WO2009148222A2 - 인쇄 회로 기판용 천공 가공 시트 - Google Patents
인쇄 회로 기판용 천공 가공 시트 Download PDFInfo
- Publication number
- WO2009148222A2 WO2009148222A2 PCT/KR2009/002411 KR2009002411W WO2009148222A2 WO 2009148222 A2 WO2009148222 A2 WO 2009148222A2 KR 2009002411 W KR2009002411 W KR 2009002411W WO 2009148222 A2 WO2009148222 A2 WO 2009148222A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sheet
- resin
- ethylene
- melting point
- low melting
- Prior art date
Links
- 229920005989 resin Polymers 0.000 claims abstract description 77
- 239000011347 resin Substances 0.000 claims abstract description 77
- 238000000034 method Methods 0.000 claims abstract description 34
- 238000002844 melting Methods 0.000 claims abstract description 27
- 230000008018 melting Effects 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 17
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000005977 Ethylene Substances 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 229920001577 copolymer Polymers 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- 238000005553 drilling Methods 0.000 claims description 34
- 238000004080 punching Methods 0.000 claims description 27
- 229920005672 polyolefin resin Polymers 0.000 claims description 19
- 229920001038 ethylene copolymer Polymers 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 9
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 7
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 6
- 230000003078 antioxidant effect Effects 0.000 claims description 5
- 239000003086 colorant Substances 0.000 claims description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- -1 ethylene-propylene-ethylene Chemical group 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000002216 antistatic agent Substances 0.000 claims description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims description 3
- JJYWRQLLQAKNAD-UHFFFAOYSA-N 2-methylpent-2-enoic acid Chemical compound CCC=C(C)C(O)=O JJYWRQLLQAKNAD-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920005653 propylene-ethylene copolymer Polymers 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 229920006305 unsaturated polyester Polymers 0.000 claims description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 1
- 229920006213 ethylene-alphaolefin copolymer Polymers 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 22
- 239000000203 mixture Substances 0.000 description 11
- 239000000314 lubricant Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000001993 wax Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 235000019592 roughness Nutrition 0.000 description 5
- 229940117958 vinyl acetate Drugs 0.000 description 5
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 150000001336 alkenes Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000005191 phase separation Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- YQEMORVAKMFKLG-UHFFFAOYSA-N glycerine monostearate Natural products CCCCCCCCCCCCCCCCCC(=O)OC(CO)CO YQEMORVAKMFKLG-UHFFFAOYSA-N 0.000 description 2
- SVUQHVRAGMNPLW-UHFFFAOYSA-N glycerol monostearate Natural products CCCCCCCCCCCCCCCCC(=O)OCC(O)CO SVUQHVRAGMNPLW-UHFFFAOYSA-N 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 150000002898 organic sulfur compounds Chemical class 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- KOVQMCGGWATESY-VXKWHMMOSA-N (4s)-5-amino-4-[[(2s)-4-carboxy-2-[3-[3-[4-(3-chlorophenyl)phenyl]-1,2-oxazol-5-yl]propanoylamino]butanoyl]amino]-5-oxopentanoic acid Chemical compound O1C(CCC(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCC(O)=O)C(=O)N)=CC(C=2C=CC(=CC=2)C=2C=C(Cl)C=CC=2)=N1 KOVQMCGGWATESY-VXKWHMMOSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 1
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical class CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- ZLFHNCHMEGLFKL-UHFFFAOYSA-N 3,3-bis(3-tert-butyl-4-hydroxyphenyl)butanoic acid Chemical compound C1=C(O)C(C(C)(C)C)=CC(C(C)(CC(O)=O)C=2C=C(C(O)=CC=2)C(C)(C)C)=C1 ZLFHNCHMEGLFKL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 1
- 239000004716 Ethylene/acrylic acid copolymer Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- VMDFZGPHEWEXQX-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.C=C.CC=C VMDFZGPHEWEXQX-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- LHGVFZTZFXWLCP-UHFFFAOYSA-N guaiacol Chemical class COC1=CC=CC=C1O LHGVFZTZFXWLCP-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FRCAGVUKJQCWBD-UHFFFAOYSA-L iodine green Chemical compound [Cl-].[Cl-].C1=CC(N(C)C)=CC=C1C(\C=1C=CC(=CC=1)[N+](C)(C)C)=C/1C=C(C)C(=[N+](C)C)C=C\1 FRCAGVUKJQCWBD-UHFFFAOYSA-L 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/56—Damping, energy absorption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Definitions
- the present invention relates to a sheet for drilling, which is used for drilling, which is one of the manufacturing processes of a printed circuit board, and more specifically, an organic resin layer containing an ethylene copolymer, a low melting point polyolefin resin, and a compatibilizer is a thermosetting adhesive.
