JP2007157740A - 導電性ボールの配列装置 - Google Patents
導電性ボールの配列装置 Download PDFInfo
- Publication number
- JP2007157740A JP2007157740A JP2005346414A JP2005346414A JP2007157740A JP 2007157740 A JP2007157740 A JP 2007157740A JP 2005346414 A JP2005346414 A JP 2005346414A JP 2005346414 A JP2005346414 A JP 2005346414A JP 2007157740 A JP2007157740 A JP 2007157740A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- wafer
- conductive
- cup
- ball cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01056—Barium [Ba]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【課題】ボールカップをジグザグに移動させて、落下する導電性ボールが、ボール配列マスクの挿入部のエッジとの間に挟まれ、導電性ボールが欠けて、異物が発生したり、導電性ボール自体が変形してしまう危険を回避することを目的とする。
【解決手段】導電性ボールの配列装置に次の手段を採用する。
第1に、導電性ボールの挿入部が所定の領域に形成された配列治具と下面に開口部が形成されると共に前記配列治具とで多数の導電性ボールを収容可能なボールカップと前記ボールカップを配列治具の上面に沿って移動させる移動手段とを備える。
第2に、多数の導電性ボールを収容したボールカップを配列治具の上面に沿って移動させることにより配列治具の挿入部に導電性ボールを落とし込んで配列する装置とする。
第3に、前記移動手段は、ボールカップをジグザグに移動させる。
【選択図】 図6
Description
第1に、導電性ボールの挿入部が所定の領域に形成された配列治具と下面に開口部が形成されると共に前記配列治具とで多数の導電性ボールを収容可能なボールカップと前記ボールカップを配列治具の上面に沿って移動させる移動手段とを備える。
第2に、多数の導電性ボールを収容したボールカップを配列治具の上面に沿って移動させることにより配列治具の挿入部に導電性ボールを落とし込んで配列する導電性ボールの配列装置とする。
第3に、前記移動手段は、ボールカップをジグザグに移動させることを特徴とする導電性ボールの配列装置とする。
第3の発明は、ボールカップの進行方向と交差する方向のジグザグの幅が、上記配列治具の挿入部の同方向の配列ピッチの2分の1以下であるので、導電性ボールが挿入された挿入部に2重にボールカップの移動を行うことを防止でき、無駄な動きをなくすことができた。
2,5....ウエハ受渡部
3......フラックス印刷部
4......ボール搭載部
6......ウエハ供給部
7......一次アライメント部
8......搬入用ロボット
9......反転ユニット
10.....ウエハ収納部
11.....搬出用ロボット
12.....ウエハ搬送ステージ
13.....搬送路
14.....ウエハ
15.....印刷マスク
16.....フラックス供給装置
17,37.型枠
18.....挿入部
18A...エッジ
19.....ボール配列マスク
20.....半田ボール供給装置
21、21A、21B、21C.....半田ボール
22.....ボールホッパ
23a、23b.....ボールカップ
24.....ボールカップ移動手段
25.....X軸駆動機構
26.....Y軸駆動機構
27.....マスク高さ検出センサ
28.....Y軸駆動機構
29.....θ軸駆動機構
30.....Z軸駆動機構
31,34.上下観察カメラ
32.....カセット
33.....クリーニングユニット
36.....挿入部形成領域
38.....貫通孔形成領域
40.....X軸駆動装置
41.....取付ベース
42.....傾き調整機構
43.....ガイドレール
44.....ナット部材
45.....昇降手段
50,52,54.....駆動モータ
51,53,55.....ボールねじ
56.....X軸ガイド
57.....Y軸ガイド
58.....ベース部材
63,64....開口部
65.....シャッタ
66.....シリンダ
67.....受け部
68.....切換部
69.....ボール導入部
70.....ボール検出センサ
71.....揺動型エアシリンダ
Claims (4)
- 導電性ボールの挿入部が所定の領域に形成された配列治具と下面に開口部が形成されると共に前記配列治具とで多数の導電性ボールを収容可能なボールカップと前記ボールカップを配列治具の上面に沿って移動させる移動手段とを備え、多数の導電性ボールを収容したボールカップを配列治具の上面に沿って移動させることにより配列治具の挿入部に導電性ボールを落とし込んで配列する導電性ボールの配列装置において、
前記移動手段は、ボールカップをジグザグに移動させることを特徴とする導電性ボールの配列装置。
- 前記ボールカップの開口部は、前記領域の幅より狭い幅であり、前記移動手段は、ボールカップの進行方向を折り返す際に、進行方向と直交する方向へ移動するようにしたものである請求項1記載の導電性ボールの配列装置。
- ボールカップの進行方向と交差する方向のジグザグの幅が、上記配列治具の挿入部の同方向の配列ピッチの2分の1以下である請求項1または2記載の導電性ボールの配列装置。
- ボールカップ内に収容される導電性ボールの量を、所定の範囲に維持するようにした請求項1または2または3記載の導電性ボールの配列装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005346414A JP4822105B2 (ja) | 2005-11-30 | 2005-11-30 | 導電性ボールの配列装置 |
