CN102015286B - 用于印刷电路基板的穿孔加工用薄板 - Google Patents
用于印刷电路基板的穿孔加工用薄板 Download PDFInfo
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- CN102015286B CN102015286B CN200980113891.9A CN200980113891A CN102015286B CN 102015286 B CN102015286 B CN 102015286B CN 200980113891 A CN200980113891 A CN 200980113891A CN 102015286 B CN102015286 B CN 102015286B
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- thin plate
- perforation
- perforation processing
- resin layer
- organic resin
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Abstract
本发明涉及用于作为印刷电路基板制造工序中的一种的穿孔加工中的穿孔加工用薄板,具体的涉及特征在于通过利用热固性粘合剂将含有乙烯系共聚物、低熔点聚烯烃系树脂及增容剂的有机树脂层与金属层层压而得到的穿孔加工用薄板。本发明还涉及印刷电路基板的制造方法,该印刷电路基板的制造方法包括将上述薄板设置在一层或数层层压的印刷电路基板的钻机进入侧表面上作为盖板,通过钻机实施穿孔加工的工序。
Description
技术领域
本发明涉及用于作为印刷电路基板制造工序的一种的穿孔加工中的穿孔加工用薄板,具体的涉及特征在于通过利用热固化性粘合剂将含有乙烯系共聚物、低熔点聚烯烃系树脂及增容剂的有机树脂层与金属层层压而得到的穿孔加工用薄板;以及涉及印刷电路基板的制造方法,该印刷电路基板的制造方法包括将上述薄板设置在一层或数层层压的印刷电路基板的钻机进入侧表面上作为盖板,通过钻机实施穿孔加工的工序。
背景技术
印刷电路基板是指为了组装电子电路而安装零件进行配线时使用的基板,是很重要的电器的内部零件。该印刷电路基板的制造工序中包括为了使层压基板的最上层和最下层之间能够通电而在断面方向形成通孔的工序(穿孔加工工序)。由于通孔是印刷电路基板中必需的而且其数量多,因此穿孔加工工序对于印刷电路基板的制造非常重要。
通常印刷电路基板由铜箔构成的导体层与玻璃纤维织造的无纺布上含浸并固化环氧树脂等的绝缘层层压的复合材料构成,这些各构成材料的物理性质有区别。因此,如果使用钻机加工作为穿孔加工工序,很容易引起材料之间界面剥离或龟裂等问题,导致加工孔内壁的表面粗糙度恶化或钻头磨损或折损。另外,基板表面存在由于玻璃纤维无纺布的凹凸引起的周期性的凹凸,因此钻机加工时孔的位置的精密度容易降低,且由于钻机加工时产生的热量印刷电路基板中的树脂软化,在通孔镀金后成为电传导不良的因素的污点(smear)容易附着到内层铜箔上。