- the sheet for punching processing which is laminated
- a printed circuit board represents a board
- a process punching process process
- a printed circuit board is composed of a composite material in which a conductive layer made of copper foil and an insulating layer impregnated with an epoxy resin are laminated on a cross-web woven from glass fiber.
- a conductive layer made of copper foil and an insulating layer impregnated with an epoxy resin are laminated on a cross-web woven from glass fiber.
- Korean Patent Publication No. 2002-0018984 discloses a mixture containing a metal foil having a thickness of 5 to 500 ⁇ m, a polyether ester, a solid water-soluble lubricant, and polyethylene glycol or Lubricant sheets for perforation of printed circuit boards comprising an organic material layer comprising a mixture containing a polyetherester, a solid water soluble lubricant and a liquid water soluble lubricant are disclosed.
- Korean Patent No. 10-0657427 discloses 57 to 65 weight of polyethylene wax.
- US Patent Nos. 4,781,495 and 4,929,370 disclose a method of arranging a water-soluble lubricant impregnated sheet on one or both sides of a laminated substrate, and using this sheet as a cover plate to perform drilling by drill.
- the lubricant impregnated sheet used in the drilling method is a porous, such as paper, made of a mixture of glycols such as diethylene glycol and dipropylene glycol, which are solid water-soluble lubricants, and synthetic waxes such as fatty acids and nonionic surfactants. It is impregnated with the material.
- Japanese Patent Application Laid-Open No. 2002-120198 also uses a water-soluble resin-coated metal sheet obtained by adhering a mixture of polyethylene glycol dimethyl terephthalate polycondensate and polyoxymethylene monostearate, both of which are water-soluble compounds, to one surface of an aluminum sheet.
- a method of drilling by a drill is disclosed.
- the present inventors have tried to develop a new sheet for punching which can solve the above problems, when using a water-insoluble organic resin layer containing an ethylene copolymer, a low melting point polyolefin resin and a compatibilizer,
- the present invention was completed by confirming that the problems caused by the use can be solved, and local vibration caused by the high speed rotation of the drill bit can be absorbed to improve the positional accuracy and wear resistance of the drill.
- the perforated sheet of the present invention is composed of a water-insoluble organic resin layer containing an ethylene copolymer, a low melting point polyolefin resin, and a compatibilizer, problems due to water-soluble resin, that is, adhesion to a metal substrate is poor, or coating Due to the large difference in water absorption from the substrate metal of the resin, warpage occurs in the resin-coated metal sheet, and in particular, since the film itself is easily sticky, the surface of the film may be sticky under high temperature and humidity conditions in the rainy season and summer, which may interfere with handling and workability. It can solve the problem that is caused.
- the organic resin layer of the sheet for punching of the present invention absorbs local vibration due to the high-speed rotation of the drill bit, the wear resistance of the drill can be improved to extend the drill replacement time, and ultimately, the straightness during drilling. That is, the positional accuracy of the drill can be improved.
- the positional accuracy of the drill is improved, the phenomenon that the chip is buried in the substrate during drilling, that is, the smear can be reduced, so that the quality of the punched substrate can be improved.
- the organic resin layer of this invention can achieve the lubrication effect by bit frictional heat, and can improve the wear resistance of a drill bit.
- the present invention relates to a sheet for punching, characterized in that an organic resin layer comprising an ethylene copolymer, a low melting point polyolefin resin, and a compatibilizer is laminated with a metal layer by a thermosetting adhesive.
- the organic resin layer includes an ethylene copolymer, a low melting point polyolefin resin, and a compatibilizer.
