WO2014045914A1 - 圧電デバイス及びその使用方法 - Google Patents

圧電デバイス及びその使用方法 Download PDF

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Publication number
WO2014045914A1
WO2014045914A1 PCT/JP2013/074215 JP2013074215W WO2014045914A1 WO 2014045914 A1 WO2014045914 A1 WO 2014045914A1 JP 2013074215 W JP2013074215 W JP 2013074215W WO 2014045914 A1 WO2014045914 A1 WO 2014045914A1
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Prior art keywords
piezoelectric
electric field
voltage
film
polarization
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English (en)
French (fr)
Japanese (ja)
Inventor
藤井　隆満
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Fujifilm Corp
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Fujifilm Corp
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Priority to EP13840021.3A priority Critical patent/EP2899766B1/en
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Priority to US14/661,114 priority patent/US9437801B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/802—Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
    • H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/101—Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices

Definitions

  • the present invention relates to a piezoelectric device and a method of using the piezoelectric device, and more particularly, to a configuration of a device using a piezoelectric element such as a piezoelectric actuator, an acceleration sensor, and an angular velocity sensor that operates using a piezoelectric effect or an inverse piezoelectric effect, and the piezoelectric device.
  • the present invention relates to a method for maintaining the operation performance of the system.
  • Patent Document 1 discloses that in order to polarize a piezoelectric body used in a piezoelectric component, heating (aging) is performed in the manufacturing process of the piezoelectric component, and processing is performed at an applied voltage of 2 to 2.5 times the coercive electric field. (Claim 1 of Patent Document 1). Further, it is generally described that an applied voltage that is three times or more the coercive electric field is necessary as a condition for polarization treatment of the piezoelectric material (Patent Document 1, page 1, right column).
  • Patent Document 2 describes a polarization method of a vibrator for a piezoelectric vibration gyro. According to the document 2, it is proposed that a high electric field is applied between the electrodes and the polarization treatment is performed in the air (claims 2 and 3 of patent document 2).
  • Patent Document 3 describes that the temperature of polarization processing of piezoelectric element parts is performed at a temperature higher than the reflow temperature (Claim 1 of Patent Document 3).
  • Patent Document 4 proposes a piezoelectric actuator using a piezoelectric film having an asymmetric bipolar polarization-electric field curve (Pr-E hysteresis) polarization characteristic and a driving method thereof.
  • Pr-E hysteresis asymmetric bipolar polarization-electric field curve
  • the piezoelectric film is depolarized (depolarized) when a solder reflow process or the like is performed after device formation. For this reason, it has been necessary to proceed with process steps such as reflow at the lowest possible temperature to minimize deterioration of the characteristics of the piezoelectric body, or to perform polarization processing again after a high temperature process such as reflow.
  • the Nb-doped PZT film has a good piezoelectric constant without undergoing polarization treatment (in an unpolarized treatment state) (Patent Document 4).
  • This material does not easily depolarize even when heated, and thus has an advantage that the post-deposition process has no temperature limitation and is easy to handle.
  • Patent Document 4 proposes a driving method of an actuator that applies a driving voltage having an electric field strength sufficiently larger than the coercive electric field of the piezoelectric film. The drive is not described. Further, the relationship between sensor driving having asymmetric polarization characteristics and reflow is not described.
  • An object of the present invention is to provide a highly reliable piezoelectric device capable of ensuring stable and stable operation performance and a method of using the piezoelectric device.
  • the piezoelectric device is a piezoelectric device that operates using at least one of the piezoelectric effect and the inverse piezoelectric effect of a piezoelectric film, and is a bipolar polarization-electric field (Pr-E) of a piezoelectric material.
  • the hysteresis characteristic has a bias that is asymmetrical with respect to the axis of the zero electric field.
  • the first coercive electric field having the smaller absolute value is Ec1
  • the second coercive electric field having the larger absolute value is the second.
  • the coercive electric field is defined as Ec2 and the coercive field bias rate is defined as [(Ec2 + Ec1) / (Ec2-Ec1)] ⁇ 100 [%]
  • a piezoelectric film having a coercive field bias rate of 20% or more is used.
  • polarization processing by applying a high voltage is unnecessary, and even when depolarization occurs due to the usage environment or over time, the polarization state is recovered by applying a relatively low voltage. can do. Thereby, the performance of the device can be maintained / recovered, and stable operation performance can be ensured.
  • the bias rate of the piezoelectric film is 70% or more.
  • the polarization state recovery process (refresh process) can be performed with a lower voltage.
  • a driving circuit that supplies a driving voltage for driving the piezoelectric element unit to the piezoelectric element unit and a detection that detects a voltage signal obtained from the piezoelectric element unit A configuration including at least one of the circuits may be employed.
  • the actuator device includes a piezoelectric element that operates using the inverse piezoelectric effect and a drive circuit thereof.
  • the sensor device includes a piezoelectric element that operates using the piezoelectric effect and a detection circuit thereof.
  • a piezoelectric element unit that combines a driving piezoelectric element that operates using the inverse piezoelectric effect and a detecting piezoelectric element that operates using the piezoelectric effect, a driving circuit, and Some configurations include a detection circuit.
  • the refresh voltage application circuit may be incorporated in at least one of the drive circuit and the detection circuit.
