TW201139249A - Transporting device and coating system - Google Patents

Transporting device and coating system Download PDF

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Publication number
TW201139249A
TW201139249A TW100104349A TW100104349A TW201139249A TW 201139249 A TW201139249 A TW 201139249A TW 100104349 A TW100104349 A TW 100104349A TW 100104349 A TW100104349 A TW 100104349A TW 201139249 A TW201139249 A TW 201139249A
Authority
TW
Taiwan
Prior art keywords
substrate
adsorption
suction
coating
floating
Prior art date
Application number
TW100104349A
Other languages
English (en)
Chinese (zh)
Inventor
Kenji Hamakawa
Toshihiro Mori
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW201139249A publication Critical patent/TW201139249A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975Assembly, maintenance, transport or storage of apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
TW100104349A 2010-03-31 2011-02-10 Transporting device and coating system TW201139249A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010081860A JP2011213435A (ja) 2010-03-31 2010-03-31 搬送装置及び塗布システム

Publications (1)

Publication Number Publication Date
TW201139249A true TW201139249A (en) 2011-11-16

Family

ID=44694529

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100104349A TW201139249A (en) 2010-03-31 2011-02-10 Transporting device and coating system

Country Status (4)

Country Link
JP (1) JP2011213435A (ja)
KR (1) KR20110109868A (ja)
CN (1) CN102205297A (ja)
TW (1) TW201139249A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI557835B (zh) * 2012-07-18 2016-11-11 Toray Eng Co Ltd Substrate delivery device

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202011108836U1 (de) 2011-12-08 2011-12-29 Grenzebach Maschinenbau Gmbh Vorrichtung zur industriellen Herstellung von photovoltaischen Konzentratormodulen
JP5865164B2 (ja) * 2012-04-16 2016-02-17 オイレス工業株式会社 離間距離調整装置およびこれを用いた搬送装置
JP5939678B2 (ja) * 2012-05-09 2016-06-22 大塚電子株式会社 光学特性測定装置及び光学特性測定方法
JP6151053B2 (ja) * 2013-03-18 2017-06-21 東レ株式会社 塗布装置、塗布方法およびディスプレイ用部材の製造方法
JP6189646B2 (ja) * 2013-05-30 2017-08-30 東レエンジニアリング株式会社 搬送装置
JP5858247B2 (ja) * 2013-09-30 2016-02-10 株式会社村田製作所 塗工装置
TWI472767B (zh) * 2014-01-22 2015-02-11 Utechzone Co Ltd Detection device
US9960070B2 (en) * 2014-12-06 2018-05-01 Kla-Tencor Corporation Chucking warped wafer with bellows
DE102015007325A1 (de) * 2015-06-12 2016-12-15 Durst Phototechnik Digital Technology Gmbh Transportsystem für einen Tintenstrahldrucker
JP2017007046A (ja) * 2015-06-23 2017-01-12 澁谷工業株式会社 軟質容器のグリッパ
JP6651392B2 (ja) * 2016-03-22 2020-02-19 東レエンジニアリング株式会社 基板浮上搬送装置
CN107628306A (zh) * 2016-07-18 2018-01-26 上海沃迪自动化装备股份有限公司 一种多工位往复式输送机
JP2018047420A (ja) * 2016-09-21 2018-03-29 東レエンジニアリング株式会社 脱臭装置及び塗布装置
JP6842948B2 (ja) * 2017-02-24 2021-03-17 リンテック株式会社 位置決め装置および位置決め方法
JP6804155B2 (ja) * 2017-03-13 2020-12-23 東レエンジニアリング株式会社 基板浮上搬送装置
JP6901379B2 (ja) * 2017-11-02 2021-07-14 東レエンジニアリング株式会社 塗布装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2691299B2 (ja) * 1989-06-12 1997-12-17 株式会社ニコン 基板ホルダ
JP3245813B2 (ja) * 1996-11-27 2002-01-15 東京エレクトロン株式会社 塗布膜形成装置
JP4049751B2 (ja) * 2004-02-05 2008-02-20 東京エレクトロン株式会社 塗布膜形成装置
JP4495752B2 (ja) * 2007-11-06 2010-07-07 東京エレクトロン株式会社 基板処理装置及び塗布装置
JP4890424B2 (ja) * 2007-11-13 2012-03-07 川崎重工業株式会社 薄板曲面被加工物の加工装置
JP2009147240A (ja) * 2007-12-18 2009-07-02 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI557835B (zh) * 2012-07-18 2016-11-11 Toray Eng Co Ltd Substrate delivery device

Also Published As

Publication number Publication date
CN102205297A (zh) 2011-10-05
JP2011213435A (ja) 2011-10-27
KR20110109868A (ko) 2011-10-06

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