- the low melting point polyolefin resin is added to the ethylene copolymer to induce phase separation between the ethylene chain and the olefin chain. It is prepared by adding.
- ethylene chains and olefin chains are representative polymers known to cause phase separation due to differences in cohesive energy.
- the organic resin layer of the present invention takes the form of phase separation of ethylene resin and olefin resin. have.
- the compatibilizer which is another component included in the organic resin layer of the present invention, is added to improve the processability of the olefin resin and to induce the refinement of the olefin resin domain.
- the organic resin layer of the present invention has a form in which ethylene-based resins and olefin-based resins are phase-separated, and thus exhibits an effect of reducing vibration due to a phenomenon in which vibration energy transfer capability at the interface is reduced. That is, since the organic resin layer of the present invention serves as a buffer layer for absorbing local vibration due to the high speed rotation of the drill bit at the interface between the ethylene resin and the olefin resin, the vibration of the drill can be reduced, so that the drill By improving the wear resistance, it is possible to prolong the drill replacement time and ultimately improve the straightness during drilling, that is, the positional accuracy of the drill. When the positional accuracy of the drill is improved, the phenomenon that the chip is buried in the substrate during drilling, that is, the smear can be reduced, so that the quality of the punched substrate can be improved.
- the organic resin layer of the present invention is also water-insoluble or substantially water-insoluble. Therefore, a problem may occur due to the use of the water-soluble resin in the sheet for punching, that is, the adhesion to the metal substrate is poor, or due to the difference in absorption rate of the coating resin with the substrate metal, warping occurs in the resin-coated metal sheet, especially during the rainy season and summer It is possible to solve the problem of sticking of the surface of the film under high temperature and high humidity conditions such as causing trouble in handling or workability.
- substantially insoluble in water means that the organic resin layer may be insoluble in water or may have some water solubility within the range capable of exerting the above-described effects such as storage stability of the product. Therefore, even if some water-soluble substances are contained in the material inevitably incorporated in the organic resin layer in addition to the components of the organic resin layer specified in the present invention, such an organic resin layer is also included in the present invention.
- the organic resin layer of this invention contains 100 weight part of ethylene copolymers, 1-20 weight part of low melting point polyolefin resins, and 1-20 weight part of compatibilizers.
- the thickness of the organic resin layer of this invention is 20-300 micrometers. If the thickness is too thin, it may be difficult to sufficiently absorb the vibration, the role of lubricant, and the discharge of cutting waste during the drilling process. On the contrary, if the thickness is too thick, the positioning accuracy of the drilling may be deteriorated or the drill may be broken. have.
- the copolymer in which ethylene and 1 or more types chosen from the group which consists of vinyl acetate, ethylene vinyl acetate, ethyl acrylic acid, and ethyl methacrylic acid polymerized is preferable.
- low-melting-point polyolefin-based resin refers to a polyolefin-based polymerized using a metalocene catalyst, and generally using a zigro-nata catalyst. Since the melting point is lowered when the metalocene system is used as compared to the polymerized polyolefin system, it is called a low melting point polyolefin system.
- low melting point polyolefins of the present invention low melting point propylene and PE wax are preferred, and low melting point propylene resin is particularly preferable.
- the present invention uses a low melting point resin, the lubrication action due to the bit frictional heat can be achieved to prevent puncture and bit breakage.
- a compatibilizer contained in the organic resin layer of this invention 1 or more types chosen from the group which consists of an ethylene propylene copolymer, an ethylene propylene ethylene copolymer, and an alpha olefin copolymer are preferable.
- the organic resin layer may further include an antioxidant, and such antioxidants include phenolic antioxidants and organic sulfur compound-based antioxidants.
