TW201243278A - Interferometer module - Google Patents

Interferometer module Download PDF

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Publication number
TW201243278A
TW201243278A TW101111338A TW101111338A TW201243278A TW 201243278 A TW201243278 A TW 201243278A TW 101111338 A TW101111338 A TW 101111338A TW 101111338 A TW101111338 A TW 101111338A TW 201243278 A TW201243278 A TW 201243278A
Authority
TW
Taiwan
Prior art keywords
beams
measuring
mirror
interferometer module
module
Prior art date
Application number
TW101111338A
Other languages
English (en)
Chinese (zh)
Inventor
Boer Guido De
Thomas Adriaan Ooms
Niels Vergeer
Godefridus Cornelius Antonius Couweleers
Original Assignee
Mapper Lithography Ip Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mapper Lithography Ip Bv filed Critical Mapper Lithography Ip Bv
Publication of TW201243278A publication Critical patent/TW201243278A/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
    • G01B9/02007—Two or more frequencies or sources used for interferometric measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
    • G01B9/02011—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal polarization variation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
    • G01B9/02012—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal intensity variation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02016—Interferometers characterised by the beam path configuration contacting two or more objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02027—Two or more interferometric channels or interferometers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/304—Controlling tubes
    • H01J2237/30433—System calibration
    • H01J2237/30438—Registration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW101111338A 2011-03-30 2012-03-30 Interferometer module TW201243278A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2006496 2011-03-30

Publications (1)

Publication Number Publication Date
TW201243278A true TW201243278A (en) 2012-11-01

Family

ID=45930961

Family Applications (3)

Application Number Title Priority Date Filing Date
TW101111338A TW201243278A (en) 2011-03-30 2012-03-30 Interferometer module
TW101111337A TWI566052B (zh) 2011-03-30 2012-03-30 具有差分干涉儀模組的微影系統
TW101111339A TWI624733B (zh) 2011-03-30 2012-03-30 用於曝光工具的干涉儀模組的校準

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW101111337A TWI566052B (zh) 2011-03-30 2012-03-30 具有差分干涉儀模組的微影系統
TW101111339A TWI624733B (zh) 2011-03-30 2012-03-30 用於曝光工具的干涉儀模組的校準

Country Status (8)

Country Link
US (5) US9069265B2 (enExample)
EP (3) EP2691812B1 (enExample)
JP (3) JP2014509750A (enExample)
KR (2) KR101804610B1 (enExample)
CN (5) CN202793315U (enExample)
RU (1) RU2612361C2 (enExample)
TW (3) TW201243278A (enExample)
WO (3) WO2012134290A1 (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202793315U (zh) 2011-03-30 2013-03-13 迈普尔平版印刷Ip有限公司 差分干涉仪模块和具有差分干涉仪模块的光刻系统
US9551563B2 (en) 2012-09-27 2017-01-24 Mapper Lithography Ip B.V. Multi-axis differential interferometer
JP6170694B2 (ja) * 2013-03-06 2017-07-26 株式会社荏原製作所 測長計の設置構造
CN103257402B (zh) * 2013-04-23 2015-08-12 青岛海信宽带多媒体技术有限公司 光混合器以及应用光混合器进行信号解调的方法
KR102238107B1 (ko) * 2014-05-22 2021-04-12 삼성전자주식회사 계측 시스템 및 계측 방법
US9874435B2 (en) * 2014-05-22 2018-01-23 Samsung Electronics Co., Ltd. Measuring system and measuring method
JP5839759B1 (ja) 2015-07-30 2016-01-06 浜松ホトニクス株式会社 光干渉計
US10272851B2 (en) * 2015-10-08 2019-04-30 Toyota Motor Engineering & Manufacturing North America, Inc. Vehicle emblem alignment and installation tools and methods of use
CN106931878A (zh) * 2015-12-31 2017-07-07 上海微电子装备有限公司 一种干涉仪测量装置及其控制方法
CN107024176A (zh) * 2016-02-01 2017-08-08 上海微电子装备有限公司 基于衍射光栅的位移测量系统及方法
EP4465115A3 (en) * 2016-09-27 2025-02-12 Intuitive Surgical Operations, Inc. Micro optic assemblies and optical interrogation systems
US10712775B2 (en) * 2016-12-06 2020-07-14 Facebook Technologies, Llc Dichroic combiner backlight used in a head mounted display
DE102017003084B4 (de) * 2017-03-31 2025-07-17 Just Vacuum Gmbh System zum Messen von Längenänderungen im Vakuum
JP6461446B1 (ja) 2017-07-06 2019-01-30 浜松ホトニクス株式会社 ミラーユニット及び光モジュール
CN107328355B (zh) * 2017-09-01 2023-06-23 中科酷原科技(武汉)有限公司 用于冷原子干涉仪的集成化光学系统
CN111183501B (zh) * 2017-10-04 2022-11-25 Asml荷兰有限公司 干涉测量台定位装置
CN108627996B (zh) * 2018-05-07 2020-12-08 西安应用光学研究所 一种基于双层透光框架的变间隙fp干涉仪装调机构和方法
CN109520428B (zh) * 2018-11-09 2020-01-31 中国科学院长春光学精密机械与物理研究所 一种位移测量光学系统
KR102125624B1 (ko) * 2018-11-22 2020-07-07 전북대학교산학협력단 핸드헬드형 분광타원편광계측장치 및 이를 이용한 분광타원편광 파라미터 측정방법
US11698526B2 (en) * 2019-02-08 2023-07-11 The Charles Stark Draper Laboratory, Inc. Multi-channel optical system
CN109975727B (zh) * 2019-03-04 2020-03-27 中国科学技术大学 纳米级磁共振扫描成像设备以及方法
US12292697B2 (en) 2019-05-30 2025-05-06 Asml Holding N.V. Self-referencing interferometer and dual self-referencing interferometer devices
CN112113509B (zh) * 2019-06-20 2022-06-17 上海微电子装备（集团）股份有限公司 龙门式测量装置及龙门式测量方法
CN110806680B (zh) * 2019-10-31 2020-11-24 清华大学 激光干涉光刻系统
CN111045070B (zh) * 2019-11-26 2021-11-30 浙江大学 一种基于差分干涉仪测量被捕获冷原子的系统及方法
CN110927880B (zh) * 2019-11-28 2021-06-18 中国科学院微电子研究所 高稳定偏振保持合束装置及方法
US11761750B1 (en) 2022-02-25 2023-09-19 Utah State University Space Dynamics Laboratory Multi-environment Rayleigh interferometer
EP4647841A1 (en) * 2024-05-07 2025-11-12 Mycronic AB Substrate pattern system with sensor heads emitting laser beams for stage position measurement