为了解决上述问题,尤其是为了解决钻机加工时基板上存在的小创口或者微小的瑕疵导致孔的位置精密度下降的问题,以及钻机的旋转力引起的高热而使基板自身损伤的问题,通常加工直径0.35mm以上的孔时在印刷电路基板表面附着纯铝板使用。但是随着IT技术的高功能化、高精密化,快速进行印刷电路基板的模板的微型化、高密度化、多层化,0.1至0.3mm的微小口径加工正在实用化;随着孔数的增加及对孔位置的高精密化的要求变高,在加工0.30mm以下的微细直径时,仍然存在由于直径变小,钻机强度小而导致钻机的位置精密度及耐磨性下降等问题。
因此,作为提高钻机的位置精密度及耐磨性的技术,韩国专利公开第2002-0018984号公开了一种印刷电路基板穿孔用润滑剂薄板,其由有机物层构成,所述有机物层包含含有厚度为5至500μm的金属薄片、聚醚酯、固体状水溶性润滑剂及聚乙二醇的混合物或含有聚醚酯、固体状水溶性润滑剂及液体水溶性润滑剂的混合物。韩国专利第10-0657427号公开了一种由涂覆用组合物构成的印刷电路基板穿孔用薄板,其包含聚乙烯系蜡57至65重量%、由丙烯酸树脂及环氧树脂合成的乳剂形成的水溶性树脂25至33重量%、甲醇8重量%、由去泡剂以及增粘剂组成的添加剂2重量%组成。
另外,美国专利4,781,495号及第4,929,370号公开了一种在层压基板的一面或两面设置水溶性润滑剂含浸薄板,将此薄板作为盖板利用钻机实施穿孔加工的方法,该穿孔方法中使用的润滑剂含浸薄板是将固体的水溶性润滑剂二甘醇或一缩二丙二醇等醇系和脂肪酸等的合成蜡及非离子系表面活性剂的混合物含浸到纸等多孔材料而成的。
日本专利公开第2002-120198号也公开了一种通过钻机实施穿孔加工的方法,该方法中使用将水溶性化合物聚乙二醇对苯二甲酸二甲酯缩聚物和聚甲醛单硬脂酸酯的混合物粘着到铝箔板的一面的水溶性树脂被覆金属板作为盖板。
上述技术都由于钻机加工时产生的摩擦热量使薄板上的树脂部分熔化而起到润滑作用,因此在提高钻机的耐磨性及位置精密度的方面具有一定的效果。但是由于上述技术都是使用水溶性树脂,因此存在以下缺点:导致金属基板的粘合性降低,被覆树脂与基板金属之间的吸收率差异大而使树脂被覆金属板上发生弯曲,尤其在雨季、夏季等高温多湿状态下被膜表面发粘而妨碍拿取或操作。
另外,钻机加工时由于钻头的高速旋转产生的局部震动吸收不利而在解决钻头位置精密度及耐磨性的问题上存在不足。
发明内容
因此,为了解决由于使用水溶性树脂而产生的上述问题,即与金属基板的密着性降低、被覆树脂与基板金属的吸收率差异大而使树脂被覆金属板发生弯曲,尤其是雨季、夏季等高温多湿状态下被膜表面发粘而妨碍拿取或操作的问题,需要开发出一种能够有效解决由于钻头高速旋转引起的局部震动导致的钻机的位置精密度及耐磨性不足等问题的穿孔加工用薄板。
因此,本发明的发明人为开发能够解决上述问题的新型的穿孔加工用薄板而付出努力,结果确认在使用含有乙烯系共聚物、低熔点聚烯烃系树脂及增容剂的非水溶性有机树脂层时,能够解决由于使用水溶性树脂而产生的问题,吸收由于钻头高速旋转引起的局部震动,提高了钻机的位置精密度及耐磨性,从而完成了本发明。
本发明的穿孔加工用薄板由含有乙烯系共聚物、低熔点聚烯烃系树脂及增容剂的非水溶性有机树脂层组成,因此解决了使用水溶性树脂引起的问题,即与金属基板的密着性降低、被覆树脂与基板金属的吸收率差异大而使树脂被覆金属板发生弯曲,尤其是因被膜本身容易发粘而在雨季、夏季等高温多湿状态下被膜表面发粘而妨碍拿取或操作的问题。
