體係由具有優異的導熱性及導電性之材料所組成。
  12. 如申請專利範圍第11項所述之半導體封裝，其中該散熱體係由銅、鋁、或其合金所組成。
  13. 如申請專利範圍第10項所述之半導體封裝，其中該散熱體係由具有優異的散熱性質之金屬所組成，且該球型焊墊係由與該散熱體不同之金屬所組成，並具有優異的導電性。
  14. 如申請專利範圍第13項所述之半導體封裝，其中該散熱體係由鋁所組成，且該球型焊墊係由銅、金、鉑其中之任一金屬所組成。
  15. 如申請專利範圍第9項所述之半導體封裝，其中該基底基材更高括一電路保護絕緣材料，該電路保護絕緣材料形成於該些電路圖案之間，並曝露於該基底基材上與設置有該散熱體之一表面相對的表面
  16. 如申請專利範圍第15項所述之半導體封裝，其中該電路保護絕緣材料係為抗焊劑(solder resist)。
  17. 一種晶片埋入式印刷電路板之製造方法，該製造方法包括： 將一電子元件結合至一散熱體之一表面；形成一絕緣層於該散熱體之一表面上，以埋入該電子元件；形成複數個電路圖案，該些電路圖案在該絕緣層之中電性連接該電子元件；以及蝕刻該散熱體，以形成接觸於該電子元件之一散熱圖案。
  18. 如申請專利範圍第17項所述之製造方法，其中形成該絕緣層與該些電路圖案之步驟係執行複數次。
  19. 如申請專利範圍第17項所述之製造方法，更包括：形成一球型焊墊，該球型焊墊電性連接於該絕緣層上的該些電路圖案之至少一部分。
  20. 如申請專利範圍第19項所述之製造方法，其中當該散熱圖案形成時，同時形成該球型焊墊。
  21. 一種晶片埋入式印刷電路板之製造方法，該製造方法包括：製備一基底基材，該基底基材具有預定的複數個電路圖案形成於其中；部分移除該基底基材之一上部分，以形成一凹槽，經由該凹槽曝露該些電路圖案之一部分；將一電子元件插入該凹槽中，使得該電子元件電性連接於該些電路圖案；形成一散熱體於該基底基材之一上表面上與該電子元件之一曝露表面上；以及 蝕刻該散熱體，以在該電子元件之該曝露表面之上形成一散熱圖案。
  22. 如申請專利範圍第21項所述之製造方法，更包括：形成一球型焊墊，該球型焊墊電性連接於該基底基材上之該些電路圖案的至少一部分。
  23. 如申請專利範圍第22項所述之製造方法，其中當形成該散熱圖案時，同時形成該球型焊墊。
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