JP2008305893A - 導電性ボールの配列装置 - Google Patents
導電性ボールの配列装置 Download PDFInfo
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
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- H01L2224/81011—Chemical cleaning, e.g. etching, flux
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- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0292—Using vibration, e.g. during soldering or screen printing
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Abstract
【課題】
導電性ボールの配列装置におけるボールカップを浮上させると共に振動させて、ボールカップの内壁面に接触する導電性ボールを停滞させないようにする。
【解決手段】
導電性ボールの配列装置に次の手段を採用する。
第1に、ボールの挿入部が形成された配列治具と、下面に開口部が形成され、前記配列治具との間で多数の導電性ボールを収容可能なボールカップと、ボールカップを配列治具の上面に沿って相対移動させる移動手段とを備える。
第2に、多数のボールを収容したボールカップを配列治具上面に沿って相対移動させることにより、配列治具の挿入部にボールを落とし込んで配列する配列装置とする。
第3に、前記ボールカップの前記配列治具からの浮上手段と、ボールカップへの振動手段とを設ける。
第4に、配列治具から浮上させたボールカップを振動させながら配列治具上面に沿って相対移動させる。
【選択図】 図1
Description
第1に、導電性ボールの挿入部が所定の配列パターンに形成された配列治具と、下面に開口部が形成され、前記配列治具との間で多数の導電性ボールを収容可能なボールカップと、ボールカップを配列治具の上面に沿って相対移動させる移動手段とを備える。
第2に、多数の導電性ボールを収容したボールカップを配列治具上面に沿って相対移動させることにより、配列治具の挿入部に導電性ボールを落とし込んで配列する導電性ボールの配列装置とする。
第3に、前記ボールカップを前記配列治具から浮上させる浮上手段と、ボールカップに振動を与える振動手段とを設ける。
第4に、配列治具から浮上させたボールカップを振動させながら配列治具上面に沿って相対移動させることを特徴とする導電性ボールの配列装置とする。
第1に、導電性ボールの挿入部が所定の配列パターンに形成された配列治具と、下面に開口部が形成され、前記配列治具との間で多数の導電性ボールを収容可能なボールカップと、ボールカップを配列治具の上面に沿って相対移動させる移動手段とを備える。
第2に、多数の導電性ボールを収容したボールカップを配列治具上面に沿って相対移動させることにより、配列治具の挿入部に導電性ボールを落とし込んで配列する導電性ボールの配列装置とする。
第3に、前記ボールカップの底面から配列治具上面に向けて気体を噴射する気体噴射孔を設ける。
第4に、上記気体噴射孔から気体を噴出することにより、ボールカップを振動させながら、ボールカップを配列治具上面に沿って相対移動させることを特徴とする導電性ボールの配列装置とする。
2......ウエハ
3......配列マスク
4......ボールカップ
5......ボールカップ移動装置
6......貫通孔形成領域
7......貫通孔
8......保持用ブロック部材
9......開口部
10......バックアッププレート
11.....エア噴射口
12.....エア通路
13.....エア配管
14.....エア供給装置
15.....開閉バルブ
16.....カップホルダ
17.....駆動装置
18.....ガイドプレート
19.....駆動モータ
20.....ガイドレール
21.....ボール受け
22.....スライドローラ
23.....負荷検知用シャフト
24、25.....負荷検知用センサ
26.....スプリング
27.....カップ移動路
30.....フラックス
31.....ウエハ載置テーブル
32.....ピエゾアクチュエータ
33a,b.底面部
34.....外周面
35.....内壁面
36.....上面
37.....絞り弁
38.....レギュレータ
Claims (4)
- 導電性ボールの挿入部が所定の配列パターンに形成された配列治具と、下面に開口部が形成され、前記配列治具との間で多数の導電性ボールを収容可能なボールカップと、ボールカップを配列治具の上面に沿って相対移動させる移動手段とを備え、
多数の導電性ボールを収容したボールカップを配列治具上面に沿って相対移動させることにより、配列治具の挿入部に導電性ボールを落とし込んで配列する導電性ボールの配列装置において、
前記ボールカップを前記配列治具から浮上させる浮上手段と、ボールカップに振動を与える振動手段とを設け、
配列治具から浮上させたボールカップを振動させながら配列治具上面に沿って相対移動させることを特徴とする導電性ボールの配列装置。
- 前記浮上手段は、ボールカップの底面から配列治具上面に向けて気体を噴射するものである請求項1記載の導電性ボールの配列装置。
- 前記振動手段は、ボールカップに振動子を取り付けたものである請求項1または2記載の導電性ボールの配列装置。
- 導電性ボールの挿入部が所定の配列パターンに形成された配列治具と、下面に開口部が形成され、前記配列治具との間で多数の導電性ボールを収容可能なボールカップと、ボールカップを配列治具の上面に沿って相対移動させる移動手段とを備え、
多数の導電性ボールを収容したボールカップを配列治具上面に沿って相対移動させることにより、配列治具の挿入部に導電性ボールを落とし込んで配列する導電性ボールの配列装置において、
前記ボールカップの底面から配列治具上面に向けて気体を噴射する気体噴射孔を設け、該気体噴射孔から気体を噴出することにより、ボールカップを振動させながら、ボールカップを配列治具上面に沿って相対移動させることを特徴とする導電性ボールの配列装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150250A JP4915618B2 (ja) | 2007-06-06 | 2007-06-06 | 導電性ボールの配列装置 |
