CN101369572B - 对准标记及其半导体芯片和封装以及其制造方法 - Google Patents

对准标记及其半导体芯片和封装以及其制造方法 Download PDF

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CN101369572B
CN101369572B CN2008101714342A CN200810171434A CN101369572B CN 101369572 B CN101369572 B CN 101369572B CN 2008101714342 A CN2008101714342 A CN 2008101714342A CN 200810171434 A CN200810171434 A CN 200810171434A CN 101369572 B CN101369572 B CN 101369572B
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metal
pad
chip
aligning
semiconductor chip
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CN101369572A (zh
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金成宰
朴容福
南定洙
李仁正
金升俊
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
CN2008101714342A 2007-05-14 2008-05-14 对准标记及其半导体芯片和封装以及其制造方法 Expired - Fee Related CN101369572B (zh)

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JP5658442B2 (ja) * 2009-06-02 2015-01-28 株式会社東芝 電子部品とその製造方法
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