- the phenolic antioxidant can improve the electrical insulation without damaging other properties such as drillability, 1,2,3-trihydroxybenzene, 2,6-di-t-butyl-p-cresol, butyl Monophenols such as hydrogenated hydroxyanisole and 2,6-di-t-butyl-4-ethylphenol, 2,2'-methylene-bis (4-methyl-6-t-butylphenol), 4,4 ' -Thiobis (3-methyl-6-t-butylphenol), 2,2-methylenebis (4-ethyl-6-t-butylphenol), 4.4'-butylidenebis (3-methyl-6-t -Butylphenol), 3,9-bis [1,1-dimethyl-2- [ ⁇ -3-t-butyl-4-hydroxy-5-methylphenyl) propionyloxy] ethyl, and 2,4,8, Bisphenols such as 10-tetraoxaspiro [5,5] undecane, and 1,1,3-tris (2-methyl-4-hydroxy-5-t-but
- organic sulfur compound-based antioxidants examples include dilauryl-thiodipropionate, distearyl-thiodipropionate and dimyristyl-thiodipropionate.
- a colorant may be included in the organic resin layer of the present invention.
- coloring agent examples include known conventional coloring agents such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium oxide, carbon black, naphthalene black, but are not limited thereto.
- Various colorants can be used as long as they do not affect the properties of the organic resin layer.
- the organic resin layer of the present invention may include an antistatic agent.
- glycerol monostearate or a glycerol monostearate / ethoxylated amine mixture (2/1 mol%) is preferable, but any monostearate compound may be used.
- thermosetting adhesive included in the sheet for punching of the present invention may include one selected from the group consisting of phenol resins, epoxy resins, acrylic resins, maleimides, unsaturated polyesters, polyurethanes, alkyl resins, and silicone resins. It is not limited to this.
- seat for punching process of this invention is an aluminum layer, and it is most preferable that it is pure aluminum with a purity of 99.0%. Since these aluminum plates have appropriate hardness and strength, they are preferable because they can suppress the occurrence of burrs and warpage during use as a cover plate during drilling, and do not deteriorate the drill.
- 5-500 micrometers is preferable, as for the thickness of the metal layer of this invention, 30-300 micrometers is more preferable, 50-200 micrometers is the most preferable.
- the sheet for punching processing of the present invention is manufactured by laminating an organic resin layer with a metal layer with a thermosetting adhesive, wherein the adhesion of the organic resin layer and the metal layer may be performed by a method such as a dry laminate, a wet laminate, and a high temperature laminate method. It is also possible to bond using an adhesive.
- commercially available adhesives for dry lamination such as acrylic, urethane, and ester
- adhesives for high temperature lamination such as ethylene-vinylacetate copolymer resin, olefin, and rubber can be appropriately selected and used.
- the present invention also provides a sheet for punching processing of the present invention on a drill entry side surface of a printed circuit board on which one or several layers are stacked, as a cover plate, and the punching process is performed by a drill. It relates to a method for producing a printed circuit board comprising a step.
- positioning a sheet for a punching process to a cover plate on the drill entrance side surface of a printed circuit board, and performing a punching process by a drill depends on the method normally used in the manufacturing field of a printed circuit board.
- the raw material was used at a cylinder temperature of 200 to 220 ⁇ and a die temperature of 180 to 200.
- the product was fed into an extruder maintained at ⁇ ⁇ and then extruded slowly at a high speed.
- the speed is adjusted for several minutes so that the discharge amount is 800 to 1200 g / min, blow-extruded to be about 30 ⁇ m thick, and one side and the laminate of the pure aluminum plate having a thickness of 130 ⁇ m using urethane-based adhesive To prepare a sheet for drilling.
- the raw materials were prepared at a cylinder temperature of 200 to 220 ° C and a die temperature of 180 to 200 ° C. It was fed into an extruder maintained at 0, and then started at a low speed and gradually extruded at a high speed.
- the speed is adjusted for several minutes so that the discharge amount is 800 to 1200 g / min, blow-extruded to be about 30 ⁇ m thick, and one side and the laminate of the pure aluminum plate having a thickness of 130 ⁇ m using urethane-based adhesive To prepare a sheet for drilling.
- the raw material was used at a cylinder temperature of 200 to 220 ⁇ , It was fed into an extruder maintained at a die temperature of 180 to 200 ° C. and then extruded slowly at a high speed.
- the speed is adjusted for several minutes so that the discharge amount is 800 to 1200 g / min, blow-extruded to a thickness of 35 ⁇ m, and laminated with one surface of a pure aluminum plate having a thickness of 130 ⁇ m using a urethane-based adhesive. A sheet for punching was produced.
