TW201414026A - 壓電元件及其使用方法 - Google Patents
壓電元件及其使用方法 Download PDFInfo
- Publication number
- TW201414026A TW201414026A TW102133380A TW102133380A TW201414026A TW 201414026 A TW201414026 A TW 201414026A TW 102133380 A TW102133380 A TW 102133380A TW 102133380 A TW102133380 A TW 102133380A TW 201414026 A TW201414026 A TW 201414026A
- Authority
- TW
- Taiwan
- Prior art keywords
- piezoelectric
- electric field
- voltage
- film
- circuit
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 57
- 230000005684 electric field Effects 0.000 claims abstract description 148
- 230000010287 polarization Effects 0.000 claims abstract description 108
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000001514 detection method Methods 0.000 claims description 33
- 230000000694 effects Effects 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 10
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims 1
- 230000009471 action Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 142
- 238000012545 processing Methods 0.000 description 46
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 41
- 239000000758 substrate Substances 0.000 description 36
- 230000008569 process Effects 0.000 description 26
- 239000010955 niobium Substances 0.000 description 23
- 230000028161 membrane depolarization Effects 0.000 description 21
- 238000002474 experimental method Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 239000012467 final product Substances 0.000 description 11
- 230000006866 deterioration Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 7
- 238000013461 design Methods 0.000 description 7
- 238000006731 degradation reaction Methods 0.000 description 6
- 230000007774 longterm Effects 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 238000004380 ashing Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 239000011651 chromium Substances 0.000 description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000001947 vapour-phase growth Methods 0.000 description 3
- -1 Ru (ruthenium) Chemical class 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000004549 pulsed laser deposition Methods 0.000 description 2
- 230000002336 repolarization Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000877463 Lanio Species 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910004121 SrRuO Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002999 depolarising effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/802—Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/101—Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Gyroscopes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012205691A JP5756786B2 (ja) | 2012-09-19 | 2012-09-19 | 圧電デバイス及びその使用方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201414026A true TW201414026A (zh) | 2014-04-01 |
Family
ID=50341229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102133380A TW201414026A (zh) | 2012-09-19 | 2013-09-14 | 壓電元件及其使用方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9437801B2 (enExample) |
| EP (1) | EP2899766B1 (enExample) |
| JP (1) | JP5756786B2 (enExample) |
| TW (1) | TW201414026A (enExample) |
| WO (1) | WO2014045914A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112350612A (zh) * | 2019-08-07 | 2021-02-09 | 台湾积体电路制造股份有限公司 | 用于恢复或防止压电装置的劣化装置性能的方法及其系统 |
| TWI725528B (zh) * | 2018-09-20 | 2021-04-21 | 台灣積體電路製造股份有限公司 | 壓電元件、恢復壓電元件的劣化元件性能的方法及系統 |
| TWI860842B (zh) * | 2022-09-15 | 2024-11-01 | 樂聲電子系統股份有限公司 | 平面壓電振動模組的製造方法 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012111972A1 (de) * | 2012-12-07 | 2014-06-12 | Epcos Ag | Verfahren zur Herstellung eines elektronischen Bauteils |
| JP6258241B2 (ja) * | 2015-02-27 | 2018-01-10 | 富士フイルム株式会社 | 圧電アクチュエータ |
| JP6699662B2 (ja) * | 2015-05-25 | 2020-05-27 | コニカミノルタ株式会社 | 圧電薄膜、圧電アクチュエータ、インクジェットヘッド、インクジェットプリンタおよび圧電アクチュエータの製造方法 |
| JP2017094615A (ja) | 2015-11-25 | 2017-06-01 | 株式会社リコー | 液体吐出ヘッド、液体吐出ユニット及び液体を吐出する装置 |
