TW201000307A - Sheets for drilling holes in printed circuit boards - Google Patents

Sheets for drilling holes in printed circuit boards Download PDF

Info

Publication number
TW201000307A
TW201000307A TW098118895A TW98118895A TW201000307A TW 201000307 A TW201000307 A TW 201000307A TW 098118895 A TW098118895 A TW 098118895A TW 98118895 A TW98118895 A TW 98118895A TW 201000307 A TW201000307 A TW 201000307A
Authority
TW
Taiwan
Prior art keywords
drilling
resin
sheet
ethylene
layer
Prior art date
Application number
TW098118895A
Other languages
English (en)
Chinese (zh)
Inventor
Bu-Jin Hong
Seung-Bong Chae
Original Assignee
I S Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by I S Tech Co Ltd filed Critical I S Tech Co Ltd
Publication of TW201000307A publication Critical patent/TW201000307A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/56—Damping, energy absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
TW098118895A 2008-06-06 2009-06-06 Sheets for drilling holes in printed circuit boards TW201000307A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080053408A KR100889702B1 (ko) 2008-06-06 2008-06-06 진동흡수용 천공 가공 시트
PCT/KR2009/002411 WO2009148222A2 (ko) 2008-06-06 2009-05-07 인쇄 회로 기판용 천공 가공 시트

Publications (1)

Publication Number Publication Date
TW201000307A true TW201000307A (en) 2010-01-01

Family

ID=40698508

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098118895A TW201000307A (en) 2008-06-06 2009-06-06 Sheets for drilling holes in printed circuit boards

Country Status (5)

Country Link
JP (1) JP5543431B2 (cg-RX-API-DMAC10.html)
KR (1) KR100889702B1 (cg-RX-API-DMAC10.html)
CN (1) CN102015286B (cg-RX-API-DMAC10.html)
TW (1) TW201000307A (cg-RX-API-DMAC10.html)
WO (1) WO2009148222A2 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102573306A (zh) * 2012-01-09 2012-07-11 苏州艾迪亚电子科技有限公司 一种用于生产外层半压合板的方法
JP6131977B2 (ja) * 2015-03-24 2017-05-24 マツダ株式会社 金属製基材上に樹脂含有皮膜を有するワークの加工方法
KR20160139574A (ko) 2015-05-28 2016-12-07 창조산업 주식회사 인쇄회로기판 천공용 엔트리 시트 및 그 제조방법
KR101906124B1 (ko) * 2015-09-02 2018-10-08 미츠비시 가스 가가쿠 가부시키가이샤 드릴 천공용 엔트리 시트, 및 그것을 사용한 드릴 천공 가공 방법
CN108419432B (zh) * 2016-12-09 2021-09-07 日本Mektron株式会社 盖板、盖板的制造方法以及柔性电路板的制造方法
JP2019042870A (ja) * 2017-09-01 2019-03-22 三菱瓦斯化学株式会社 切削加工用エントリーシート及び切削加工方法
CN112265339B (zh) * 2020-10-28 2022-12-02 深圳市柳鑫实业股份有限公司 一种pcb背钻用盖板及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972484A (en) * 1997-12-01 1999-10-26 Polyeitan Composites Ltd. Ultrahigh molecular weight polyethylene composite for printed circuit board and antenna base material
US6268070B1 (en) * 1999-03-12 2001-07-31 Gould Electronics Inc. Laminate for multi-layer printed circuit
JP2001150215A (ja) * 1999-11-24 2001-06-05 Hitachi Chem Co Ltd プリント配線板穴明け加工用シート
JP4249370B2 (ja) * 2000-04-19 2009-04-02 大日本印刷株式会社 ラミネ−トチュ−ブ容器
JP2003080498A (ja) * 2000-06-28 2003-03-18 Hitachi Chem Co Ltd プリント配線板穴あけ加工用シート
JP5041621B2 (ja) 2000-10-11 2012-10-03 三菱瓦斯化学株式会社 孔明け用金属箔複合シート及びドリル孔明け加工法
JP2002292599A (ja) * 2001-01-29 2002-10-08 Hitachi Chem Co Ltd 積層体穴あけ加工用シート
JP2004009270A (ja) * 2002-06-11 2004-01-15 Hitachi Chem Co Ltd フレキシブルプリント配線板穴あけ加工用シートおよびフレキシブルプリント配線板の製造方法
JP4551654B2 (ja) * 2003-12-09 2010-09-29 株式会社神戸製鋼所 プリント配線基板の穴あけ加工に使用する樹脂被覆金属板
KR100657427B1 (ko) 2006-04-19 2006-12-14 주식회사 제알코 코팅용 조성물 및 이를 이용한 피씨비 홀가공용 시트
JP2008045019A (ja) * 2006-08-14 2008-02-28 Asahi Kasei Chemicals Corp ドリル穴開け加工用シート
JP4467553B2 (ja) * 2006-10-17 2010-05-26 日本ユニカー株式会社 発泡ポリエチレン被覆金属管
KR20080055627A (ko) * 2007-11-19 2008-06-19 홍부진 천공 가공용 쉬트

Also Published As

Publication number Publication date
WO2009148222A2 (ko) 2009-12-10
KR100889702B1 (ko) 2009-03-20
JP2011518059A (ja) 2011-06-23
WO2009148222A3 (ko) 2010-01-28
CN102015286B (zh) 2014-08-13
JP5543431B2 (ja) 2014-07-09
CN102015286A (zh) 2011-04-13

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