- Drilling was performed on the sheet
- the drill processing method puts the sheet
- Drill bit diameter 0.25 mm
- Determination of the hole position accuracy was carried out with respect to the board
- Determination of the inner wall roughness was performed on the fifth substrate from above, and the inner wall roughnesses on the right and left of each of the through holes (drilling holes) of the 4000th-th hole and the front and rear two holes were measured, and the average value was less than 5.0 ⁇ m.
- Circle and the thing of less than 10 micrometers (DELTA) and the thing of 10 micrometers or more were made into what is less than 7.0 micrometers.
- EVA copolymer of ethylene and vinyl acetate
- EEA copolymer of ethylene and ethylene vinyl acetate
- EAA copolymer of ethylene and ethyl acrylic acid
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
Description
Claims (14)
- 에틸렌계 공중합체, 저융점 폴리올레핀계 수지 및 상용화제를 포함하는 유기 수지층이 열경화성 접착제에 의하여 금속층과 라미네이션되어 있는 것을 특징으로 하는 천공 가공용 시트.
- 제1항에 있어서, 상기 저융점 폴리올레핀계 수지는 저융점 프로필렌계 수지 또는 PE 왁스인 것을 특징으로 하는 천공 가공용 시트.
- 제1항에 있어서, 상기 저융점 폴리올레핀계 수지는 저융점 프로필렌계 수지인 것을 특징으로 하는 천공 가공용 시트.
- 제1항에 있어서, 상기 유기 수지층은 에틸렌계 공중합체 100 중량부, 저융점 폴리올레핀계 수지 1 내지 20 중량부 및 상용화제 1 내지 20 중량부를 포함하는 것인 천공 가공용 시트.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 에틸렌계 공중합체는 에틸렌과, 비닐아세테이트, 에틸렌비닐아세테이트, 에틸아크릴산 및 에틸메타아크릴산으로 이루어진 군으로부터 선택되는 1종 이상으로 구성되는 공중합체인 것인 천공 가공용 시트.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 상용화제는 에틸렌-프로필렌 공중합체, 에틸렌-프로필렌-에틸렌 공중합체 및 알파올레핀 공중합체로 이루어진 군으로부터 선택되는 1종 이상인 것인 천공 가공용 시트.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 유기 수지층은 두께가 20 내지 300 ㎛인 것인 천공가공용 시트.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 유기 수지층은 산화 방지제를 더 포함하는 것인 천공 가공용 시트.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 유기 수지층은 착색제를 더 포함하는 것인 천공 가공용 시트.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 유기 수지층은 대전방지제를 더 포함하는 것인 천공 가공용 시트.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 열경화성 접착제는 페놀수지, 에폭시수지, 아크릴 수지, 말레이미드, 불포화 폴리에스테르, 폴리우레탄, 알킬 수지, 실리콘 수지로 이루어진 군으로부터 선택되는 1종 이상인 것인 천공 가공용 시트.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 금속층은 알루미늄층인 것인 천공 가공용 시트.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 금속층은 두께가 50 내지 200 ㎛인 것인 천공 가공용 시트.
