TW201139249A - Transporting device and coating system - Google Patents
Transporting device and coating system Download PDFInfo
- Publication number
- TW201139249A TW201139249A TW100104349A TW100104349A TW201139249A TW 201139249 A TW201139249 A TW 201139249A TW 100104349 A TW100104349 A TW 100104349A TW 100104349 A TW100104349 A TW 100104349A TW 201139249 A TW201139249 A TW 201139249A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- adsorption
- suction
- coating
- floating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010081860A JP2011213435A (ja) | 2010-03-31 | 2010-03-31 | 搬送装置及び塗布システム |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201139249A true TW201139249A (en) | 2011-11-16 |
Family
ID=44694529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100104349A TW201139249A (en) | 2010-03-31 | 2011-02-10 | Transporting device and coating system |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2011213435A (ja) |
KR (1) | KR20110109868A (ja) |
CN (1) | CN102205297A (ja) |
TW (1) | TW201139249A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI557835B (zh) * | 2012-07-18 | 2016-11-11 | Toray Eng Co Ltd | Substrate delivery device |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202011108836U1 (de) | 2011-12-08 | 2011-12-29 | Grenzebach Maschinenbau Gmbh | Vorrichtung zur industriellen Herstellung von photovoltaischen Konzentratormodulen |
JP5865164B2 (ja) * | 2012-04-16 | 2016-02-17 | オイレス工業株式会社 | 離間距離調整装置およびこれを用いた搬送装置 |
JP5939678B2 (ja) * | 2012-05-09 | 2016-06-22 | 大塚電子株式会社 | 光学特性測定装置及び光学特性測定方法 |
JP6151053B2 (ja) * | 2013-03-18 | 2017-06-21 | 東レ株式会社 | 塗布装置、塗布方法およびディスプレイ用部材の製造方法 |
JP6189646B2 (ja) * | 2013-05-30 | 2017-08-30 | 東レエンジニアリング株式会社 | 搬送装置 |
JP5858247B2 (ja) * | 2013-09-30 | 2016-02-10 | 株式会社村田製作所 | 塗工装置 |
TWI472767B (zh) * | 2014-01-22 | 2015-02-11 | Utechzone Co Ltd | Detection device |
US9960070B2 (en) * | 2014-12-06 | 2018-05-01 | Kla-Tencor Corporation | Chucking warped wafer with bellows |
DE102015007325A1 (de) * | 2015-06-12 | 2016-12-15 | Durst Phototechnik Digital Technology Gmbh | Transportsystem für einen Tintenstrahldrucker |
JP2017007046A (ja) * | 2015-06-23 | 2017-01-12 | 澁谷工業株式会社 | 軟質容器のグリッパ |
JP6651392B2 (ja) * | 2016-03-22 | 2020-02-19 | 東レエンジニアリング株式会社 | 基板浮上搬送装置 |
CN107628306A (zh) * | 2016-07-18 | 2018-01-26 | 上海沃迪自动化装备股份有限公司 | 一种多工位往复式输送机 |
JP2018047420A (ja) * | 2016-09-21 | 2018-03-29 | 東レエンジニアリング株式会社 | 脱臭装置及び塗布装置 |
JP6842948B2 (ja) * | 2017-02-24 | 2021-03-17 | リンテック株式会社 | 位置決め装置および位置決め方法 |
JP6804155B2 (ja) * | 2017-03-13 | 2020-12-23 | 東レエンジニアリング株式会社 | 基板浮上搬送装置 |
JP6901379B2 (ja) * | 2017-11-02 | 2021-07-14 | 東レエンジニアリング株式会社 | 塗布装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2691299B2 (ja) * | 1989-06-12 | 1997-12-17 | 株式会社ニコン | 基板ホルダ |
JP3245813B2 (ja) * | 1996-11-27 | 2002-01-15 | 東京エレクトロン株式会社 | 塗布膜形成装置 |
JP4049751B2 (ja) * | 2004-02-05 | 2008-02-20 | 東京エレクトロン株式会社 | 塗布膜形成装置 |
JP4495752B2 (ja) * | 2007-11-06 | 2010-07-07 | 東京エレクトロン株式会社 | 基板処理装置及び塗布装置 |
JP4890424B2 (ja) * | 2007-11-13 | 2012-03-07 | 川崎重工業株式会社 | 薄板曲面被加工物の加工装置 |
JP2009147240A (ja) * | 2007-12-18 | 2009-07-02 | Dainippon Printing Co Ltd | 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法 |
-
2010
- 2010-03-31 JP JP2010081860A patent/JP2011213435A/ja active Pending
-
2011
- 2011-02-10 TW TW100104349A patent/TW201139249A/zh unknown
- 2011-03-18 KR KR1020110024144A patent/KR20110109868A/ko not_active Application Discontinuation
- 2011-03-28 CN CN2011100749948A patent/CN102205297A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI557835B (zh) * | 2012-07-18 | 2016-11-11 | Toray Eng Co Ltd | Substrate delivery device |
Also Published As
Publication number | Publication date |
---|---|
CN102205297A (zh) | 2011-10-05 |
JP2011213435A (ja) | 2011-10-27 |
KR20110109868A (ko) | 2011-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201139249A (en) | Transporting device and coating system | |
JP4305918B2 (ja) | 浮上式基板搬送処理装置 | |
TWI438857B (zh) | 浮上式基板搬送處理裝置及浮上式基板搬送處理方法 | |
TWI329607B (ja) | ||
JP2005228881A (ja) | 浮上式基板搬送処理方法及びその装置 | |
JP2007090145A (ja) | 塗布方法及び塗布装置 | |
JP2011187499A (ja) | ウェハの分離移載方法及び分離移載装置 | |
KR101069600B1 (ko) | 부상식 기판 코터 장치 및 그 코팅 방법 | |
TW201133681A (en) | Substrate processing apparatus, changing method and transferring method | |
KR102605684B1 (ko) | 기판 부상 반송 장치 | |
WO2017163887A1 (ja) | 基板浮上搬送装置 | |
JP7299790B2 (ja) | 基板浮上搬送装置及び基板浮上搬送装置の基板位置補正方法 | |
JP2018114475A (ja) | 塗布装置および塗布方法 | |
JP2011246213A (ja) | 基板搬送装置 | |
JP6804155B2 (ja) | 基板浮上搬送装置 | |
KR102440148B1 (ko) | 기판 지지 기구와 이를 이용한 기판 이송 방법 | |
KR20140071039A (ko) | 기판 처리 장치 | |
JP2017148761A (ja) | 塗布装置 | |
KR101350950B1 (ko) | 노즐 유닛, 기판 처리 장치 및 기판 처리 방법 | |
WO2013140888A1 (ja) | 部品の位置合わせ装置、及び、位置合わせが完了した複数の部品が表面に転写・固定されたシートを製造する方法 | |
JP4915618B2 (ja) | 導電性ボールの配列装置 | |
JP3161434B2 (ja) | シート供給装置 | |
KR102134272B1 (ko) | 부상식 기판 이송 장치 | |
JP2021150351A (ja) | 基板浮上搬送装置 | |
TW202304599A (zh) | 塗佈處理裝置、塗佈處理方法及塗佈處理程式 |