JP4915618B2 - 導電性ボールの配列装置 - Google Patents
導電性ボールの配列装置 Download PDFInfo
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- JP4915618B2 JP4915618B2 JP2007150250A JP2007150250A JP4915618B2 JP 4915618 B2 JP4915618 B2 JP 4915618B2 JP 2007150250 A JP2007150250 A JP 2007150250A JP 2007150250 A JP2007150250 A JP 2007150250A JP 4915618 B2 JP4915618 B2 JP 4915618B2
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- 238000002347 injection Methods 0.000 claims description 24
- 239000007924 injection Substances 0.000 claims description 24
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 101150038956 cup-4 gene Proteins 0.000 description 92
- 229910000679 solder Inorganic materials 0.000 description 47
- 235000012431 wafers Nutrition 0.000 description 23
- 238000001514 detection method Methods 0.000 description 14
- 230000004907 flux Effects 0.000 description 7
- 238000005339 levitation Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/8101—Cleaning the bump connector, e.g. oxide removal step, desmearing
- H01L2224/81011—Chemical cleaning, e.g. etching, flux
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0292—Using vibration, e.g. during soldering or screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1に、導電性ボールの挿入部が所定の配列パターンに形成された配列治具と、下面に開口部が形成され、前記配列治具との間で多数の導電性ボールを収容可能なボールカップと、ボールカップを配列治具の上面に沿って相対移動させる移動手段とを備える。
第2に、多数の導電性ボールを収容したボールカップを配列治具上面に沿って相対移動させることにより、配列治具の挿入部に導電性ボールを落とし込んで配列する導電性ボールの配列装置とする。
第3に、前記ボールカップの底面から配列治具上面に向けて気体を噴射する気体噴射孔を設ける。
第4に、上記気体噴射孔から気体を噴出することにより、ボールカップを振動させながら、ボールカップを配列治具上面に沿って相対移動させることを特徴とする導電性ボールの配列装置とする。
2......ウエハ
3......配列マスク
4......ボールカップ
5......ボールカップ移動装置
6......貫通孔形成領域
7......貫通孔
8......保持用ブロック部材
9......開口部
10......バックアッププレート
11.....エア噴射口
12.....エア通路
13.....エア配管
14.....エア供給装置
15.....開閉バルブ
16.....カップホルダ
17.....駆動装置
18.....ガイドプレート
19.....駆動モータ
20.....ガイドレール
21.....ボール受け
22.....スライドローラ
23.....負荷検知用シャフト
24、25.....負荷検知用センサ
26.....スプリング
27.....カップ移動路
30.....フラックス
31.....ウエハ載置テーブル
32.....ピエゾアクチュエータ
33a,b.底面部
34.....外周面
35.....内壁面
36.....上面
37.....絞り弁
38.....レギュレータ
Claims (1)
- 導電性ボールの挿入部が所定の配列パターンに形成された配列治具と、下面に開口部が形成され、前記配列治具との間で多数の導電性ボールを収容可能なボールカップと、ボールカップを配列治具の上面に沿って相対移動させる移動手段とを備え、
多数の導電性ボールを収容したボールカップを配列治具上面に沿って相対移動させることにより、配列治具の挿入部に導電性ボールを落とし込んで配列する導電性ボールの配列装置において、
前記ボールカップの底面から配列治具上面に向けて気体を噴射する気体噴射孔を設け、該気体噴射孔から気体を噴出することにより、ボールカップを振動させながら、ボールカップを配列治具上面に沿って相対移動させることを特徴とする導電性ボールの配列装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150250A JP4915618B2 (ja) | 2007-06-06 | 2007-06-06 | 導電性ボールの配列装置 |
US11/987,804 US7607559B2 (en) | 2007-06-06 | 2007-12-04 | Conductive ball arraying apparatus |
DE102007058454A DE102007058454A1 (de) | 2007-06-06 | 2007-12-05 | Anordnungsvorrichtung für leitende Kugeln |
TW096146253A TWI413197B (zh) | 2007-06-06 | 2007-12-05 | 導電球之排列裝置 |
KR1020070125225A KR101372764B1 (ko) | 2007-06-06 | 2007-12-05 | 도전성 볼의 배열장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150250A JP4915618B2 (ja) | 2007-06-06 | 2007-06-06 | 導電性ボールの配列装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008305893A JP2008305893A (ja) | 2008-12-18 |
JP4915618B2 true JP4915618B2 (ja) | 2012-04-11 |
Family
ID=39942263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007150250A Active JP4915618B2 (ja) | 2007-06-06 | 2007-06-06 | 導電性ボールの配列装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7607559B2 (ja) |
JP (1) | JP4915618B2 (ja) |
KR (1) | KR101372764B1 (ja) |
DE (1) | DE102007058454A1 (ja) |
TW (1) | TWI413197B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6320066B2 (ja) * | 2014-02-13 | 2018-05-09 | イビデン株式会社 | ボール搭載用マスクおよびボール搭載装置 |
KR102078936B1 (ko) * | 2018-11-07 | 2020-02-19 | 주식회사 프로텍 | 도전성 볼 탑재 방법 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07119540B2 (ja) | 1990-03-22 | 1995-12-20 | 株式会社ナブコ | 扉開閉制御装置 |
US5655704A (en) * | 1994-08-30 | 1997-08-12 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component |
JP3271482B2 (ja) | 1994-08-30 | 2002-04-02 | 松下電器産業株式会社 | 半田ボール搭載装置及び半田ボール搭載方法 |
US6253992B1 (en) * | 1998-03-18 | 2001-07-03 | Tessera, Inc. | Solder ball placement fixtures and methods |
JP4130526B2 (ja) * | 2000-11-10 | 2008-08-06 | 株式会社日立製作所 | バンプ形成方法およびその装置 |
TWI273666B (en) * | 2004-06-30 | 2007-02-11 | Athlete Fa Corp | Method and device for mounting conductive ball |
JP2006303341A (ja) * | 2005-04-25 | 2006-11-02 | Shibuya Kogyo Co Ltd | 導電性ボール配列装置 |
JP5140962B2 (ja) | 2005-10-28 | 2013-02-13 | 日亜化学工業株式会社 | 窒化物半導体基板の製造方法 |
-
2007
- 2007-06-06 JP JP2007150250A patent/JP4915618B2/ja active Active
- 2007-12-04 US US11/987,804 patent/US7607559B2/en active Active
- 2007-12-05 TW TW096146253A patent/TWI413197B/zh not_active IP Right Cessation
- 2007-12-05 KR KR1020070125225A patent/KR101372764B1/ko active IP Right Grant
- 2007-12-05 DE DE102007058454A patent/DE102007058454A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US7607559B2 (en) | 2009-10-27 |
DE102007058454A1 (de) | 2008-12-11 |
KR20080107240A (ko) | 2008-12-10 |
US20080302856A1 (en) | 2008-12-11 |
TWI413197B (zh) | 2013-10-21 |
TW200849429A (en) | 2008-12-16 |
JP2008305893A (ja) | 2008-12-18 |
KR101372764B1 (ko) | 2014-03-10 |
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