US11/987,804 US7607559B2 (en) | 2007-06-06 | 2007-12-04 | Conductive ball arraying apparatus |
KR1020070125225A KR101372764B1 (ko) | 2007-06-06 | 2007-12-05 | 도전성 볼의 배열장치 |
DE102007058454A DE102007058454A1 (de) | 2007-06-06 | 2007-12-05 | Anordnungsvorrichtung für leitende Kugeln |
TW096146253A TWI413197B (zh) | 2007-06-06 | 2007-12-05 | 導電球之排列裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150250A JP4915618B2 (ja) | 2007-06-06 | 2007-06-06 | 導電性ボールの配列装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008305893A true JP2008305893A (ja) | 2008-12-18 |
JP4915618B2 JP4915618B2 (ja) | 2012-04-11 |
Family
ID=39942263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007150250A Active JP4915618B2 (ja) | 2007-06-06 | 2007-06-06 | 導電性ボールの配列装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7607559B2 (ja) |
JP (1) | JP4915618B2 (ja) |
KR (1) | KR101372764B1 (ja) |
DE (1) | DE102007058454A1 (ja) |
TW (1) | TWI413197B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6320066B2 (ja) * | 2014-02-13 | 2018-05-09 | イビデン株式会社 | ボール搭載用マスクおよびボール搭載装置 |
KR102078936B1 (ko) * | 2018-11-07 | 2020-02-19 | 주식회사 프로텍 | 도전성 볼 탑재 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151539A (ja) * | 2000-11-10 | 2002-05-24 | Hitachi Ltd | バンプ形成方法およびその装置 |
WO2006004000A1 (ja) * | 2004-06-30 | 2006-01-12 | Athlete Fa Corporation | 導電性ボールの搭載方法および装置 |
JP2006303341A (ja) * | 2005-04-25 | 2006-11-02 | Shibuya Kogyo Co Ltd | 導電性ボール配列装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07119540B2 (ja) | 1990-03-22 | 1995-12-20 | 株式会社ナブコ | 扉開閉制御装置 |
JP3271482B2 (ja) | 1994-08-30 | 2002-04-02 | 松下電器産業株式会社 | 半田ボール搭載装置及び半田ボール搭載方法 |
US5655704A (en) * | 1994-08-30 | 1997-08-12 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component |
US6253992B1 (en) * | 1998-03-18 | 2001-07-03 | Tessera, Inc. | Solder ball placement fixtures and methods |
JP5140962B2 (ja) | 2005-10-28 | 2013-02-13 | 日亜化学工業株式会社 | 窒化物半導体基板の製造方法 |
-
2007
- 2007-06-06 JP JP2007150250A patent/JP4915618B2/ja active Active
- 2007-12-04 US US11/987,804 patent/US7607559B2/en active Active
- 2007-12-05 TW TW096146253A patent/TWI413197B/zh not_active IP Right Cessation
- 2007-12-05 KR KR1020070125225A patent/KR101372764B1/ko active IP Right Grant
- 2007-12-05 DE DE102007058454A patent/DE102007058454A1/de not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151539A (ja) * | 2000-11-10 | 2002-05-24 | Hitachi Ltd | バンプ形成方法およびその装置 |
WO2006004000A1 (ja) * | 2004-06-30 | 2006-01-12 | Athlete Fa Corporation | 導電性ボールの搭載方法および装置 |
JP2006303341A (ja) * | 2005-04-25 | 2006-11-02 | Shibuya Kogyo Co Ltd | 導電性ボール配列装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4915618B2 (ja) | 2012-04-11 |
US7607559B2 (en) | 2009-10-27 |
TWI413197B (zh) | 2013-10-21 |
TW200849429A (en) | 2008-12-16 |
KR101372764B1 (ko) | 2014-03-10 |
DE102007058454A1 (de) | 2008-12-11 |
US20080302856A1 (en) | 2008-12-11 |
KR20080107240A (ko) | 2008-12-10 |
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