  • an electronic circuit unit including at least one of a drive circuit and a detection circuit and a refresh voltage application circuit is configured as an integrated circuit. Can be.
  • the electronic circuit unit can be configured by ASIC (Application Specific Integrated Circuit).
  • ASIC Application Specific Integrated Circuit
  • the magnitude of the voltage supplied from the refresh voltage application circuit to the piezoelectric element portion is 5 V or less. preferable.
  • the refresh voltage is preferably 5 V or less, more preferably 3 V or less, and even more preferably 1.5 V or less.
  • the piezoelectric element portion has a laminated structure in which a first electrode, a piezoelectric film, and a second electrode are laminated.
  • the refresh voltage application circuit can be configured to apply a negative voltage to the second electrode when the first electrode is grounded.
  • the polarity of the applied voltage can be selected as appropriate.
  • a lower electrode corresponding to the first electrode
  • a piezoelectric film and an upper electrode (corresponding to the second electrode) are stacked on the substrate.
  • the lower electrode is grounded and a negative voltage is applied to the upper electrode to perform a refresh process (a process for restoring the polarization state).
  • the piezoelectric film may be a perovskite oxide.
  • the piezoelectric film has one or more perovskite oxides (inevitable) represented by the following general formula (P-1): An impurity may be included.).
  • X of the piezoelectric film is Nb and b3 is 0.05 or more and 0.3 or less.
  • X of the piezoelectric film is at least one metal element of Nb and Bi.
  • a in the general formula (P-1) of the piezoelectric film is preferably 1.1 or more.
  • the piezoelectric element portion uses a piezoelectric element for driving that operates using an inverse piezoelectric effect, and a piezoelectric effect.
  • a detection voltage element that operates as a refresh voltage when the detection voltage output from the detection piezoelectric element is lower than a reference value when the driving piezoelectric element is driven at a predetermined drive voltage.
  • a control means for applying a voltage to the piezoelectric element portion from the application circuit can be provided.
  • the method of using the piezoelectric device according to the fourteenth aspect has a bias that the bipolar polarization-electric field (Pr-E) hysteresis characteristic of the piezoelectric material is asymmetric when the axis of the zero electric field is used as a reference,
  • the first coercive electric field having the smaller absolute value is Ec1
  • the second coercive electric field having the larger absolute value is Ec2
  • the coercive field bias rate is [(Ec2 + Ec1) / (Ec2 ⁇ Ec1)] ⁇ 100 [%]
  • a piezoelectric film having a coercive electric field bias rate of 20% or more is used, and at least one of the piezoelectric effect and the inverse piezoelectric effect of the piezoelectric film is used.
  • 3 times By applying a voltage to the electric field strength of lower restoring the polarization state of the piezoelectric film.
  • the performance degradation of the piezoelectric device due to depolarization can be prevented, and stable performance can be secured while maintaining the operation performance of the device.
  • polarization processing by applying a high voltage is unnecessary, and polarization performance deterioration due to use environment or aging can be prevented and device performance can be maintained.
  • a highly stable and reliable piezoelectric device can be provided.
  • FIG. 1 is a diagram illustrating a configuration example of a piezoelectric device according to an embodiment of the present invention.
  • FIG. 2 is a diagram showing an example of the bipolar polarization-electric field hysteresis (Pr-E hysteresis) characteristic of the piezoelectric film.
  • FIG. 3 is a plan view of the manufactured gyro sensor. 4 is an enlarged sectional view taken along the line IV-IV in FIG.
  • FIG. 5 is a graph summarizing the results of the preliminary experiment.
  • FIG. 6 is a diagram showing Pr-E hysteresis characteristics of a conventional piezoelectric film (intrinsic PZT).
  • FIG. 7 is a flowchart showing a procedure of a manufacturing process of an electronic device using a conventional piezoelectric film (intrinsic PZT).
  • FIG. 8 is a flowchart showing a procedure of a manufacturing process of an electronic device using a conventional piezoelectric film (intrinsic PZT).
  • FIG. 9 is a diagram showing the Pr—E hysteresis characteristics of the piezoelectric film (Nb—PZT) of the present embodiment.
  • FIG. 10 is a flowchart showing a method for manufacturing a piezoelectric device and a method for using the same according to the present embodiment.
  • FIG. 11 is a chart summarizing the results obtained for Examples 1 and 2 and Comparative Examples 1 and 2.
  • FIG. 12 is a block diagram showing another embodiment of the present invention.
  • FIG. 1 is a diagram showing a configuration example of a piezoelectric device according to an embodiment of the present invention.
  • This piezoelectric device 10 corresponds to a sensor element unit 28 (corresponding to a “piezoelectric element unit”) in which driving piezoelectric elements 20 and 22 and a detecting piezoelectric element 26 are provided on a substrate 14 constituting a vibrating unit 12. ).
  • the piezoelectric device 10 includes an electronic circuit unit 30 that is electrically connected to the sensor element unit 28.
  • the piezoelectric device 10 can be configured as a sensor unit packaged (covered with a package member (not shown)) including the sensor element unit 28 and the electronic circuit unit 30.
  • the piezoelectric elements 20 and 22 for driving in the sensor element unit 28 operate using the inverse piezoelectric effect, and convert electrical signals (driving voltage) into mechanical stress.