另外,本发明的穿孔加工用薄板的有机树脂层能够吸收钻头的高速旋转引起的局部震动,因此提高了钻机的耐磨性,能够延长钻机的更换周期,最终提高了钻孔时的线性度,即钻机的位置精密度。提高钻机的位置精密度,就能减少钻机加工中芯片再附着到基板的现象,即减少瑕疵,从而能够提高穿孔加工基板的品质。
本发明的有机树脂层含有低熔点聚烯烃系树脂,因此实现钻头摩擦热引起的润滑作用,从而提高钻头的耐磨性。
具体实施方式
作为一种实施方式,本发明涉及一种穿孔加工用薄板,其特征在于,该穿孔加工用薄板为通过利用热固化性粘合剂将含有乙烯系共聚物、低熔点聚烯烃系树脂及增容剂的有机树脂层与金属层层压而成的。
上述有机树脂层含有乙烯系共聚物、低熔点聚烯烃系树脂及增容剂,是通过在乙烯系共聚物中添加低熔点聚烯烃系树脂诱导乙烯链和烯烃链的相分离后,添加增容剂而制造的。
通常,乙烯链和烯烃链,尤其丙烯链是已知的因凝集能量的差异而产生相分离的代表性高分子,本发明的有机树脂层具有乙烯系树脂和烯烃系树脂相分离的状态。本发明的有机树脂层含有的另一组成成分增容剂是为了提高诱导烯烃系树脂的加工性及诱导烯烃系树脂域(domain)的微细化而添加的。
如上所述,本发明的有机树脂层由于具有乙烯系树脂和烯烃系树脂相分离的状态,因此通过减少在界面的震动能量传递能力,从而发挥减少震动的效果。即,由于本发明的有机树脂层在乙烯系树脂和烯烃系树脂的界面起到吸收缓冲钻头高速旋转引起的局部振动的作用,从而能够减少钻机的震动,提高钻机的耐磨性,延长钻机的更换周期,最终能够提高钻孔时的线性度,即钻机的位置精密度。提高钻机位置精密度,就能减少在钻孔加工中芯片再附着到基板的现象,即减少瑕疵,从而能够提高穿孔加工的基板的品质。
本发明的有机树脂层是非水溶性或实质上是非水溶性的。因此,能够解决在穿孔加工用薄板上使用水溶性树脂而可能引起的问题,即与金属基板的密着性降低、被覆树脂与基板金属的吸收率差异而使树脂被覆金属板发生弯曲,尤其是在雨季、夏季等高温多湿状态下被膜表面发粘而妨碍拿取或操作的问题。
在本发明中,“实质上是非水溶性”是指有机树脂层是非水溶性的,或者产品的保存稳定性等在能够发挥上述作用效果的范围内可以具有一定的水溶性。因此,即使有机树脂层中的除了本发明上述的有机树脂层的组成成分之外不可避免地含有的物质中含有一部分水溶性物质,这样的有机树脂层也仍然包含在本发明中。
本发明的有机树脂层优选含有乙烯系共聚物100重量份、低熔点聚烯烃系树脂1至20重量份及增容剂1至20重量份。
另外,本发明的有机树脂层优选其厚度为20至300μm的。如果厚度太薄,在钻孔加工时不能充分发挥吸收震动、润滑剂的作用以及排除切割碎屑的作用,相反,如果厚度太厚,就可能会导致穿孔加工位置精密度恶化或钻机折损。
作为本发明的有机树脂层含有的乙烯系共聚物,特别优选乙烯与选自醋酸乙烯酯、乙烯醋酸乙烯酯、丙烯酸乙酯和甲基丙烯酸乙酯组成的组中的一种或多种聚合的共聚物。
在本发明的有机树脂层含有的低熔点聚烯烃系树脂中,“低熔点聚烯烃系树脂”是指使用茂金属催化剂而聚合的聚烯烃系树脂,通常与使用齐格勒-纳塔催化剂聚合的聚烯烃系树脂比较,使用茂金属催化剂会降低熔点,因此将由此获得的叫做低熔点聚烯烃系树脂。本发明的低熔点聚烯烃系树脂中优选低熔点丙烯系树脂及聚乙烯(PE)蜡树脂,特别优选低熔点丙烯系树脂。如上所述,由于本发明使用低熔点树脂,因此可以实现由于钻头摩擦热引起的润滑作用,从而能够提高穿孔加工性及防止钻头的破损。
