WO2009060897A1 - エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物 - Google Patents

エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物 Download PDF

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Publication number
WO2009060897A1
WO2009060897A1 PCT/JP2008/070203 JP2008070203W WO2009060897A1 WO 2009060897 A1 WO2009060897 A1 WO 2009060897A1 JP 2008070203 W JP2008070203 W JP 2008070203W WO 2009060897 A1 WO2009060897 A1 WO 2009060897A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
resin composition
cured product
producing
disclosed
Prior art date
Application number
PCT/JP2008/070203
Other languages
English (en)
French (fr)
Inventor
Masashi Kaji
Tomomi Fukunaga
Original Assignee
Nippon Steel Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co., Ltd. filed Critical Nippon Steel Chemical Co., Ltd.
Priority to JP2009540078A priority Critical patent/JP5443993B2/ja
Publication of WO2009060897A1 publication Critical patent/WO2009060897A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)

Abstract

　高熱伝導性、低熱膨張性、高耐熱性、低吸湿性及びガスバリア性等に優れた硬化物を与えるエポキシ樹脂、その製造方法、このエポキシ樹脂を用いたエポキシ樹脂組成物並びにその硬化物を提供する。 　下記一般式（２）で表されるフェノール性樹脂とエピクロルヒドリンを反応させて得られるエポキシ樹脂。エポキシ樹脂組成物はこのエポキシ樹脂と硬化剤を必須成分とする樹脂組成物であり、この硬化物はこのエポキシ樹脂組成物を硬化させて得られる。一般式（２）において、Ａは非メソゲン系の２価の芳香族基を示す。
PCT/JP2008/070203 2007-11-08 2008-11-06 エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物 WO2009060897A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009540078A JP5443993B2 (ja) 2007-11-08 2008-11-06 エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007290647 2007-11-08
JP2007-290647 2007-11-08

Publications (1)

Publication Number Publication Date
WO2009060897A1 true WO2009060897A1 (ja) 2009-05-14

Family

ID=40625784

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070203 WO2009060897A1 (ja) 2007-11-08 2008-11-06 エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物

Country Status (3)

Country Link
JP (1) JP5443993B2 (ja)
TW (1) TWI441846B (ja)
WO (1) WO2009060897A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012046616A (ja) * 2010-08-26 2012-03-08 Nippon Steel Chem Co Ltd フェノール性樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及び硬化物
JPWO2014109143A1 (ja) * 2013-01-09 2017-01-19 Jsr株式会社 感光性組成物、重合体、樹脂膜およびその製造方法ならびに電子部品
JP2017203131A (ja) * 2016-05-13 2017-11-16 日立化成株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置
JPWO2020203449A1 (ja) * 2019-03-29 2020-10-08
JP7476529B2 (ja) 2019-12-09 2024-05-01 住友ベークライト株式会社 樹脂シートおよび金属ベース基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241223A (ja) * 1985-08-19 1987-02-23 Sumitomo Chem Co Ltd エポキシ樹脂
JPS6241222A (ja) * 1985-08-19 1987-02-23 Sumitomo Chem Co Ltd エポキシ樹脂
JPH01501800A (ja) * 1986-09-15 1989-06-22 ザ　ダウ　ケミカル　カンパニー ハロゲン含有エポキシ樹脂組成物
JP2003231682A (ja) * 2002-02-06 2003-08-19 Mitsubishi Chemicals Corp ヘテロ環含有化合物およびその組成物
JP2003238655A (ja) * 2002-02-15 2003-08-27 Mitsubishi Gas Chem Co Inc 積層板用エポキシ樹脂組成物
WO2008018364A1 (fr) * 2006-08-07 2008-02-14 Nippon Steel Chemical Co., Ltd. Préimprégné, stratifié et carte de câblage imprimé

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241223A (ja) * 1985-08-19 1987-02-23 Sumitomo Chem Co Ltd エポキシ樹脂
JPS6241222A (ja) * 1985-08-19 1987-02-23 Sumitomo Chem Co Ltd エポキシ樹脂
JPH01501800A (ja) * 1986-09-15 1989-06-22 ザ　ダウ　ケミカル　カンパニー ハロゲン含有エポキシ樹脂組成物
JP2003231682A (ja) * 2002-02-06 2003-08-19 Mitsubishi Chemicals Corp ヘテロ環含有化合物およびその組成物
JP2003238655A (ja) * 2002-02-15 2003-08-27 Mitsubishi Gas Chem Co Inc 積層板用エポキシ樹脂組成物
WO2008018364A1 (fr) * 2006-08-07 2008-02-14 Nippon Steel Chemical Co., Ltd. Préimprégné, stratifié et carte de câblage imprimé

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012046616A (ja) * 2010-08-26 2012-03-08 Nippon Steel Chem Co Ltd フェノール性樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及び硬化物
JPWO2014109143A1 (ja) * 2013-01-09 2017-01-19 Jsr株式会社 感光性組成物、重合体、樹脂膜およびその製造方法ならびに電子部品
JP2017203131A (ja) * 2016-05-13 2017-11-16 日立化成株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置
JPWO2020203449A1 (ja) * 2019-03-29 2020-10-08
WO2020203449A1 (ja) * 2019-03-29 2020-10-08 Tdk株式会社 エポキシ樹脂、樹脂組成物、樹脂シート、樹脂硬化物、樹脂基板および積層基板
JP7476529B2 (ja) 2019-12-09 2024-05-01 住友ベークライト株式会社 樹脂シートおよび金属ベース基板

Also Published As

Publication number Publication date
JP5443993B2 (ja) 2014-03-19
JPWO2009060897A1 (ja) 2011-03-24
TW200936628A (en) 2009-09-01
TWI441846B (zh) 2014-06-21

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