TW200745195A - Insulating material, process for producing electronic part/device, and electronic part/device - Google Patents

Insulating material, process for producing electronic part/device, and electronic part/device

Info

Publication number
TW200745195A
TW200745195A TW096116299A TW96116299A TW200745195A TW 200745195 A TW200745195 A TW 200745195A TW 096116299 A TW096116299 A TW 096116299A TW 96116299 A TW96116299 A TW 96116299A TW 200745195 A TW200745195 A TW 200745195A
Authority
TW
Taiwan
Prior art keywords
skeleton
curable compound
insulating material
electronic part
main chain
Prior art date
Application number
TW096116299A
Other languages
English (en)
Inventor
Hiroshi Maenaka
Takuji Aoyama
Takashi Watanabe
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200745195A publication Critical patent/TW200745195A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Inorganic Insulating Materials (AREA)
  • Organic Insulating Materials (AREA)
  • Formation Of Insulating Films (AREA)
TW096116299A 2006-05-08 2007-05-08 Insulating material, process for producing electronic part/device, and electronic part/device TW200745195A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006129394 2006-05-08
JP2007099489 2007-04-05
JP2007099490 2007-04-05
JP2007104134 2007-04-11

Publications (1)

Publication Number Publication Date
TW200745195A true TW200745195A (en) 2007-12-16

Family

ID=38667771

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096116299A TW200745195A (en) 2006-05-08 2007-05-08 Insulating material, process for producing electronic part/device, and electronic part/device

Country Status (3)

Country Link
JP (1) JPWO2007129662A1 (zh)
TW (1) TW200745195A (zh)
WO (1) WO2007129662A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101977984B (zh) * 2008-03-25 2014-03-26 住友电木株式会社 环氧树脂组合物、树脂片、半固化片、多层印刷布线板及半导体装置

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008087890A1 (ja) * 2007-01-15 2010-05-06 太陽インキ製造株式会社 熱硬化性樹脂組成物
JP2009029904A (ja) * 2007-07-26 2009-02-12 Kyocera Chemical Corp 半導体封止用樹脂組成物及び樹脂封止型半導体装置
WO2009031536A1 (ja) * 2007-09-05 2009-03-12 Sekisui Chemical Co., Ltd. 絶縁シート及び積層構造体
JP5150381B2 (ja) * 2008-06-20 2013-02-20 太陽ホールディングス株式会社 熱硬化性樹脂組成物
JP4495768B2 (ja) * 2008-08-18 2010-07-07 積水化学工業株式会社 絶縁シート及び積層構造体
KR101798668B1 (ko) * 2009-06-15 2017-11-16 아지노모토 가부시키가이샤 수지 조성물 및 유기 전해액 전지
JP5760463B2 (ja) * 2010-02-19 2015-08-12 三菱レイヨン株式会社 熱硬化性樹脂組成物及び繊維強化プリプレグ
JP2011222946A (ja) * 2010-03-26 2011-11-04 Sumitomo Bakelite Co Ltd 回路基板、半導体装置、回路基板の製造方法および半導体装置の製造方法
JP2012049423A (ja) * 2010-08-30 2012-03-08 Sumitomo Bakelite Co Ltd 回路基板、半導体装置、回路基板の製造方法および半導体装置の製造方法
JP6013118B2 (ja) * 2012-09-28 2016-10-25 株式会社タムラ製作所 絶縁性接着剤組成物および回路基板
JP6217895B2 (ja) * 2013-02-14 2017-10-25 味の素株式会社 硬化性樹脂組成物
JP6183583B2 (ja) * 2013-02-14 2017-08-23 味の素株式会社 硬化性樹脂組成物
JP6308344B2 (ja) * 2013-04-08 2018-04-11 味の素株式会社 硬化性樹脂組成物
JP6026347B2 (ja) * 2013-04-23 2016-11-16 日東電工株式会社 感光性エポキシ樹脂組成物および光導波路コア層形成用硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
JP6034742B2 (ja) 2013-04-26 2016-11-30 日東電工株式会社 光導波路用感光性エポキシ樹脂組成物、光導波路形成用硬化性フィルム、およびそれを用いた光導波路ならびに光・電気伝送用混載フレキシブルプリント配線板、およびその光導波路の製法
KR20160099609A (ko) * 2013-12-13 2016-08-22 블루 큐브 아이피 엘엘씨 코어-쉘 고무를 포함하는 에폭시 조성물
TWI575016B (zh) 2015-12-03 2017-03-21 財團法人工業技術研究院 環氧樹脂組成物及包含該組成物之熱介面材料
TWI781918B (zh) * 2016-02-02 2022-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、印刷電路板及半導體裝置
JP6452080B2 (ja) * 2017-08-01 2019-01-16 味の素株式会社 硬化性樹脂組成物
JP6801608B2 (ja) * 2017-08-21 2020-12-16 味の素株式会社 樹脂組成物
JP6579500B2 (ja) * 2018-03-16 2019-09-25 味の素株式会社 硬化性樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000001610A (ja) * 1998-06-16 2000-01-07 Kanegafuchi Chem Ind Co Ltd 難燃性熱可塑性樹脂組成物
JP2001207065A (ja) * 2000-01-26 2001-07-31 Matsushita Electric Works Ltd 人造大理石用樹脂組成物
JP3802373B2 (ja) * 2001-06-06 2006-07-26 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
JP3867522B2 (ja) * 2001-06-26 2007-01-10 松下電工株式会社 エポキシ樹脂組成物及び半導体装置
JP2003064153A (ja) * 2001-08-28 2003-03-05 Matsushita Electric Works Ltd エポキシ樹脂組成物及び半導体装置
JP2003218407A (ja) * 2002-01-28 2003-07-31 Matsushita Electric Works Ltd 光半導体装置
JP2003286391A (ja) * 2002-03-28 2003-10-10 Nippon Steel Chem Co Ltd エポキシ樹脂組成物、ワニス、このエポキシ樹脂組成物を用いたフィルム状接着剤及びその硬化物
JP2003286390A (ja) * 2002-03-28 2003-10-10 Nippon Steel Chem Co Ltd エポキシ樹脂組成物、ワニス、このエポキシ樹脂組成物を用いたフィルム状接着剤及びその硬化物
JP4725704B2 (ja) * 2003-05-27 2011-07-13 味の素株式会社 多層プリント配線板の層間絶縁用樹脂組成物、接着フィルム及びプリプレグ
JP2006028274A (ja) * 2004-07-14 2006-02-02 Tokai Rubber Ind Ltd エポキシ樹脂組成物およびこれを用いたプリプレグ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101977984B (zh) * 2008-03-25 2014-03-26 住友电木株式会社 环氧树脂组合物、树脂片、半固化片、多层印刷布线板及半导体装置

Also Published As

Publication number Publication date
WO2007129662A1 (ja) 2007-11-15
JPWO2007129662A1 (ja) 2009-09-17

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