Family Cites Families (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4504147A (en) 1981-07-28 1985-03-12 Huang Cheng Chung Angular alignment sensor
DE3262679D1 (en) 1981-09-03 1985-04-25 Bbc Brown Boveri & Cie Process for manufacturing an article from a heat-resisting alloy
US4528490A (en) * 1982-08-11 1985-07-09 Hughes Aircraft Company Two axis drive for stage
JPS60203804A (ja) 1984-03-29 1985-10-15 Mitsubishi Heavy Ind Ltd 真直度測定装置
US4891526A (en) 1986-12-29 1990-01-02 Hughes Aircraft Company X-Y-θ-Z positioning stage
JPH01184402A (ja) * 1988-01-18 1989-07-24 Hitachi Electron Eng Co Ltd 光学式変位測定方法および測定装置
NL9100215A (nl) * 1991-02-07 1992-09-01 Asm Lithography Bv Inrichting voor het repeterend afbeelden van een maskerpatroon op een substraat.
RU2047085C1 (ru) * 1992-06-30 1995-10-27 Владимир Николаевич Давыдов Интерферометр для измерения перемещений двухкоординатного стола
US5719702A (en) 1993-08-03 1998-02-17 The United States Of America As Represented By The United States Department Of Energy Polarization-balanced beamsplitter
JP3367209B2 (ja) * 1994-05-30 2003-01-14 株式会社ニコン 干渉計
US6122036A (en) 1993-10-21 2000-09-19 Nikon Corporation Projection exposure apparatus and method
JP3413945B2 (ja) * 1994-01-28 2003-06-09 株式会社ニコン 縞計数変位干渉計
JPH08210814A (ja) * 1994-10-12 1996-08-20 Canon Inc 光学式変位測定装置
JP3315540B2 (ja) 1994-10-28 2002-08-19 キヤノン株式会社 位置計測装置、位置合わせ装置、露光装置およびデバイスの製造方法
JP3739121B2 (ja) 1995-10-30 2006-01-25 株式会社ソキア レーザ測長機
DE69705779T2 (de) * 1996-03-06 2002-05-23 Asm Lithography B.V., Veldhoven Differential-interferometer-system und lithographischer "step and scan" apparat ausgestattet mit diesem system
US6020963A (en) 1996-06-04 2000-02-01 Northeastern University Optical quadrature Interferometer
US5880838A (en) * 1996-06-05 1999-03-09 California Institute Of California System and method for optically measuring a structure
US6507326B2 (en) 1996-07-10 2003-01-14 Nikon Corporation Color-projection apparatus operable to project a high-contrast image with minimal change in the state or phase of polarization of light flux
JP2879325B2 (ja) * 1996-07-29 1999-04-05 新菱冷熱工業株式会社 レーザ光を用いた配管組立治具
JP3832681B2 (ja) * 1997-03-19 2006-10-11 株式会社ニコン ステージ装置及び該装置を備えた露光装置
US5949546A (en) 1997-05-14 1999-09-07 Ahead Optoelectronics, Inc. Interference apparatus for measuring absolute and differential motions of same or different testing surface
KR100228285B1 (ko) 1997-07-23 1999-11-01 윤종용 액정 표시 장치의 액정 물질 주입 장치 및 그 방법
AU8746998A (en) * 1997-08-19 1999-03-08 Nikon Corporation Object observation device and object observation method
WO1999016113A1 (en) 1997-09-19 1999-04-01 Nikon Corporation Stage device, a scanning aligner and a scanning exposure method, and a device manufactured thereby
US6020964A (en) 1997-12-02 2000-02-01 Asm Lithography B.V. Interferometer system and lithograph apparatus including an interferometer system
JPH11265847A (ja) 1998-01-16 1999-09-28 Canon Inc 位置検出方法及び位置検出装置