作为本发明的有机树脂层中含有的增容剂,特别优选选自由乙烯-丙烯共聚物、乙烯-丙烯-乙烯共聚物及α-烯烃共聚物组成的组中的一种或多种。
在本发明中,上述有机树脂层中还可以含有抗氧化剂,这种抗氧化剂可以举出酚系抗氧化剂和有机硫化合物系抗氧化剂。
所述酚系抗氧化剂不损害钻机加工性等其他特性的同时提高电绝缘性,并且可以举出1,2,3-三羟基苯、2,6-二叔丁基对甲酚、丁基羟基茴香醚和2,6-二叔丁基-4-乙基苯酚等单酚;2,2′-亚甲基双-(4-甲基-6-叔丁基苯酚)、4,4′-硫代双(3-甲基-6-叔丁基苯酚)、2,2-亚甲基双(4-乙基-6-叔丁基苯酚)、4,4′-亚丁基双(3-甲基-6-叔丁基苯酚)、3,9-双[1,1-二甲基-2-[β-(3-叔丁基-4-羟基-5-甲基苯基)丙酸基]乙基-2,4,8,10-四氧杂螺[5,5]十一烷(3,9-[1,1--2-[β-3-t--4--5-)]2,4,8,10- [5,5])等双酚;以及1,1,3-三(2-甲基-4-羟基-5-叔丁苯基)丁烷、1,3,5-三甲基-2,4,6-三(3,5-二叔丁基-4-羟基苄基)苯、四(亚甲基3-(3′,5′-二叔丁基-4′-羟基苯基)丙酸酯)甲烷、双(3,3-双(4′-羟基-3′-叔丁基苯基)丁酸)乙二醇酯、1,3,5-三(3′5′-二叔丁基-4′-羟基苄基)-s-三嗪-2,4,6-(1H,3H,5H)三酮等高分子酚。
有机硫化合物抗氧化剂可以举出硫代二丙酸二月桂酯、硫代二丙酸二硬脂酰酯及硫代二丙酸二肉豆蔻酯。
为了解决在钻孔加工准备时的有机树脂层透明而不易识别的问题,本发明的有机树脂层可含有着色剂。
所述着色剂可以举出酞菁蓝、酞菁绿、碘绿、双偶氮黄、结晶紫、二氧化钛、炭黑、萘黑等公知常用的着色剂,但并不限于此,此外还可以使用不影响本发明的有机树脂层的性质的多种着色剂。
此外为了防止静电引起的微细灰尘的附着或者钻孔加工装置的误操作,本发明的有机树脂层还可以含有防静电剂。
这种防静电剂优选丙三醇单硬脂酸酯或丙三醇单硬脂酸酯/乙氧化胺混合物(2/1摩尔%),但只要是单硬脂酸酯化合物均可。
本发明穿孔加工用薄板中含有的热固性粘合剂可以举出选自由酚醛树脂、环氧树脂、丙烯酸树脂、马来酸酐缩亚胺、不饱和聚酯、聚氨酯、烷基树脂、硅树脂组成的组中的一种,但并不限于此。
本发明的穿孔加工用薄板含有的金属层优选为铝层,最优选为纯度99.0%的纯铝。由于这些铝板具有适当的硬度和强度,因此用作穿孔加工时的盖板,可以抑制毛刺(burr)或弯曲的发生,且不使钻机热化,因而作为优选。
本发明的金属层的厚度优选为5至500μm,更优选30至300μm,最优选为50至200μm。
本发明的穿孔加工用薄板是通过用热固性粘合剂将有机树脂层与金属层层压而制造,此时有机树脂层和金属层的粘合可以是干法层压、湿法层压及高温层压等方法,也可使用公知的粘合剂粘合。例如,可以适当的选择使用市售中的丙烯酸系、尿烷系、酯系等干法层压用粘合剂,以及乙烯-醋酸乙烯酯聚合树脂系、烯烃系、橡胶系等高温层压用粘合剂。
