TW200903588A - Align mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same - Google Patents

Align mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same Download PDF

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Publication number
TW200903588A
TW200903588A TW97117550A TW97117550A TW200903588A TW 200903588 A TW200903588 A TW 200903588A TW 97117550 A TW97117550 A TW 97117550A TW 97117550 A TW97117550 A TW 97117550A TW 200903588 A TW200903588 A TW 200903588A
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TW
Taiwan
Prior art keywords
metal
alignment
pad
wafer
metal block
Prior art date
Application number
TW97117550A
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English (en)
Chinese (zh)
Inventor
Sung-Jae Kim
Yong-Bok Park
Jung-Soo Nam
In-Jung Lee
Sung-Jun Kim
Original Assignee
Samsung Electronics Co Ltd
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Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200903588A publication Critical patent/TW200903588A/zh

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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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  • Engineering & Computer Science (AREA)
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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TW97117550A 2007-05-14 2008-05-13 Align mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same TW200903588A (en)

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