JP5543431B2 - 印刷回路基板用穿孔加工シート - Google Patents
印刷回路基板用穿孔加工シート Download PDFInfo
- Publication number
- JP5543431B2 JP5543431B2 JP2011504938A JP2011504938A JP5543431B2 JP 5543431 B2 JP5543431 B2 JP 5543431B2 JP 2011504938 A JP2011504938 A JP 2011504938A JP 2011504938 A JP2011504938 A JP 2011504938A JP 5543431 B2 JP5543431 B2 JP 5543431B2
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- JP
- Japan
- Prior art keywords
- ethylene
- punching sheet
- organic resin
- resin layer
- sheet according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 238000004080 punching Methods 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
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- 230000008018 melting Effects 0.000 claims description 17
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 15
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- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
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- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
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- ZAAQJFLUOUQAOG-UHFFFAOYSA-N 4-benzyl-2,6-ditert-butylphenol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C=CC=CC=2)=C1 ZAAQJFLUOUQAOG-UHFFFAOYSA-N 0.000 description 1
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- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
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- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/56—Damping, energy absorption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2008-0053408 | 2008-06-06 | ||
| KR1020080053408A KR100889702B1 (ko) | 2008-06-06 | 2008-06-06 | 진동흡수용 천공 가공 시트 |
| PCT/KR2009/002411 WO2009148222A2 (ko) | 2008-06-06 | 2009-05-07 | 인쇄 회로 기판용 천공 가공 시트 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011518059A JP2011518059A (ja) | 2011-06-23 |
| JP2011518059A5 JP2011518059A5 (cg-RX-API-DMAC10.html) | 2013-10-31 |
| JP5543431B2 true JP5543431B2 (ja) | 2014-07-09 |
Family
ID=40698508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011504938A Expired - Fee Related JP5543431B2 (ja) | 2008-06-06 | 2009-05-07 | 印刷回路基板用穿孔加工シート |
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| Country | Link |
|---|---|
| JP (1) | JP5543431B2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR100889702B1 (cg-RX-API-DMAC10.html) |
| CN (1) | CN102015286B (cg-RX-API-DMAC10.html) |
| TW (1) | TW201000307A (cg-RX-API-DMAC10.html) |
| WO (1) | WO2009148222A2 (cg-RX-API-DMAC10.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573306A (zh) * | 2012-01-09 | 2012-07-11 | 苏州艾迪亚电子科技有限公司 | 一种用于生产外层半压合板的方法 |
| JP6131977B2 (ja) * | 2015-03-24 | 2017-05-24 | マツダ株式会社 | 金属製基材上に樹脂含有皮膜を有するワークの加工方法 |
| KR20160139574A (ko) | 2015-05-28 | 2016-12-07 | 창조산업 주식회사 | 인쇄회로기판 천공용 엔트리 시트 및 그 제조방법 |
| KR101906124B1 (ko) * | 2015-09-02 | 2018-10-08 | 미츠비시 가스 가가쿠 가부시키가이샤 | 드릴 천공용 엔트리 시트, 및 그것을 사용한 드릴 천공 가공 방법 |
| CN108419432B (zh) * | 2016-12-09 | 2021-09-07 | 日本Mektron株式会社 | 盖板、盖板的制造方法以及柔性电路板的制造方法 |
| JP2019042870A (ja) * | 2017-09-01 | 2019-03-22 | 三菱瓦斯化学株式会社 | 切削加工用エントリーシート及び切削加工方法 |
| CN112265339B (zh) * | 2020-10-28 | 2022-12-02 | 深圳市柳鑫实业股份有限公司 | 一种pcb背钻用盖板及其制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5972484A (en) * | 1997-12-01 | 1999-10-26 | Polyeitan Composites Ltd. | Ultrahigh molecular weight polyethylene composite for printed circuit board and antenna base material |
| US6268070B1 (en) * | 1999-03-12 | 2001-07-31 | Gould Electronics Inc. | Laminate for multi-layer printed circuit |
| JP2001150215A (ja) * | 1999-11-24 | 2001-06-05 | Hitachi Chem Co Ltd | プリント配線板穴明け加工用シート |
| JP4249370B2 (ja) * | 2000-04-19 | 2009-04-02 | 大日本印刷株式会社 | ラミネ−トチュ−ブ容器 |
| JP2003080498A (ja) * | 2000-06-28 | 2003-03-18 | Hitachi Chem Co Ltd | プリント配線板穴あけ加工用シート |
| JP5041621B2 (ja) | 2000-10-11 | 2012-10-03 | 三菱瓦斯化学株式会社 | 孔明け用金属箔複合シート及びドリル孔明け加工法 |
| JP2002292599A (ja) * | 2001-01-29 | 2002-10-08 | Hitachi Chem Co Ltd | 積層体穴あけ加工用シート |
| JP2004009270A (ja) * | 2002-06-11 | 2004-01-15 | Hitachi Chem Co Ltd | フレキシブルプリント配線板穴あけ加工用シートおよびフレキシブルプリント配線板の製造方法 |
| JP4551654B2 (ja) * | 2003-12-09 | 2010-09-29 | 株式会社神戸製鋼所 | プリント配線基板の穴あけ加工に使用する樹脂被覆金属板 |
| KR100657427B1 (ko) | 2006-04-19 | 2006-12-14 | 주식회사 제알코 | 코팅용 조성물 및 이를 이용한 피씨비 홀가공용 시트 |
| JP2008045019A (ja) * | 2006-08-14 | 2008-02-28 | Asahi Kasei Chemicals Corp | ドリル穴開け加工用シート |
| JP4467553B2 (ja) * | 2006-10-17 | 2010-05-26 | 日本ユニカー株式会社 | 発泡ポリエチレン被覆金属管 |
| KR20080055627A (ko) * | 2007-11-19 | 2008-06-19 | 홍부진 | 천공 가공용 쉬트 |
-
2008
- 2008-06-06 KR KR1020080053408A patent/KR100889702B1/ko not_active Expired - Fee Related
-
2009
- 2009-05-07 CN CN200980113891.9A patent/CN102015286B/zh not_active Expired - Fee Related
- 2009-05-07 WO PCT/KR2009/002411 patent/WO2009148222A2/ko not_active Ceased
- 2009-05-07 JP JP2011504938A patent/JP5543431B2/ja not_active Expired - Fee Related
- 2009-06-06 TW TW098118895A patent/TW201000307A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW201000307A (en) | 2010-01-01 |
| WO2009148222A2 (ko) | 2009-12-10 |
| KR100889702B1 (ko) | 2009-03-20 |
| JP2011518059A (ja) | 2011-06-23 |
| WO2009148222A3 (ko) | 2010-01-28 |
| CN102015286B (zh) | 2014-08-13 |
| CN102015286A (zh) | 2011-04-13 |
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