  • the detecting piezoelectric element 26 operates using the piezoelectric effect, and converts mechanical stress into an electrical signal.
  • the electronic circuit unit 30 includes a drive circuit 32 that supplies a drive voltage to the drive piezoelectric elements 20 and 22, a detection circuit 34 that detects a voltage signal (detection voltage) obtained from the detection piezoelectric element 26, and A voltage for refresh processing (polarization recovery processing) for maintaining / recovering the polarization state of the piezoelectric elements 20, 22, and 26 in order to maintain the operation performance of the device (referred to as “refresh voltage” in this specification). And a refresh voltage application circuit 36 to be supplied.
  • the electronic circuit unit 30 can be composed of an integrated circuit typified by ASIC (Application Specific Specific Integrated Circuit).
  • ASIC Application Specific Specific Integrated Circuit
  • the drive circuit 32, the detection circuit 34, and the refresh voltage application circuit 36 are described as separate blocks.
  • a refresh voltage application function may be incorporated in the drive circuit 32, and the detection circuit It is also possible to incorporate a refresh voltage application function into 34.
  • the piezoelectric elements 20, 22, and 26 of the sensor element unit 28 are provided on a substrate 14 as a support layer, with a lower electrode 40 (corresponding to “first electrode”), a piezoelectric film 42, and an upper electrode 44 (“second electrode”). Corresponds to a stacked structure sequentially stacked in this order. Note that the thicknesses and ratios of the layers shown in FIG. 1 and other drawings are appropriately changed for convenience of explanation, and do not necessarily reflect actual thicknesses and ratios. Further, in this specification, in expressing the laminated structure, the direction away from the surface of the substrate 14 in the substrate thickness direction is expressed as “up”. In FIG.
  • the direction of gravity (in FIG. 1) This coincides with the vertical relationship when (downward) is the downward direction.
  • the posture of the substrate 14 can be tilted or reversed. Even when the stacking direction of the laminated structure depending on the posture of the substrate 14 does not necessarily coincide with the vertical direction based on the direction of gravity, in order to express the vertical relationship of the laminated structure without confusion, the surface of the substrate 14 is used as a reference. The direction away from the surface in the thickness direction is expressed as “up”. For example, even when the top and bottom of FIG. 1 are reversed, the lower electrode 40 is formed on the substrate 14 and the piezoelectric film 42 is stacked thereon.
  • the material of the substrate 14 is not particularly limited.
  • silicon (Si), silicon oxide, glass, stainless steel (SUS), yttrium stabilized zirconia (YSZ), alumina, sapphire, SiC, SrTiO 3, or the like is used.
  • a laminated substrate such as an SOI (Silicon on Insulator) substrate in which a SiO 2 film and a Si active layer are sequentially laminated on a silicon substrate may be used.
  • the composition of the lower electrode 40 and the upper electrode 44 is not particularly limited.
  • Au gold
  • Pt platinum
  • Ag silver
  • Ir iridium
  • Al aluminum
  • Mo molecular weight
  • Ru Ruthenium
  • TiN titanium nitride
  • the lower electrode 40 preferably includes a platinum group metal.
  • the structure which uses Ti, TiW, etc. as an adhesion layer is preferable, and the aspect formed by laminating
  • the upper electrode 44 is electrically connected to an ASIC (electronic circuit unit 30) and other electronic circuits (including a lead wiring pattern) using wire bonding, anisotropic conductive film (ACF), or the like. A connection is made. For this reason, it is desirable that the uppermost layer (outermost surface layer) of the upper electrode 44 be a material excellent in wire bonding properties.
  • a metal having a relatively low melting point is preferable.
  • a metal having a melting point of 1500 degrees or less is desirable, and for example, a configuration containing any of Al, Au, Ti, Cu, Cr, and Ni is preferable.
  • FIG. 1 shows a form in which each piezoelectric element 20, 22, 26 is separately processed in element units, and shows a configuration in which the lower electrode 40, the piezoelectric film 42, and the upper electrode 44 are separated in element units.
  • the lower electrode 40 and the piezoelectric film 42 may be configured so as not to be individually separated for each element.
  • a common lower electrode a common electrode layer that is not patterned
  • the piezoelectric film 42 can also be configured as an integral piezoelectric film that is not separately processed for the plurality of piezoelectric elements 20, 22, and 26 (see, for example, FIGS. 1 and 3 of Patent Document 2). .
  • the portion of the piezoelectric film 42 sandwiched between the upper electrode 44 and the lower electrode 40 facing the piezoelectric element is piezoelectrically active. It functions as a part.
  • the sensor element unit 28 is configured by combining two driving piezoelectric elements 20 and 22 and one detecting piezoelectric element 26, but the number of piezoelectric elements, driving and detecting elements are described.
  • the presence or absence of the combination, the number ratio thereof, the arrangement form of the piezoelectric elements, and the like are not limited to this example, and various designs are possible depending on the application and specifications of the device.
  • a tuning fork type gyro sensor (FIGS. 3 and 4), which will be described later, includes a plurality of vibration units 12 having the configuration shown in FIG.
  • a configuration in which a driving electrode is disposed at the center and detection electrodes are disposed on both sides thereof is also possible.