JPH11281319A (ja) 1998-03-30 1999-10-15 Sumitomo Heavy Ind Ltd 光学素子の位置設定装置、及び光学素子の位置設定方法
US6765217B1 (en) * 1998-04-28 2004-07-20 Nikon Corporation Charged-particle-beam mapping projection-optical systems and methods for adjusting same
JP4109765B2 (ja) 1998-09-14 2008-07-02 キヤノン株式会社 結像性能評価方法
US7139080B2 (en) * 1998-09-18 2006-11-21 Zygo Corporation Interferometry systems involving a dynamic beam-steering assembly
US6181420B1 (en) * 1998-10-06 2001-01-30 Zygo Corporation Interferometry system having reduced cyclic errors
WO2000022376A1 (en) 1998-10-14 2000-04-20 Nikon Corporation Shape measuring method and shape measuring device, position control method, stage device, exposure apparatus and method for producing exposure apparatus, and device and method for manufacturing device
JP3796363B2 (ja) 1998-10-30 2006-07-12 キヤノン株式会社 位置検出装置及びそれを用いた露光装置
US6550919B1 (en) 1999-03-26 2003-04-22 Unaxis Balzers Aktiengesellschaft Spectral light division and recombination configuration as well as process for the spectrally selective modulation of light
US6201609B1 (en) * 1999-08-27 2001-03-13 Zygo Corporation Interferometers utilizing polarization preserving optical systems
CN1117963C (zh) * 2000-07-07 2003-08-13 清华大学 利用合成波长法实现纳米测量的方法
JP2002141393A (ja) * 2000-07-18 2002-05-17 Nikon Corp 干渉計ボックス
US6727992B2 (en) * 2001-07-06 2004-04-27 Zygo Corporation Method and apparatus to reduce effects of sheared wavefronts on interferometric phase measurements
WO2003033199A1 (en) 2001-10-19 2003-04-24 U.C. Laser Ltd. Method for improved wafer alignment
EP1468333A2 (de) 2002-01-24 2004-10-20 JENOPTIK Laser, Optik, Systeme GmbH Verfahren zum aufbau eines optischen strahlführungssystems
US6757066B2 (en) 2002-01-28 2004-06-29 Zygo Corporation Multiple degree of freedom interferometer
TWI277720B (en) * 2002-01-28 2007-04-01 Zygo Corp Multi-axis interferometer apparatus and method, lithography apparatus and method using same, and beam writing system and method using same
DE10206061A1 (de) 2002-02-08 2003-09-04 Carl Zeiss Semiconductor Mfg S Polarisationsoptimiertes Beleuchtungssystem
US7057739B2 (en) * 2002-02-12 2006-06-06 Zygo Corporation Separated beam multiple degree of freedom interferometer
GB0222970D0 (en) 2002-10-04 2002-11-13 Renishaw Plc Vacuum compatible laser interferometer
JP4546255B2 (ja) * 2002-12-12 2010-09-15 ザイゴ コーポレーション フォトリソグラフィック露光サイクルの間のステージ・ミラー歪の工程内補正
CN1252444C (zh) * 2002-12-24 2006-04-19 中国航空工业总公司第三○四研究所 一种实现阿贝误差实时补偿的激光干涉测长系统
AU2003296344A1 (en) 2003-01-15 2004-08-13 Inlight Solutions, Inc. Optical path difference scanning interferometer
JP2004228382A (ja) 2003-01-23 2004-08-12 Nikon Corp 露光装置
US7224466B2 (en) * 2003-02-05 2007-05-29 Agilent Technologies, Inc. Compact multi-axis interferometer
CN1227520C (zh) * 2003-05-14 2005-11-16 安徽大学 远距离散射物微振动信号测量和保真拾取干涉仪
JP2005057222A (ja) 2003-08-07 2005-03-03 Canon Inc マーク検出装置、マーク検出方法、マーク検出プログラム、露光装置、デバイスの製造方法、及び、デバイス
WO2005047974A2 (en) * 2003-11-10 2005-05-26 Zygo Corporation Measurement and compensation of errors in interferometers