作为另一实施方式,本发明还涉及一种印刷电路基板的制造方法,该方法包括:将本发明的穿孔加工用薄板设置在一层或数层层压的印刷电路基板的钻机进入侧表面作为盖板,利用钻机实施穿孔加工的工序。
将穿孔加工用薄板设置在印刷电路基板的钻机进入侧表面作为盖板,利用钻机实施穿孔加工的工序的具体方法采用印刷电路基板制造领域中惯用的方法。
实施例
以下根据实施例详细说明本发明,但是本发明的范围并不限于此。
实施例1
在含有乙烯和醋酸乙烯酯的共聚物100重量份、低熔点丙烯系树脂5重量份及增容剂5重量份的有机树脂层中混合抗氧化剂后,将原料投入到维持料筒温度200至220℃、模具温度180至200℃的挤出机中,然后从低速逐渐向高速挤出。原料通过模具开始出来时,调速数分钟,使挤出量为800至1200g/min,然后吹塑成型为厚度30μm左右,利用尿烷系粘合剂与厚度为130μm的纯铝箔板的一面层压,从而制造穿孔加工用薄板。
实施例2至18
除乙烯系共聚物、低熔点丙烯系树脂及增容剂的具体成分及组成比之外,根据实施例1中记载的方法制造穿孔加工用薄板。乙烯系共聚物、低熔点丙烯系树脂及增容剂的具体成分及组成比如下表1所示。
实施例19
在含有乙烯和醋酸乙烯的共聚物100重量份、PE蜡树脂5重量份及增容剂5重量份的有机树脂层中混合抗氧化剂后,将原料投入到维持料筒温度200至220℃、模具温度180至200℃的挤出机中,然后从低速逐渐向高速挤出。原料通过模具开始出来时,调速数分钟,使挤出量设置为800至1200g/min,然后吹塑成型为厚度30μm左右,利用尿烷系粘合剂与厚度为130μm的纯铝箔板的一面层压,从而制造穿孔加工用薄板。
实施例20至36
除乙烯系共聚物、PE蜡树脂及增容剂的具体成分及组成比之外,根据实施例19中记载的方法制造穿孔加工用薄板。乙烯系共聚物、PE蜡树脂及增容剂的具体成分及组成比如下表1所示。
比较例1
在仅含有乙烯和醋酸乙烯酯的共聚物100重量份,不含有低熔点丙烯系树脂、PE蜡树脂及增容剂的有机树脂层中混合抗氧化剂后,将原料投入到维持料筒温度200至220℃、模具温度180至200℃的挤出机中,然后从低速逐渐向高速挤出。原料通过模具开始出来时,调速数分钟,使挤出量设置为800至1200g/min,然后吹塑成型为厚度35μm,利用尿烷系粘合剂与厚度为130μm的纯铝箔板的一面层压,从而制造穿孔加工用薄板。
比较例2至12
除乙烯系共聚物的具体成分及乙烯系共聚物及增容剂的具体组成比之外,根据比较例1中记载的方法制造穿孔加工用薄板。乙烯系共聚物的具体成分及乙烯系共聚物及增容剂的具体组成比如下表1中所示。
实验例
对根据实施例1至36及比较例1至12制造的穿孔加工用薄板实施钻孔加工,评估孔位置精密度、内壁粗糙度及孔内瑕疵的产生。
钻孔加工方法是将根据实施例1至36及比较例1至12制造的穿孔加工用薄板置于钻机的一侧,使层压有机树脂层的面与钻机接触,在其下方重叠设置有0.4mm厚的双面铜箔印刷电路基板(FR-4产品、铜箔厚度18μm)7张,在其下方追加设置1.5mm厚的酚醛塑料(bakelite)板构成的垫板,实施印刷电路基板的穿孔加工。
钻孔加工以如下条件实施。
钻头:直径0.25mm
转速:125,000rpm
移送速度:2.5m/分钟
邻接加工孔中心之间的距离:0.5mm