  • a piezoelectric sensor device in which the driving piezoelectric elements 20 and 22 and the driving circuit 32 are omitted from the configuration of FIG. 1 is also possible.
  • a form of a piezoelectric actuator device in which the detection piezoelectric element 26 and the detection circuit 34 are omitted from the configuration of FIG. 1 is also possible.
  • a piezoelectric film made of one or more perovskite oxides (which may contain inevitable impurities) represented by the following general formula (P-1) is used.
  • X is at least one metal element selected from the group of elements of group V and group VI. a> 0, b1> 0, b2> 0, b3 ⁇ 0.
  • a ⁇ 1.0 and b1 + b2 + b3 1.0, these numerical values may deviate from 1.0 within a range where a perovskite structure can be taken.
  • a may be less than 1.0, and there is a tolerance between the value of (b1 + b2 + b3) and 1.0. Can do.
  • PZT lead zirconate titanate
  • X may be any metal element of Group VA, Group VB, Group VIA, and Group VIB, and is at least one selected from the group consisting of V, Nb, Ta, Cr, Mo, W, and Bi. Is preferred.
  • b3 is preferably 0.05 or more and 0.3 or less.
  • a lead zirconate titanate (PZT) thin film doped with 12% of Nb by atomic composition percentage can be used.
  • a bulk piezoelectric body may be bonded to the substrate and polished.
  • the amount of displacement is small. Furthermore, there is a problem that the yield due to destruction during polishing is small.
  • the piezoelectric film 42 of the present embodiment is preferably a thin film having a thickness of 5 ⁇ m or less. Since the applied voltage can be lowered as the film thickness is thinner, the film thickness is more preferably 3 ⁇ m or less.
  • a piezoelectric thin film having a thickness of 2 ⁇ m formed by sputtering is used as the piezoelectric film, but the present invention is not limited to this.
  • the film thickness of the piezoelectric film can be 1 ⁇ m to 1.5 ⁇ m.
  • a vapor phase growth method As a method for forming the piezoelectric film 42, a vapor phase growth method is preferable. For example, various methods such as ion plating, MOCVD (metal organic chemical vapor deposition), and PLD (pulse laser deposition) can be applied in addition to sputtering. It is also conceivable to use a method other than the vapor phase growth method (for example, a sol-gel method).
  • the piezoelectric film 42 may be referred to as an “Nb-doped PZT film”.
  • FIG. 2 shows the bipolar polarization-electric field hysteresis (Pr-E hysteresis) characteristics of the piezoelectric film 42.
  • the horizontal axis represents drive voltage (electric field)
  • the vertical axis represents polarization. Since the drive voltage on the horizontal axis is expressed by the product of the thickness of the piezoelectric film in the voltage application direction and the electric field, the value of the electric field is obtained by dividing the value of the drive voltage by the thickness of the piezoelectric body.
  • V1 is the product of the coercive electric field on the positive electric field side and the thickness in the voltage application direction of the piezoelectric film
  • V2 is the coercive electric field on the negative electric field side and the voltage application direction of the piezoelectric film. Is the product of the thickness of
  • the Nb-doped PZT film has coercive electric field points on the negative electric field side and the positive electric field side, respectively, and is asymmetric (positive electric field) with respect to the y axis (position of zero electric field) indicating remanent polarization. Pr-E hysteresis characteristics biased to the side).
  • the coercive electric field Ec1 on the negative electric field side and the coercive electric field Ec2 on the positive electric field side have a relationship of
  • the coercive electric field Ec2 is large when a positive electric field is applied, so that it is difficult to be polarized, and when a negative electric field is applied, the absolute value of the coercive electric field Ec1 Because the value is small, it is easily polarized.
  • a large piezoelectric performance can be obtained by driving by applying an electric field having a polarity with a smaller absolute value of the coercive electric field value (in the case of FIG. 2, driving by a negative electric field).
  • the piezoelectric device 10 using a piezoelectric material having a biased PE hysteresis characteristic as shown in FIG. 2 operates the piezoelectric element within a range of a value smaller than the coercive electric field (Ec1) having a smaller absolute value.
  • bias rate of Pr-E hysteresis is defined by the following [Formula 1]
  • the bias rate of PE hysteresis shown in FIG. 2 is about 75%.
  • the deviation rate is the absolute value of the value obtained by [Equation 1].
  • the driving voltage is in the opposite direction to that when the Pr-E hysteresis characteristic is biased toward the negative field.
  • the bias rate of the Pr-E hysteresis has a correlation with the Nb doping amount (that is, the doping amount of the “X” element in the general formula (P-1)) in the piezoelectric film.
  • the bias rate increases as the doping amount of elements such as Nb and Bi increases. Also, the bias rate tends to increase as the amount of “Pb” in the general formula (P-1) increases.
  • the value of “a” is preferably 1.1 or more and Pb excess.
  • the upper limit of the Nb amount in the piezoelectric material is determined from the viewpoint of whether or not a piezoelectric film suitable for practical use can be formed. In general, increasing the doping amount of Nb improves the piezoelectric performance, but if the doping amount of Nb increases excessively, cracks tend to occur due to stress. Since cracks are unlikely to occur if the film thickness is small, the doping amount of Nb is determined depending on the film thickness of the piezoelectric film actually used.