- 제1항 내지 제4항 중 어느 하나의 항에 기재된 천공 가공용 시트를, 한층 또는 수개의 층이 적층된 인쇄 회로 기판의 드릴 진입측 표면에 덮개판으로 배치하고, 드릴에 의하여 천공 가공을 실시하는 공정을 포함하는 것을 특징으로 하는 인쇄 회로 기판의 제조 방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011504938A JP5543431B2 (ja) | 2008-06-06 | 2009-05-07 | 印刷回路基板用穿孔加工シート |
CN200980113891.9A CN102015286B (zh) | 2008-06-06 | 2009-05-07 | 用于印刷电路基板的穿孔加工用薄板 |
TW098118895A TW201000307A (en) | 2008-06-06 | 2009-06-06 | Sheets for drilling holes in printed circuit boards |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0053408 | 2008-06-06 | ||
KR1020080053408A KR100889702B1 (ko) | 2008-06-06 | 2008-06-06 | 진동흡수용 천공 가공 시트 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009148222A2 true WO2009148222A2 (ko) | 2009-12-10 |
WO2009148222A3 WO2009148222A3 (ko) | 2010-01-28 |
Family
ID=40698508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/002411 WO2009148222A2 (ko) | 2008-06-06 | 2009-05-07 | 인쇄 회로 기판용 천공 가공 시트 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5543431B2 (ko) |
KR (1) | KR100889702B1 (ko) |
CN (1) | CN102015286B (ko) |
TW (1) | TW201000307A (ko) |
WO (1) | WO2009148222A2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112265339A (zh) * | 2020-10-28 | 2021-01-26 | 深圳市柳鑫实业股份有限公司 | 一种pcb背钻用盖板及其制备方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102573306A (zh) * | 2012-01-09 | 2012-07-11 | 苏州艾迪亚电子科技有限公司 | 一种用于生产外层半压合板的方法 |
JP6131977B2 (ja) * | 2015-03-24 | 2017-05-24 | マツダ株式会社 | 金属製基材上に樹脂含有皮膜を有するワークの加工方法 |
KR20160139574A (ko) | 2015-05-28 | 2016-12-07 | 창조산업 주식회사 | 인쇄회로기판 천공용 엔트리 시트 및 그 제조방법 |
CN108025450B (zh) * | 2015-09-02 | 2018-12-07 | 三菱瓦斯化学株式会社 | 钻孔用盖板、和使用其的钻孔加工方法 |
WO2018105176A1 (ja) * | 2016-12-09 | 2018-06-14 | 日本メクトロン株式会社 | エントリーシート、エントリーシートの製造方法及びフレキシブル基板の製造方法 |
JP2019042870A (ja) * | 2017-09-01 | 2019-03-22 | 三菱瓦斯化学株式会社 | 切削加工用エントリーシート及び切削加工方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001301777A (ja) * | 2000-04-19 | 2001-10-31 | Dainippon Printing Co Ltd | ラミネ−トチュ−ブ容器 |
JP2002120198A (ja) * | 2000-10-11 | 2002-04-23 | Mitsubishi Gas Chem Co Inc | 孔明け用金属箔複合シート及びドリル孔明け加工法 |
KR100657427B1 (ko) * | 2006-04-19 | 2006-12-14 | 주식회사 제알코 | 코팅용 조성물 및 이를 이용한 피씨비 홀가공용 시트 |
JP2007100961A (ja) * | 2006-10-17 | 2007-04-19 | Nippon Unicar Co Ltd | 発泡ポリエチレン被覆金属管 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5972484A (en) * | 1997-12-01 | 1999-10-26 | Polyeitan Composites Ltd. | Ultrahigh molecular weight polyethylene composite for printed circuit board and antenna base material |
US6268070B1 (en) * | 1999-03-12 | 2001-07-31 | Gould Electronics Inc. | Laminate for multi-layer printed circuit |
JP2001150215A (ja) * | 1999-11-24 | 2001-06-05 | Hitachi Chem Co Ltd | プリント配線板穴明け加工用シート |
JP2003080498A (ja) * | 2000-06-28 | 2003-03-18 | Hitachi Chem Co Ltd | プリント配線板穴あけ加工用シート |
JP2002292599A (ja) * | 2001-01-29 | 2002-10-08 | Hitachi Chem Co Ltd | 積層体穴あけ加工用シート |
JP2004009270A (ja) * | 2002-06-11 | 2004-01-15 | Hitachi Chem Co Ltd | フレキシブルプリント配線板穴あけ加工用シートおよびフレキシブルプリント配線板の製造方法 |
JP4551654B2 (ja) * | 2003-12-09 | 2010-09-29 | 株式会社神戸製鋼所 | プリント配線基板の穴あけ加工に使用する樹脂被覆金属板 |