| KR101823628B1 (ko) * | 2016-11-17 | 2018-01-31 | 한국과학기술원 | 압전체 편극 장치 및 이를 이용한 편극 방법 |
| EP3367450A1 (en) * | 2017-02-22 | 2018-08-29 | Koninklijke Philips N.V. | Actuator and sensor device based on electroactive polymer |
| JP6972768B2 (ja) * | 2017-08-22 | 2021-11-24 | 株式会社デンソー | 可変焦点ミラーシステム |
| WO2019054336A1 (ja) * | 2017-09-12 | 2019-03-21 | 日本碍子株式会社 | 圧電素子の製造方法 |
| US11439015B2 (en) * | 2019-10-10 | 2022-09-06 | International Business Machines Corporation | Surface mount device placement to control a signal path in a printed circuit board |
| JP7316926B2 (ja) * | 2019-12-05 | 2023-07-28 | 富士フイルム株式会社 | 圧電ｍｅｍｓデバイス、製造方法および駆動方法 |
| JP7316927B2 (ja) * | 2019-12-05 | 2023-07-28 | 富士フイルム株式会社 | 圧電ｍｅｍｓデバイス、製造方法および駆動方法 |
| JP2022040711A (ja) | 2020-08-31 | 2022-03-11 | 株式会社ジャパンディスプレイ | 圧力センサ |
| JP2023038732A (ja) * | 2021-09-07 | 2023-03-17 | 株式会社東芝 | 磁気ディスク装置及びマイクロアクチュエータのバイアス電圧及び駆動電圧の切り替え方法 |
| JP2025042311A (ja) | 2023-09-14 | 2025-03-27 | 富士フイルム株式会社 | 圧電積層体及び圧電素子 |
| JP2025042312A (ja) | 2023-09-14 | 2025-03-27 | 富士フイルム株式会社 | 圧電積層体及び圧電素子 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482309A (ja) | 1990-07-24 | 1992-03-16 | Murata Mfg Co Ltd | 圧電体の分極方法 |
| JPH082309A (ja) | 1994-06-20 | 1996-01-09 | Kyokuto Kaihatsu Kogyo Co Ltd | 貨物自動車における牽引装置 |
| JP3805837B2 (ja) * | 1996-08-12 | 2006-08-09 | トヨタ自動車株式会社 | 角速度検出装置 |
| DE60237587D1 (de) * | 2001-04-06 | 2010-10-21 | Ricoh Printing Sys Ltd | Tintenstrahlausstossvorrichtung |
| US7230597B2 (en) * | 2001-07-13 | 2007-06-12 | Tpo Hong Kong Holding Limited | Active matrix array devices |
| JP3788759B2 (ja) * | 2001-11-02 | 2006-06-21 | リコープリンティングシステムズ株式会社 | インクジェットプリンタ用ライン型記録ヘッド |
| JP4288908B2 (ja) * | 2002-07-26 | 2009-07-01 | リコープリンティングシステムズ株式会社 | インクジェット記録装置 |
| JP4487536B2 (ja) * | 2002-11-15 | 2010-06-23 | パナソニック株式会社 | 圧電体アクチュエータの駆動方法および圧電体アクチュエータ並びにこれを用いたディスク記録再生装置 |
| US7141911B2 (en) * | 2002-11-15 | 2006-11-28 | Matsushita Electric Industrial Co., Ltd. | Driving method of piezoelectric actuator, piezoelectric actuator, and disk recording and reproducing apparatus using the same |
| JP4403707B2 (ja) * | 2003-03-25 | 2010-01-27 | リコープリンティングシステムズ株式会社 | インク滴吐出状態検知装置及びインクジェット記録装置 |
| JP2004338326A (ja) * | 2003-05-19 | 2004-12-02 | Kyocera Corp | インクジェット記録装置およびその制御方法 |
| JP2005340631A (ja) | 2004-05-28 | 2005-12-08 | Sony Corp | 圧電素子部品及び電子装置 |
| JP2007040879A (ja) | 2005-08-04 | 2007-02-15 | Nec Tokin Corp | 圧電振動ジャイロ用振動子の分極方法 |
| WO2009157189A1 (ja) * | 2008-06-27 | 2009-12-30 | パナソニック株式会社 | 圧電体素子とその製造方法 |
| JP5497394B2 (ja) | 2009-09-30 | 2014-05-21 | 富士フイルム株式会社 | 圧電アクチュエータとその駆動方法、液体吐出装置、圧電型超音波振動子 |
| JP5506031B2 (ja) | 2009-12-28 | 2014-05-28 | 富士フイルム株式会社 | アクチュエータ素子の駆動方法、及びデバイス検査方法 |
| JP5506035B2 (ja) * | 2010-02-23 | 2014-05-28 | 富士フイルム株式会社 | アクチュエータの製造方法 |
| JP4775502B2 (ja) | 2010-10-28 | 2011-09-21 | パナソニック株式会社 | 角速度センサ素子 |
-
2012
- 2012-09-19 JP JP2012205691A patent/JP5756786B2/ja not_active Expired - Fee Related
-
2013
- 2013-09-09 WO PCT/JP2013/074215 patent/WO2014045914A1/ja not_active Ceased
- 2013-09-09 EP EP13840021.3A patent/EP2899766B1/en not_active Not-in-force
- 2013-09-14 TW TW102133380A patent/TW201414026A/zh unknown
-
2015
- 2015-03-18 US US14/661,114 patent/US9437801B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI725528B (zh) * | 2018-09-20 | 2021-04-21 | 台灣積體電路製造股份有限公司 | 壓電元件、恢復壓電元件的劣化元件性能的方法及系統 |
| CN112350612A (zh) * | 2019-08-07 | 2021-02-09 | 台湾积体电路制造股份有限公司 | 用于恢复或防止压电装置的劣化装置性能的方法及其系统 |
| TWI737025B (zh) * | 2019-08-07 | 2021-08-21 | 台灣積體電路製造股份有限公司 | 用於恢復或防止壓電裝置的劣化裝置性能的方法及其系統 |
| TWI860842B (zh) * | 2022-09-15 | 2024-11-01 | 樂聲電子系統股份有限公司 | 平面壓電振動模組的製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014045914A1 (ja) | 2014-03-27 |
| EP2899766A1 (en) | 2015-07-29 |
| JP5756786B2 (ja) | 2015-07-29 |
| US20150194591A1 (en) | 2015-07-09 |
| EP2899766B1 (en) | 2017-04-05 |
| JP2014060330A (ja) | 2014-04-03 |
| US9437801B2 (en) | 2016-09-06 |
| EP2899766A4 (en) | 2016-06-08 |
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