US11/605,396 US20070123068A1 (en) | 2005-11-30 | 2006-11-29 | Conductive ball arraying apparatus |
GB0623881A GB2432968A (en) | 2005-11-30 | 2006-11-29 | Solder ball arrays |
KR1020060120236A KR20070057060A (ko) | 2005-11-30 | 2006-11-30 | 도전성 볼의 배열 장치 |
TW095144360A TW200731437A (en) | 2005-11-30 | 2006-11-30 | Conductive ball arraying apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005346414A JP4822105B2 (ja) | 2005-11-30 | 2005-11-30 | 導電性ボールの配列装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007157740A true JP2007157740A (ja) | 2007-06-21 |
JP4822105B2 JP4822105B2 (ja) | 2011-11-24 |
Family
ID=37671560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005346414A Expired - Fee Related JP4822105B2 (ja) | 2005-11-30 | 2005-11-30 | 導電性ボールの配列装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070123068A1 (ja) |
JP (1) | JP4822105B2 (ja) |
KR (1) | KR20070057060A (ja) |
GB (1) | GB2432968A (ja) |
TW (1) | TW200731437A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011091207A (ja) * | 2009-10-22 | 2011-05-06 | Fuji Mach Mfg Co Ltd | 半田ボール整列供給装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006103766A1 (ja) * | 2005-03-30 | 2006-10-05 | Fujitsu Limited | ボール捕捉装置、半田ボール配置装置、ボール捕捉方法、および半田ボール配置方法 |
JP6567290B2 (ja) * | 2015-02-20 | 2019-08-28 | Aiメカテック株式会社 | 基板処理装置、基板処理システム、及び基板処理方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08118005A (ja) * | 1994-08-30 | 1996-05-14 | Matsushita Electric Ind Co Ltd | 半田ボール搭載装置及び半田ボール搭載方法 |
JP2003258016A (ja) * | 2002-03-06 | 2003-09-12 | Hitachi Ltd | バンプ形成装置 |
WO2006004000A1 (ja) * | 2004-06-30 | 2006-01-12 | Athlete Fa Corporation | 導電性ボールの搭載方法および装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3528264B2 (ja) * | 1994-08-19 | 2004-05-17 | ソニー株式会社 | ソルダーボールのマウント装置 |
US5655704A (en) * | 1994-08-30 | 1997-08-12 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component |
DE19544929C2 (de) * | 1995-12-01 | 2001-02-15 | Fraunhofer Ges Forschung | Vorrichtung zum flußmittelfreien Aufbringen eines Lötmittels auf ein Substrat oder einen Chip |
US5749614A (en) * | 1995-12-04 | 1998-05-12 | Motorola, Inc. | Vacuum pickup tool for placing balls in a customized pattern |
JP3397051B2 (ja) * | 1996-08-20 | 2003-04-14 | 松下電器産業株式会社 | 導電性ボールの搭載装置および搭載方法 |
JP4171847B2 (ja) * | 1998-01-30 | 2008-10-29 | 澁谷工業株式会社 | 半田ボールマウント装置 |
JP3405175B2 (ja) * | 1998-03-10 | 2003-05-12 | 松下電器産業株式会社 | 導電ボールの実装装置および実装方法 |
US6869008B2 (en) * | 1998-05-29 | 2005-03-22 | Hitachi, Ltd. | Method of forming bumps |
US6268275B1 (en) * | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
JP4130526B2 (ja) * | 2000-11-10 | 2008-08-06 | 株式会社日立製作所 | バンプ形成方法およびその装置 |
DE20106464U1 (de) * | 2001-04-12 | 2001-08-02 | Pac Tech Gmbh | Vorrichtung zum Aufbringen von Lotkugeln |