  • the film thickness of the piezoelectric film is approximately 1 ⁇ m to 5 ⁇ m, and the upper limit of the Nb doping amount is approximately 20 at% ( Atomic composition percentage; at%). That is, the Nb doping amount of the piezoelectric film 42 is preferably 6 at% or more and 20 at% or less.
  • a lower electrode was formed on an SOI wafer as the substrate 14, and PZT doped with 12% Nb (Nb-doped PZT) was formed to a thickness of 2 ⁇ m on the lower electrode. Further, an upper electrode was formed on the Nb-doped PZT film and processed into a target device shape by using a semiconductor processing process such as dry etching, and an angular velocity sensor element (gyro sensor) for preliminary experiments was manufactured.
  • a semiconductor processing process such as dry etching
  • FIG. 3 is a plan view of the gyro sensor produced for the preliminary experiment
  • FIG. 4 is an enlarged sectional view taken along the line IV-IV in FIG.
  • This gyro sensor has the same structure as that disclosed in JP 2011-59125 A.
  • 3 and 4 are drawings that incorporate FIGS. 1 and 2 in the publication, and the same reference numerals as those in the publication are used for the reference numerals in the drawings.
  • Reference numeral 1 denotes a substrate
  • 2 denotes a vibrating portion
  • 3 denotes a fixing portion that supports the vibrating portion 2.
  • 4 is a lower electrode
  • 5 is a piezoelectric body
  • 6 is a drive electrode
  • 7 is a detection electrode
  • 8 is a protective film
  • 9 is connected to an external electric circuit (not shown in FIG. 3, corresponding to the electronic circuit unit 30 in FIG. 1). This is a connection electrode.
  • 3 correspond to the substrate 14, the vibration part 12, the lower electrode 40, and the piezoelectric film 42 in FIG. 1, respectively. 3 corresponds to the upper electrodes of the drive piezoelectric elements 20 and 22 in FIG. 1, and the detection electrode 7 in FIG. 3 corresponds to the upper electrode of the detection piezoelectric element 26 in FIG. Yes.
  • this gyro sensor includes a pair of columnar vibrating portions 2 and a fixing portion 3 that supports the vibrating portion 2. Two drive electrodes 6 and one detection electrode 7 are formed on the upper surface of 2.
  • the vibrating portion 2 By applying an AC voltage to the two drive electrodes 6 of each vibration part 2, it can be bent at a natural frequency. By devising such as shifting the phase of voltage application to the two drive electrodes 6 in one vibrating portion 2 by 180 degrees, the vibrating portion 2 can be excited in the left-right direction on the paper surface of FIG.
  • the two vibrating parts 2 are not vibrated in a substantially parallel state, but are vibrated so as to be closed or opened.
  • the vibration unit 2 is distorted by the Coriolis force, thereby causing a potential to be applied to the detection electrode 7. Occurs.
  • the angular velocity can be detected by amplifying and processing this signal by an external circuit.
  • the points indicated by black squares in FIG. 5 indicate the plot points of the polarization degree after normalization. From the result of the preliminary experiment 1, it is confirmed that the piezoelectric film of the present example is almost polarized (in the initial state, the polarization is substantially uniform) in a state where the polarization treatment is not performed (in the state of the unpolarization treatment). all right. That is, by using such a piezoelectric material, a polarization process (initial polarization process for obtaining piezoelectric performance) that has been conventionally required becomes unnecessary.
  • the degree of polarization changes abruptly in the vicinity of the electric field of ⁇ 10 kV / cm indicated by the broken line in the figure, and when an electric field having an electric field strength of 10 kV / cm or more is applied, the degree of polarization becomes 0.1.
  • Exceeds 8 the polarization state recovers 80% or more). In other words, it was found that the polarization state could not be sufficiently recovered by applying an electric field with an electric field intensity of less than 10 kV / cm, and that an electric field with an electric field intensity of 10 kV / cm or higher would not recover the polarization of 80% or higher. .
  • This value of 10 kV / cm is sufficiently lower than the electric field strength required for the polarization treatment of the conventional piezoelectric material (intrinsic PZT).
  • the duration of the polarization process is 1 minute, but in practice it is sufficient if the voltage application duration in the polarization process is about 1 second.
  • the piezoelectric film used in the present embodiment is in a state of polarization in the initial state (in an unpolarized state as it is formed), and the required piezoelectric film can be obtained without performing the conventional polarization process. Performance is realized.
  • depolarization due to various factors in the process of processing the piezoelectric film. For example, when an electrostatic chuck that adsorbs a wafer is used, a large electric field is applied to the film surface, which may cause reverse polarization. Alternatively, exposure to the plasma may cause a potential to be applied to the film surface and reverse polarization depending on conditions. Further, there is at least a risk of depolarization in a state where the device is exposed to a high temperature in a reflow process after being formed into a device.
  • the piezoelectric device of the present embodiment has a function of maintaining the device performance by applying a refresh voltage to the piezoelectric element to recover the polarization state.
  • FIG. 6 is a graph showing Pr-E hysteresis characteristics of a conventional piezoelectric film (intrinsic PZT).
  • the horizontal axis represents an electric field (unit: [kV / cm]), and the vertical axis represents remanent polarization (unit: [ ⁇ C / cm 2 ]).