US7443511B2 (en) * 2003-11-25 2008-10-28 Asml Netherlands B.V. Integrated plane mirror and differential plane mirror interferometer system
DE102004023030B4 (de) 2004-05-06 2012-12-27 SIOS Meßtechnik GmbH Mehrfachstrahlteiler
JP2005345329A (ja) * 2004-06-04 2005-12-15 Tokyo Seimitsu Co Ltd 測長用レーザ干渉計
US7212290B2 (en) 2004-07-28 2007-05-01 Agilent Technologies, Inc. Differential interferometers creating desired beam patterns
JP4656448B2 (ja) * 2004-09-30 2011-03-23 株式会社ニコン 投影光学装置及び露光装置
JP4465451B2 (ja) * 2004-12-15 2010-05-19 独立行政法人産業技術総合研究所 光干渉計の周期誤差低減方法および装置
US7298492B2 (en) 2004-12-29 2007-11-20 Honeywell International Inc. Method and system for on-line measurement of thickness and birefringence of thin plastic films
JP5149486B2 (ja) * 2005-05-18 2013-02-20 株式会社ミツトヨ 干渉計、形状測定方法
US7355719B2 (en) * 2005-08-16 2008-04-08 Agilent Technologies, Inc. Interferometer for measuring perpendicular translations
US7362446B2 (en) * 2005-09-15 2008-04-22 Asml Netherlands B.V. Position measurement unit, measurement system and lithographic apparatus comprising such position measurement unit
US7397039B2 (en) * 2005-09-30 2008-07-08 Applied Materials, Inc. Real-time compensation of mechanical position error in pattern generation or imaging applications
JP4631655B2 (ja) 2005-10-31 2011-02-16 セイコーエプソン株式会社 光伝送モジュール、光伝送モジュールの製造方法、光インターコネクション回路及び電子機器
US7379187B2 (en) * 2006-03-31 2008-05-27 Mitutoyo Corporation Detector configuration for interferometric distance measurement
JP4191201B2 (ja) 2006-04-25 2008-12-03 アンリツ株式会社 三次元形状測定装置
DE102007017630B4 (de) * 2006-05-16 2009-08-20 Vistec Semiconductor Systems Gmbh Verfahren zum Steigern der Messgenauigkeit beim Bestimmen der Koordinaten von Strukturen auf einem Substrat
JP5613893B2 (ja) 2006-05-22 2014-10-29 株式会社ブイ・テクノロジー 作業装置におけるテーブル位置決め装置および位置決め方法。
JP2010501999A (ja) 2006-12-08 2010-01-21 キヤノン株式会社 露光装置
JP4264667B2 (ja) * 2007-02-16 2009-05-20 ソニー株式会社 振動検出装置
JP5523664B2 (ja) 2007-11-06 2014-06-18 株式会社ミツトヨ 干渉計
US20090135430A1 (en) * 2007-11-26 2009-05-28 Miao Zhu Systems and Methods for Reducing Nonlinearity in an Interferometer
US8711327B2 (en) 2007-12-14 2014-04-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US7897942B1 (en) 2007-12-20 2011-03-01 Kla-Tencor Corporation Dynamic tracking of wafer motion and distortion during lithography
DE102008004762A1 (de) * 2008-01-16 2009-07-30 Carl Zeiss Smt Ag Projektionsbelichtungsanlage für die Mikrolithographie mit einer Messeinrichtung
US20090280439A1 (en) * 2008-04-30 2009-11-12 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
JP5517071B2 (ja) 2008-07-09 2014-06-11 株式会社ニコン 位置計測方法、並びに露光方法及び装置
CN102187424B (zh) 2008-08-18 2013-07-17 迈普尔平版印刷Ip有限公司 带电粒子束光刻系统以及目标定位装置
US8462349B1 (en) * 2010-07-20 2013-06-11 Science Applications International Corporation System and method for a self-referencing interferometer
CN202793315U (zh) 2011-03-30 2013-03-13 迈普尔平版印刷Ip有限公司 差分干涉仪模块和具有差分干涉仪模块的光刻系统

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