JP2008045019A (ja) * | 2006-08-14 | 2008-02-28 | Asahi Kasei Chemicals Corp | ドリル穴開け加工用シート |
KR20080055627A (ko) * | 2007-11-19 | 2008-06-19 | 홍부진 | 천공 가공용 쉬트 |
-
2008
- 2008-06-06 KR KR1020080053408A patent/KR100889702B1/ko active IP Right Grant
-
2009
- 2009-05-07 WO PCT/KR2009/002411 patent/WO2009148222A2/ko active Application Filing
- 2009-05-07 JP JP2011504938A patent/JP5543431B2/ja not_active Expired - Fee Related
- 2009-05-07 CN CN200980113891.9A patent/CN102015286B/zh not_active Expired - Fee Related
- 2009-06-06 TW TW098118895A patent/TW201000307A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001301777A (ja) * | 2000-04-19 | 2001-10-31 | Dainippon Printing Co Ltd | ラミネ−トチュ−ブ容器 |
JP2002120198A (ja) * | 2000-10-11 | 2002-04-23 | Mitsubishi Gas Chem Co Inc | 孔明け用金属箔複合シート及びドリル孔明け加工法 |
KR100657427B1 (ko) * | 2006-04-19 | 2006-12-14 | 주식회사 제알코 | 코팅용 조성물 및 이를 이용한 피씨비 홀가공용 시트 |
JP2007100961A (ja) * | 2006-10-17 | 2007-04-19 | Nippon Unicar Co Ltd | 発泡ポリエチレン被覆金属管 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112265339A (zh) * | 2020-10-28 | 2021-01-26 | 深圳市柳鑫实业股份有限公司 | 一种pcb背钻用盖板及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201000307A (en) | 2010-01-01 |
KR100889702B1 (ko) | 2009-03-20 |
WO2009148222A3 (ko) | 2010-01-28 |
JP5543431B2 (ja) | 2014-07-09 |
JP2011518059A (ja) | 2011-06-23 |
CN102015286B (zh) | 2014-08-13 |
CN102015286A (zh) | 2011-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009148222A2 (ko) | 인쇄 회로 기판용 천공 가공 시트 | |
JP3169026B2 (ja) | 小孔あけ用滑剤シート | |
JP5012100B2 (ja) | ドリル孔明け用エントリーシート | |
TWI407854B (zh) | 鑽孔用蓋板之製造方法及蓋板 | |
JPWO2016117554A1 (ja) | 熱硬化性接着剤組成物、熱硬化性接着フィルム、および複合フィルム | |
US7587815B2 (en) | Resin-coated metal plate and method of drilling printed wiring board using the metal plate | |
JP2010540260A (ja) | プリント回路基板に孔を開けるための改善されたシステムおよび方法 | |
WO2009145526A2 (en) | Protective film composition for wafer dicing | |
DE102016210871A1 (de) | Polyimidharz und metallkaschiertes Laminat, welches dasselbe umfasst | |
JP6315226B2 (ja) | ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法 | |
KR20080055264A (ko) | 천공 가공용 쉬트 | |
JP2003225814A (ja) | 基板孔あけ用潤滑剤および基板孔あけ用潤滑シート | |
JP4551654B2 (ja) | プリント配線基板の穴あけ加工に使用する樹脂被覆金属板 | |
TWI650054B (zh) | Cover plate, cover manufacturing method and flexible circuit board manufacturing method | |
JP3693787B2 (ja) | プリント配線板の孔明け加工用当て板及びプリント配線板の孔明け加工法 | |
WO2013058526A2 (ko) | 이형성이 개선된 자기점착성 보호필름 및 이를 부착한 물품 | |
TW201902648A (zh) | 微細直徑鑽孔加工用之輔助板及利用該輔助板的鑽孔加工方法 | |
JP5041621B2 (ja) | 孔明け用金属箔複合シート及びドリル孔明け加工法 | |
KR20080055627A (ko) | 천공 가공용 쉬트 | |
EP0521144A1 (en) | Manufacturing multilayer ceramic substrate | |
JP5288067B2 (ja) | ドリル孔あけ用エントリーシート | |
WO2024101707A1 (ko) | 수지 조성물 및 이를 포함하는 인쇄회로기판 | |
JP2009275142A (ja) | プリント基板穴あけ用エントリーボード用潤滑剤組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980113891.9 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09758475 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011504938 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09758475 Country of ref document: EP Kind code of ref document: A2 |