  • the Pr-E hysteresis characteristic of the conventional PZT film is generally symmetric with respect to the limitation.
  • FIG. 7 and 8 are flowcharts showing the steps of a manufacturing process of an electronic device using a conventional piezoelectric film (PZT).
  • FIG. 7 is a flow for performing polarization processing after silicon (Si) device processing
  • FIG. 8 is a flow for performing polarization processing immediately after the formation of the PZT film.
  • a PZT film is formed on the lower electrode (step S214).
  • An upper electrode is formed thereon and patterned to form a desired laminated structure (step S216), and then the silicon layer is processed into a desired shape and thickness (step S218).
  • polarization processing is performed (step S220) to achieve a required polarization state.
  • the wafer is separated into individual device units by dicing (step S222), and connected to the integrated circuit by wire bonding (step S224), and packaged (step S226).
  • the packaged device is mounted on an electronic circuit board, and solder reflow processing is performed (step S228).
  • an electronic circuit board on which the device is mounted is manufactured, and then the final product (electronic device) is manufactured through an assembly process (step S230).
  • step S214 the same step numbers are assigned to the same or similar processes as the flow described in FIG.
  • step S215 a polarization process
  • step S216 an upper electrode formation and patterning process
  • step S220 in FIG. 7 and step S215 in FIG. 8 has been performed before it becomes the final product (electronic device).
  • the driving ASIC is low for use in mobile devices such as a mobile phone because of power consumption.
  • the output voltage of the ASIC varies depending on the specifications of each company, for example, a voltage of 5 V or less is generally used for mobile device applications. For this reason, in order to apply a voltage of 5 V or more in the device, a special device such as a charge pump is required, which causes an increase in cost. Further, the ASIC for outputting a high voltage is problematic because the size is increased.
  • FIG. 9 is a graph showing Pr-E hysteresis characteristics of the piezoelectric film (Nb-PZT) of this embodiment.
  • a piezoelectric element using an Nb-doped PZT film having such asymmetric hysteresis characteristics is used as, for example, an ejection energy generating element of an ink jet printer, an electric field sufficiently larger (large in absolute value) than the coercive electric field on the negative electrode side. Is used.
  • a piezoelectric film having a thickness of 3 ⁇ m is driven with a driving voltage of 20 V (potential difference). This driving voltage exceeds the coercive electric field, and there is no fear of depolarization.
  • FIG. 10 is a flowchart showing the manufacturing process of the piezoelectric device according to the present embodiment and the refresh process after completion of the final product (also referred to as “repolarization process” or “polarization state recovery process”).
  • the same step numbers are assigned to the same or similar processes as those in the conventional flow described in FIG.
  • the manufacturing method of the piezoelectric device which concerns on this embodiment, and its usage method are demonstrated.
  • Step 1 First, a substrate is prepared (Step S210 in FIG. 10).
  • a single crystal bulk silicon substrate Si wafer
  • an SOI (Silicon On On Insulator) substrate may be used.
  • Step 2 Next, a lower electrode (corresponding to “first electrode”) is formed on one side of the substrate (step S212, “lower electrode forming step”).
  • a TiW film having a thickness of 20 nm is formed by sputtering, and an Ir film having a thickness of 150 nm is formed thereon.
  • This laminated film of TiW (20 nm) / Ir (150 nm) becomes the lower electrode.
  • the material of the lower electrode and the film thickness of each layer are not limited to the above example, and various designs are possible.
  • Step 3 Thereafter, an Nb-doped PZT film (piezoelectric film 42) is formed on the lower electrode (step S214, “piezoelectric film forming process”).
  • a Nb-doped PZT thin film (reference numeral 44) is formed on the lower electrode by sputtering at a film forming temperature of 500 ° C. to a thickness of 2 ⁇ m.
  • an upper electrode is formed on the PZT thin film and patterned into a desired shape (step S216, “upper electrode forming step”).
  • the upper electrode has a laminated structure of IrO / Ir / Au.
  • the laminated structure a configuration in which an A material layer, a B material layer, and a C material layer are laminated in this order from the lower layer to the upper layer is represented by the notation “A / B / C”. That is, the material described before “/” constitutes the lower layer, and the material described after “/” represents the upper layer.
  • Step 5 Thereafter, the substrate is processed into a desired shape and thickness (Step S218, “Si device processing step”). Processing is performed using device processing techniques such as lithography, ashing, and Si deep digging.
  • Step S222 “dicing process”.
  • Step 7) Next, the individually separated elements are electrically connected to the integrated circuit by wire bonding (step S224, “wire bonding step”).
  • Step 8) Thereafter, the device is packaged by the package member (step S226, “package step”). In this way, a packaged sensor device is obtained.
  • Step 9 The packaged device is mounted on an electronic circuit board (“mounting step”), and a reflow process is performed (“reflow step”, step S228).
  • Reflow is a well-known technique for surface mounting.
  • the electronic components are placed on a substrate coated with a solder paste in advance, and heat treatment is performed for solder bonding. This is a process for performing all of the above.
  • the electronic circuit board is assembled in the electronic device assembly process (step S228), and the final product (electronic device) is manufactured (step S230).
  • the electronic device here can be, for example, a mobile phone, a digital camera, a personal computer, a digital music player, a game machine, various other devices such as an electronic endoscope, and the like. It is not limited.