JP4212992B2 (ja) * | 2003-09-03 | 2009-01-21 | Tdk株式会社 | 半田ボールの供給方法および供給装置 |
-
2005
- 2005-11-30 JP JP2005346414A patent/JP4822105B2/ja not_active Expired - Fee Related
-
2006
- 2006-11-29 US US11/605,396 patent/US20070123068A1/en not_active Abandoned
- 2006-11-29 GB GB0623881A patent/GB2432968A/en not_active Withdrawn
- 2006-11-30 KR KR1020060120236A patent/KR20070057060A/ko not_active Application Discontinuation
- 2006-11-30 TW TW095144360A patent/TW200731437A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08118005A (ja) * | 1994-08-30 | 1996-05-14 | Matsushita Electric Ind Co Ltd | 半田ボール搭載装置及び半田ボール搭載方法 |
JP2003258016A (ja) * | 2002-03-06 | 2003-09-12 | Hitachi Ltd | バンプ形成装置 |
WO2006004000A1 (ja) * | 2004-06-30 | 2006-01-12 | Athlete Fa Corporation | 導電性ボールの搭載方法および装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011091207A (ja) * | 2009-10-22 | 2011-05-06 | Fuji Mach Mfg Co Ltd | 半田ボール整列供給装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20070057060A (ko) | 2007-06-04 |
GB0623881D0 (en) | 2007-01-10 |
GB2432968A (en) | 2007-06-06 |
US20070123068A1 (en) | 2007-05-31 |
TW200731437A (en) | 2007-08-16 |
JP4822105B2 (ja) | 2011-11-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4560682B2 (ja) | 導電性ボール搭載装置 | |
TWI480965B (zh) | Solder ball inspection repair device and solder ball detection repair method | |
JP2010179628A (ja) | はんだ供給装置、印刷装置および印刷方法 | |
JP2824378B2 (ja) | 電子部品装着装置 | |
WO2016092658A1 (ja) | 部品収納部材、および収納方法 | |
JP5961257B2 (ja) | 電子部品装着機 | |
JP4560683B2 (ja) | 導電性ボール配列装置 | |
JP4766242B2 (ja) | 導電性ボールの配列装置 | |
JP4822105B2 (ja) | 導電性ボールの配列装置 | |
JP2006303341A (ja) | 導電性ボール配列装置 | |
JP2006302921A (ja) | 導電性ボール搭載装置 | |
JP4753010B2 (ja) | 導電性ボール配列装置 | |
JP4415326B2 (ja) | ボールマウント装置 | |
JP5303487B2 (ja) | 電子部品装着装置 | |
JP2008091733A (ja) | 部品実装装置 | |
JP2010194803A (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP4147368B2 (ja) | マウントヘッド | |
JP3972164B2 (ja) | フラックスの貯留装置及び転写方法 | |
JP4174920B2 (ja) | 転写ヘッド | |
JP7109076B2 (ja) | 基板吸着固定ステージ及びボール搭載装置 | |
JP4793689B2 (ja) | 導電性ボールの配列装置 | |
JP2007299835A (ja) | 導電性ボールの配列装置 | |
JP2001007136A (ja) | 転写ヘッドのクリーニング装置及び方法 | |
JP2001007125A (ja) | ワークとヘッドの位置決め装置 | |
JP2001012914A (ja) | 位置決めとボールマウント検査の装置及び方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080827 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110422 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110510 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110708 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110809 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110825 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140916 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |