TW200732863A - Detergent for lithography and method of forming resist pattern with the same - Google Patents
Detergent for lithography and method of forming resist pattern with the sameInfo
- Publication number
- TW200732863A TW200732863A TW095146029A TW95146029A TW200732863A TW 200732863 A TW200732863 A TW 200732863A TW 095146029 A TW095146029 A TW 095146029A TW 95146029 A TW95146029 A TW 95146029A TW 200732863 A TW200732863 A TW 200732863A
- Authority
- TW
- Taiwan
- Prior art keywords
- lithography
- detergent
- surfactant
- resist pattern
- inhibit
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/40—Monoamines or polyamines; Salts thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/04—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Atmospheric Sciences (AREA)
- Plasma & Fusion (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006004093 | 2006-01-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200732863A true TW200732863A (en) | 2007-09-01 |
TWI357539B TWI357539B (zh) | 2012-02-01 |
Family
ID=38256138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095146029A TW200732863A (en) | 2006-01-11 | 2006-12-08 | Detergent for lithography and method of forming resist pattern with the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US8367312B2 (zh) |
KR (1) | KR20080069252A (zh) |
TW (1) | TW200732863A (zh) |
WO (1) | WO2007080726A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI502064B (zh) * | 2009-03-31 | 2015-10-01 | Tokyo Ohka Kogyo Co Ltd | A microfilm cleaning solution and a method of forming a photoresist pattern using the cleaning solution |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5064952B2 (ja) * | 2006-09-29 | 2012-10-31 | 富士フイルム株式会社 | 平版印刷版用現像処理液及び平版印刷版の製版方法 |
JP4784760B2 (ja) * | 2006-10-20 | 2011-10-05 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
JP5152851B2 (ja) * | 2008-04-17 | 2013-02-27 | 国立大学法人東北大学 | 半導体装置の製造方法 |
US8168367B2 (en) | 2008-07-11 | 2012-05-01 | Shin-Etsu Chemical Co., Ltd. | Resist composition and patterning process |
JP2012516380A (ja) | 2009-01-28 | 2012-07-19 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | リソグラフツールの原位置(insitu)清浄化用配合物 |
JP5206622B2 (ja) | 2009-08-07 | 2013-06-12 | 三菱瓦斯化学株式会社 | 金属微細構造体のパターン倒壊抑制用処理液及びこれを用いた金属微細構造体の製造方法 |
US9334161B2 (en) * | 2009-10-02 | 2016-05-10 | Mitsubishi Gas Chemical Company, Inc. | Processing liquid for suppressing pattern collapse of fine metal structure and method for producing fine metal structure using same |
JP5708071B2 (ja) * | 2011-03-11 | 2015-04-30 | 富士通株式会社 | レジストパターン改善化材料、レジストパターンの形成方法、及び半導体装置の製造方法 |
US9184057B2 (en) | 2011-03-18 | 2015-11-10 | Basf Se | Method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices having patterned material layers with line-space dimensions of 50 nm and less |
JP6123334B2 (ja) | 2012-02-17 | 2017-05-10 | 三菱化学株式会社 | 半導体デバイス用洗浄液及び半導体デバイス用基板の洗浄方法 |
JP6106990B2 (ja) * | 2012-08-27 | 2017-04-05 | 富士通株式会社 | リソグラフィ用リンス剤、レジストパターンの形成方法、及び半導体装置の製造方法 |
MY181266A (en) | 2012-12-14 | 2020-12-21 | Basf Se | Use of compositions comprising a surfactant and a hydrophobizer for avoiding anti pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below |
JPWO2015163305A1 (ja) * | 2014-04-22 | 2017-04-20 | シャープ株式会社 | アクティブマトリクス基板、及びそれを備えた表示装置 |
JP6873100B2 (ja) * | 2015-07-16 | 2021-05-19 | ビーエイエスエフ・ソシエタス・エウロパエアBasf Se | スルホエステルのアンモニウム塩を含有する、欠陥を低減させるすすぎ液 |
JP6954738B2 (ja) * | 2016-12-14 | 2021-10-27 | 東京応化工業株式会社 | 親水化処理方法、及び表面処理液のセット |
KR102011879B1 (ko) * | 2018-12-28 | 2019-08-20 | 영창케미칼 주식회사 | 극자외선 리소그래피용 공정액 및 이를 사용한 패턴 형성 방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5326672A (en) * | 1992-04-23 | 1994-07-05 | Sortec Corporation | Resist patterns and method of forming resist patterns |
JPH06105683B2 (ja) | 1992-04-23 | 1994-12-21 | 株式会社ソルテック | レジストパターン形成方法 |
JP4027494B2 (ja) * | 1998-04-07 | 2007-12-26 | 花王株式会社 | リンス剤組成物 |
US20040029395A1 (en) * | 2002-08-12 | 2004-02-12 | Peng Zhang | Process solutions containing acetylenic diol surfactants |
US7521405B2 (en) | 2002-08-12 | 2009-04-21 | Air Products And Chemicals, Inc. | Process solutions containing surfactants |
JP2001023893A (ja) | 1999-07-12 | 2001-01-26 | Nec Corp | フォトレジストパターンの形成方法 |
JP3868686B2 (ja) | 1999-12-03 | 2007-01-17 | 東京応化工業株式会社 | ディフェクトの発生を抑えたホトレジストパターンの形成方法およびディフェクト低減用現像液 |
TW558736B (en) | 2000-02-26 | 2003-10-21 | Shipley Co Llc | Method of reducing defects |
JP4694686B2 (ja) * | 2000-08-31 | 2011-06-08 | 東京応化工業株式会社 | 半導体素子製造方法 |
US6451510B1 (en) * | 2001-02-21 | 2002-09-17 | International Business Machines Corporation | Developer/rinse formulation to prevent image collapse in resist |
JP2002323774A (ja) | 2001-04-25 | 2002-11-08 | Tokyo Ohka Kogyo Co Ltd | 化学増幅型レジストパターンディフェクト低減用処理剤及びそれを用いるレジストパターン形成方法 |
JP2003178944A (ja) | 2001-12-10 | 2003-06-27 | Tokyo Electron Ltd | 現像処理方法及び現像処理装置 |
JP2003178943A (ja) | 2001-12-10 | 2003-06-27 | Tokyo Electron Ltd | 現像処理方法及び現像処理装置 |
JP4045180B2 (ja) * | 2002-12-03 | 2008-02-13 | Azエレクトロニックマテリアルズ株式会社 | リソグラフィー用リンス液およびそれを用いたレジストパターン形成方法 |
JP4522408B2 (ja) * | 2003-08-19 | 2010-08-11 | マリンクロッド・ベイカー・インコーポレイテッド | マイクロエレクトロニクス用のストリッピングおよび洗浄組成物 |
WO2005076332A1 (ja) * | 2004-02-09 | 2005-08-18 | Mitsubishi Chemical Corporation | 半導体デバイス用基板洗浄液及び洗浄方法 |
JP2005336470A (ja) * | 2004-04-30 | 2005-12-08 | Sanyo Chem Ind Ltd | アルカリ洗浄剤 |
KR100617855B1 (ko) * | 2004-04-30 | 2006-08-28 | 산요가세이고교 가부시키가이샤 | 알칼리 세정제 |
-
2006
- 2006-12-08 KR KR1020087014484A patent/KR20080069252A/ko active Search and Examination
- 2006-12-08 TW TW095146029A patent/TW200732863A/zh unknown
- 2006-12-08 US US12/087,545 patent/US8367312B2/en not_active Expired - Fee Related
- 2006-12-08 WO PCT/JP2006/324526 patent/WO2007080726A1/ja active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI502064B (zh) * | 2009-03-31 | 2015-10-01 | Tokyo Ohka Kogyo Co Ltd | A microfilm cleaning solution and a method of forming a photoresist pattern using the cleaning solution |
Also Published As
Publication number | Publication date |
---|---|
US20090004608A1 (en) | 2009-01-01 |
US8367312B2 (en) | 2013-02-05 |
WO2007080726A1 (ja) | 2007-07-19 |
KR20080069252A (ko) | 2008-07-25 |
TWI357539B (zh) | 2012-02-01 |
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