  • step S240 of FIG. 10 is a step of applying a refresh voltage (refresh processing step) to restore the polarization state due to depolarization to the original polarization state.
  • a refresh voltage refresh processing step
  • the Pr-E hysteresis As the piezoelectric body.
  • the deviation of the Pr-E hysteresis characteristic of the piezoelectric body can be realized by adding Nb or Bi into PZT. Also, the bias rate increases as the Pb amount increases.
  • the refresh process can be performed after the device has been used for a long time, and the sensitivity of the device can be stabilized.
  • a refresh process can be performed to restore the polarization state.
  • the voltage applied in the refresh process is preferably an electric field having a magnitude of 10 kV / cm or more at which the slope of the change in polarization degree changes rapidly in the experimental results of FIG. A degree of polarization of 80% or more can be expected by applying an electric field having a value larger than this electric field strength.
  • the film thickness of the piezoelectric film in sensor use or actuator use for example, 1 ⁇ m or more and 5 ⁇ m or less, preferably 4 ⁇ m or less, and more preferably 3 ⁇ m or less are assumed. It is desirable that the film thickness is as thin as possible.
  • a refresh process is performed by applying a refresh voltage of about 2 V to 3 V to a piezoelectric film having a thickness of 1 to 2 ⁇ m.
  • the timing for performing this refreshing polarization process may be any time.
  • an electronic device such as a smartphone, a mobile phone, a game machine, or a digital camera, it is possible to always maintain good performance.
  • the refresh process is performed in various modes such as a mode that is automatically performed at the time of device startup or device reset, a mode in which forced execution is performed by software, a mode that is performed at an appropriate timing according to a user operation, etc. And may be implemented at any timing.
  • a refresh voltage may be individually applied to each electrode, or all channels may be simultaneously used. Further, it is sufficient that the polarization processing time is about 1 second. According to the experimental data, when the refresh voltage is applied for about 1 second, performance of 80% or more when the refresh voltage is applied for 1 minute is obtained. Therefore, a refresh voltage application for a short time of about 1 second is sufficient.
  • Example 1 Similar to the preliminary experiment, a lower electrode was formed on an SOI wafer serving as the substrate 14, and PZT doped with 12% Nb (Nb-doped PZT) with a thickness of 2 ⁇ m was formed on the lower electrode.
  • This piezoelectric film had a PE hysteresis bias rate of 75% (see FIG. 9) and was previously polarized. Using this piezoelectric film as it is (without performing polarization treatment), after forming the upper electrode, device processing such as lithography, ashing, and Si deep digging is performed, and the gyro sensor having the configuration described in FIGS. processed.
  • value of the coercive electric field Ec1 having a smaller absolute value
  • the gyro sensor according to Example 1 has the coercive electric field value
  • 6 kV. It is a device driven with an electric field strength of / cm or less.
  • this piezoelectric film was intentionally polarized in the reverse direction (reverse polarization treatment).
  • This reverse polarization process created a state in which the performance due to depolarization was degraded.
  • a voltage of about 2 V was applied from the ASIC (electronic circuit unit 30 in FIG. 1) for about 1 second so that an electric field having an electric field strength of 10 kV / cm was applied (the lower electrode was grounded and a negative voltage was applied to the upper electrode). Applied).
  • the depolarization state is generated by the reverse polarization process.
  • the depolarization occurs due to the deterioration over time due to the long-term use of the actual device or the use environment, and the refresh process (application of the refresh voltage)
  • the refresh process application of the refresh voltage
  • the performance can be maintained within an allowable range that does not cause a problem in the practical performance of the device.
  • the electric field strength applied to maintain the device performance is related to the deviation of the Pr-E hysteresis of the piezoelectric material.
  • the electric field strength applied in the refresh process is preferably not more than three times the coercive electric field value
  • the upper limit of the electric field strength applied in the refresh process is generally set to three times or less of the coercive electric field value
  • Example 1 the coercive electric field value
  • the voltage value is preferably 5 V or less, more preferably 3 V or less, and even more preferably 1.5 V or less from the design of the ASIC.
  • the lower limit of the refresh voltage is a voltage that is higher than the drive voltage of a device that operates with a minute voltage.
  • the refresh voltage is a voltage value that applies an electric field having an electric field strength larger than the electric field strength that operates the device, and the electric field strength that is applied to the piezoelectric film by applying the refresh voltage is the coercive electric field value
  • a material that reduces the coercive electric field value on the polar side (in this embodiment, the negative side) that drives the device, or the piezoelectric film This can be achieved by reducing the thickness.
  • the selection of the piezoelectric material and the design of the film thickness are design parameters for carrying out the invention.
  • Example 2 Instead of the piezoelectric film in Example 1, the Nb doping amount is 8 at%, the bias rate of Pr-E hysteresis is 23%, and the negative coercive field is “ ⁇ 30 kV / cm”.
  • a gyro sensor similar to that of Example 1 was manufactured under the other conditions. When the driving voltage was 0.14 V, the lower electrode was grounded, and a negative voltage was applied to the upper electrode, it was confirmed that it operated well.
  • the electric field intensity at which the degree of polarization reached 80% after the reverse polarization treatment of the piezoelectric film of Example 2 was 15 kV / cm.