钻头数:5000孔(hit)
将印刷配线基板7张重叠,钻孔5000孔(穿孔)后,对最下方(第7张)基板进行了孔位置精密度判定。即,在最下方基板上,对钻孔的5000个孔测定了从孔中心的误差间距,计算其最大值,最大值为小于50μm的表示为◎,大于50μm小于70μm的表示为○,大于70小于100μm的表示为△,大于100μm的表示为×。
对从上往下数第5张基板进行了内壁粗糙度判定,测定第4000个孔及前后两个孔的各个通孔(钻机加工孔)壁面左右的内部粗糙度,其平均值小于5.0μm的表示为◎,小于7.0μm的表示为○,小于10μm的表示为△,小于10μm的表示为×。
观察通过钻孔加工试验生成的孔的瑕疵现象,瑕疵是指摩擦热扩散不充分时钻头的温度增加,而使芯片树脂部位软化并熔解再次粘合到通孔内壁的内层铜箔断面的现象,在洗涤后用显微镜观察20个通孔断面,没有发现瑕疵时为10,发现微细瑕疵时为5,在整个断面中都有发现瑕疵时为0。
以上结果在表1中示出。
表1
EVA:乙烯和醋酸乙烯酯的共聚物,EEA:乙烯和乙烯醋酸乙烯酯的共聚物,EAA:乙烯和丙烯酸乙酯的共聚物。
如表1的结果所示,使用本发明的穿孔加工用薄板时,显著改善孔位置精密度及内壁粗糙度,显著减少瑕疵的产生。
与此相比,不含有诱导微相分离的聚烯烃系树脂的有机树脂层时,孔位置精密度下降,内部粗糙度不良,瑕疵的产生增加。
Claims (11)
1.一种穿孔加工用薄板,其特征在于,该穿孔加工用薄板是通过利用热固性粘合剂将含有乙烯系共聚物、低熔点聚烯烃系树脂及增容剂的有机树脂层与金属层层压而成的;所述低熔点聚烯烃系树脂为低熔点丙烯系树脂;所述有机树脂层含有乙烯系共聚物100重量份、低熔点聚烯烃系树脂1至20重量份及增容剂1至20重量份。
2.根据权利要求1所述的穿孔加工用薄板,其特征在于,所述乙烯系共聚物为乙烯与选自由醋酸乙烯酯、乙烯醋酸乙烯酯、丙烯酸乙酯和甲基丙烯酸乙酯组成的组中的一种或多种的共聚物。
3.根据权利要求1所述的穿孔加工用薄板,其特征在于,所述增容剂为选自由乙烯-丙烯共聚物、乙烯-丙烯-乙烯共聚物及α-烯烃共聚物组成的组中的一种或多种。
4.根据权利要求1所述的穿孔加工用薄板,其特征在于,所述有机树脂层的厚度为20至300μm。
5.根据权利要求1所述的穿孔加工用薄板,其特征在于,所述有机树脂层还含有抗氧化剂。
6.根据权利要求1所述的穿孔加工用薄板,其特征在于,所述有机树脂层还含有着色剂。
7.根据权利要求1所述的穿孔加工用薄板,其特征在于,所述有机树脂层还含有防静电剂。
8.根据权利要求1所述的穿孔加工用薄板,其特征在于,所述热固性粘合剂为选自由酚醛树脂、环氧树脂、丙烯酸树脂、马来酰亚胺、不饱和聚酯、聚氨酯、烷基树脂和硅树脂组成的组中的一种以上。
9.根据权利要求1所述的穿孔加工用薄板,其特征在于,所述金属层为铝层。
10.根据权利要求1所述的穿孔加工用薄板,其特征在于,所述金属层的厚度为50至200μm。
11.一种印刷电路基板的制造方法,其特征在于,该方法包括将根据权利要求1所述的穿孔加工用薄板设置于一层或数层层压的印刷电路基板的钻机进入侧表面上作为盖板,利用钻机实施穿孔加工的工序。
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