KR100809726B1 - 얼라인 마크, 상기 얼라인 마크를 구비하는 반도체 칩,상기 반도체 칩을 구비하는 반도체 패키지 및 상기 반도체칩과 상기 반도체 패키지의 제조방법들 - Google Patents

얼라인 마크, 상기 얼라인 마크를 구비하는 반도체 칩,상기 반도체 칩을 구비하는 반도체 패키지 및 상기 반도체칩과 상기 반도체 패키지의 제조방법들 Download PDF

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KR100809726B1
KR100809726B1 KR20070046768A KR20070046768A KR100809726B1 KR 100809726 B1 KR100809726 B1 KR 100809726B1 KR 20070046768 A KR20070046768 A KR 20070046768A KR 20070046768 A KR20070046768 A KR 20070046768A KR 100809726 B1 KR100809726 B1 KR 100809726B1
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metal
alignment
chip
pad
opening
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Korean (ko)
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김성재
박용복
남정수
이인정
김승준
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삼성전자주식회사
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Priority to JP2008126087A priority patent/JP2008283195A/ja
Priority to TW97117550A priority patent/TW200903588A/zh
Priority to CN2008101714342A priority patent/CN101369572B/zh
Priority to US12/153,088 priority patent/US20080284048A1/en
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
KR20070046768A 2007-05-14 2007-05-14 얼라인 마크, 상기 얼라인 마크를 구비하는 반도체 칩,상기 반도체 칩을 구비하는 반도체 패키지 및 상기 반도체칩과 상기 반도체 패키지의 제조방법들 Expired - Fee Related KR100809726B1 (ko)

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KR20070046768A KR100809726B1 (ko) 2007-05-14 2007-05-14 얼라인 마크, 상기 얼라인 마크를 구비하는 반도체 칩,상기 반도체 칩을 구비하는 반도체 패키지 및 상기 반도체칩과 상기 반도체 패키지의 제조방법들
JP2008126087A JP2008283195A (ja) 2007-05-14 2008-05-13 アラインマーク、該アラインマークを具備する半導体チップ、該半導体チップを具備する半導体パッケージ並びに該半導体チップ及び該半導体パッケージの製造方法
TW97117550A TW200903588A (en) 2007-05-14 2008-05-13 Align mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same
CN2008101714342A CN101369572B (zh) 2007-05-14 2008-05-14 对准标记及其半导体芯片和封装以及其制造方法
US12/153,088 US20080284048A1 (en) 2007-05-14 2008-05-14 Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same

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WO2014100197A1 (en) * 2012-12-21 2014-06-26 Spansion Llc Chip positioning in multi-chip package
US9159675B2 (en) 2012-07-30 2015-10-13 Samsung Display Co., Ltd. Integrated circuit and display device including the same
KR20200053012A (ko) * 2018-11-07 2020-05-18 삼성디스플레이 주식회사 유기 발광 표시 장치
KR20240057501A (ko) * 2022-10-24 2024-05-03 세메스 주식회사 반도체 기판 장치와, 반도체 처리 방법 및 반도체 처리 장치
US12362286B2 (en) 2021-12-27 2025-07-15 Samsung Electronics Co., Ltd. Printed circuit board and semiconductor package including the same

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FR2913529B1 (fr) * 2007-03-09 2009-04-24 E2V Semiconductors Soc Par Act Boitier de circuit integre,notamment pour capteur d'image, et procede de positionnement
US7875988B2 (en) * 2007-07-31 2011-01-25 Seiko Epson Corporation Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same
JP5658442B2 (ja) * 2009-06-02 2015-01-28 株式会社東芝 電子部品とその製造方法
JP5927756B2 (ja) * 2010-12-17 2016-06-01 ソニー株式会社 半導体装置及び半導体装置の製造方法
JP5795196B2 (ja) * 2011-06-09 2015-10-14 新光電気工業株式会社 半導体パッケージ
KR101688350B1 (ko) * 2012-11-21 2016-12-20 미쓰비시덴키 가부시키가이샤 반도체 장치 및 그 제조 방법
JP5763116B2 (ja) * 2013-03-25 2015-08-12 株式会社東芝 半導体装置の製造方法
US9355979B2 (en) * 2013-08-16 2016-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Alignment structures and methods of forming same
JP6287103B2 (ja) * 2013-11-22 2018-03-07 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法
US20150187608A1 (en) * 2013-12-26 2015-07-02 Sanka Ganesan Die package architecture with embedded die and simplified redistribution layer
US9589900B2 (en) 2014-02-27 2017-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. Metal pad for laser marking
US9343434B2 (en) 2014-02-27 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Laser marking in packages
US9666522B2 (en) 2014-05-29 2017-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Alignment mark design for packages
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CN105654856A (zh) * 2016-02-04 2016-06-08 京东方科技集团股份有限公司 一种显示装置及其芯片邦定方法
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