  • this piezoelectric film was intentionally polarized in the reverse direction (reverse polarization treatment).
  • This reverse polarization process created a state in which the performance due to depolarization was degraded.
  • a voltage of about 3 V was applied from the ASIC (electronic circuit unit 30 in FIG. 1) for about 1 second so that an electric field having an electric field strength of 15 kV / cm was applied (the lower electrode was grounded and a negative voltage was applied to the upper electrode). Applied).
  • a piezoelectric film having a thickness of 2 ⁇ m was prepared with an Nb doping amount of 3 at%, a PE hysteresis bias rate of 4%, and a negative coercive electric field of ⁇ 46 kV / cm. Since this piezoelectric film was not sufficiently polarized in advance, an Al electrode was formed on the entire surface of the piezoelectric film after film formation, and a polarization treatment was performed. Thereafter, the Al electrode was removed by etching to form an upper electrode. Thereafter, device processing such as lithography, ashing, and Si deep digging was performed, and a gyro sensor having the same form as in FIGS. 3 and 4 was produced.
  • a piezoelectric film having a Nb doping amount of 0 at%, a PE hysteresis bias rate of 3%, and a negative coercive electric field of ⁇ 48 kV / cm was formed to a thickness of 2 ⁇ m. Since this piezoelectric film was not polarized in advance, an Al electrode was formed on the entire surface of the piezoelectric film after the film formation, and the polarization treatment was performed. Thereafter, the Al electrode was removed by etching to form an upper electrode. Thereafter, device processing such as lithography, ashing, and Si deep digging was performed, and a gyro sensor having the same form as in FIGS. 3 and 4 was produced.
  • FIG. 11 shows Example 1 (bias rate 75%) and Example 2 (bias rate 23%), but good results can be obtained for those with a bias rate of 20% or more. In particular, for those having a bias rate of 70% or more, it is possible to recover the polarization state at a lower refresh voltage. Furthermore, since the polarization state in an initial state is favorable, it is preferable as a material.
  • bias rate 78% Considering variation in conditions from the result of Example 1 (bias rate 75%), it is considered that a bias rate of 70% or more is sufficient.
  • FIG. 12 is a block diagram showing another embodiment of the present invention. 12, elements that are the same as or similar to those shown in FIG. 1 are given the same reference numerals, and descriptions thereof are omitted.
  • the piezoelectric device 10 used as an angular velocity sensor, a gyro sensor, or the like has a configuration in which the driving piezoelectric elements 20 and 22 and the detection piezoelectric element 26 are combined, and the driving piezoelectric element.
  • a detection voltage is obtained from the detection piezoelectric element 26 when the elements 20 and 22 are driven. Therefore, by comparing the detection voltage output when driven with a specific drive voltage with a reference value (predetermined threshold), it is determined whether or not performance degradation due to depolarization has occurred. Can do.
  • control circuit 38 (corresponding to “control means”) that automatically determines the presence or absence of performance degradation due to depolarization and controls the execution of the refresh process.
  • control circuit 38 refreshes the refresh voltage application circuit 36 when the detection voltage output from the detection piezoelectric element 26 is lower than the reference value when the drive piezoelectric elements 20 and 22 are driven at a predetermined drive voltage. Is provided with a control circuit 38 for applying a voltage to the sensor element unit 28.
  • the control circuit 38 sends a command to the drive circuit 32 to drive the drive piezoelectric elements 20 and 22 with a specific (predetermined) drive voltage, and the detection voltage obtained from the detection piezoelectric element 26 at the time of the drive. Get information. When the detected voltage is lower than a predetermined reference value, it can be determined that performance degradation due to depolarization has occurred.
  • the control circuit 38 automatically determines whether or not the refresh process is necessary based on the determination result, and sends a command to the refresh voltage application circuit 36 to supply the refresh voltage from the refresh voltage application circuit 36 when necessary.
  • control circuit 38 for example, a mode using a comparator that compares a signal obtained from the detection circuit 34 with a predetermined reference value and outputs the comparison result, or a CPU (Central Processing Unit) is used.
  • a mode using a comparator that compares a signal obtained from the detection circuit 34 with a predetermined reference value and outputs the comparison result or a CPU (Central Processing Unit) is used.
  • a CPU Central Processing Unit
  • control circuit 38 that realizes such a control function can be mounted on the ASIC (electronic circuit unit 30). Note that the control circuit 38 is not limited to being mounted on the electronic circuit unit 30, but can be mounted on an external circuit unit or device.
  • the present invention is not limited to the angular velocity sensor and the gyro sensor exemplified above, and can be applied to various forms of sensor devices and actuator devices.
  • 1 is not limited to a sensor having a configuration in which the driving actuator (using the reverse piezoelectric effect) and the sensor piezoelectric body (using the piezoelectric effect) are combined.
  • the present invention can also be applied to an actuator element that uses only the piezoelectric effect.
  • the electric field strength corresponding to the potential difference generated between the electrodes of the detecting piezoelectric element corresponds to the “electric field strength for operating the device”.
  • the piezoelectric device of the present invention can be used in various applications such as an angular velocity sensor, an acceleration sensor, a pressure sensor, an actuator, and a power generation device, and is particularly effective for a small voltage driving region and a device used for sensing a small voltage. Demonstrate.

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