Classifications

• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
  • C11D1/38—Cationic compounds
  • C11D1/40—Monoamines or polyamines; Salts thereof
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/26—Processing photosensitive materials; Apparatus therefor
  • G03F7/30—Imagewise removal using liquid means
  • G03F7/32—Liquid compositions therefor, e.g. developers
  • G03F7/322—Aqueous alkaline compositions
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
  • C11D1/02—Anionic compounds
  • C11D1/04—Carboxylic acids or salts thereof
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
  • C11D1/02—Anionic compounds
  • C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
  • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Definitions

• the present invention has been made with objects to provide a cleaning solution for lithography capable of improving non-uniformity of the pattern width (LWR: line width roughness) and fine ruggedness on the side walls of the pattern (LER: line edge roughness) to improve the resolving performance of pattern along with a decrease of the defects by subjecting the image-forming light-exposed photoresist film to the development treatment followed by the cleaning treatment and prevention of pattern falling by the water rinse without inducing size changes in the pattern before and after the cleaning treatment.
• LWR line width roughness
• LER line edge roughness
• the light sources for the fine working thereof are also under a trend of gradual shift to shorter wavelength ones from traditional UV light having a long wavelength such as the g-line (436 nm), the i-line (365 nm) and the like to the KrF excimer laser (248 nm) capable of forming a resist pattern of higher pattern resolution, leading to the current ArF excimer laser (193 nm) and further electron beams such as EB, EUV and the like shifter as a major current while developments of the process and resist materials are under progress at a high pace in order to comply with these short-wavelength light sources.
• Conventional photoresists are required to have: for instance, improved sensitivity, pattern resolution, heat resistance, focusing depth latitude, cross sectional profile of a resist pattern, aging stability resulting in the deterioration of the shape of the resist pattern due to contamination with amine and the like in a period between light exposure and post-exposure baking (PEB) and substrate dependency which changes are caused in the cross sectional profile of the resist pattern depending on various coating films on the silicon wafer such as insulating films including silicon nitride (SiN) films, semiconductor films including polycrystalline silicon (poly-Si) films and metallic films including titanium nitride (TiN) films.
• the defect means a mismatch between a resist pattern and the photomask pattern, which is detected when a resist pattern after having been developed is examined with a surface defect observation instrument, for instance, the mismatch like a difference between shapes of the patterns, occurrence of scums and contaminants, irregular coloring and coalescence between the patterns.
• the yield of the semiconductor devices decreases as the number of defects increases so that, even though the resist has the adequate resist characteristics as described above, defects make it difficult for the semiconductor devices to be effectively mass produced, while the problems thereof remain unsolved.
• the aforementioned lithographic cleaning solution for effects of decreasing defects and suppressing resist pattern falling as the objects is further required to be capable of non-uniformity of the pattern width (LWR) and fine ruggedness appearing on the side walls of the pattern (LEW) and to be capable of improving the size changes in the undesirable variations in the dimensions of the resist pattern per se.
• LWR pattern width
• LW fine ruggedness appearing on the side walls of the pattern
• the requirement is for a lithographic cleaning solution capable of satisfying all of these necessary characteristics.
• the cleaning solutions for lithography currently under use in the rinse steps to follow the development treatment include mixtures of isopropyl alcohol and water or isopropyl alcohol and Freon (JP5-299336A), aqueous solutions containing an anionic surfactant (JP2002-323773A), organic treatment solutions containing fluorine (JP2003-178943A and JP2003-178944A), a nonionic surfactant-containing rinse solution for lithography having water and ethyleneoxy group and free from any fluorine atom (JP2004-184648A) and others as the known ones.
• aqueous solutions containing a surfactant are not also suitable for preventing pattern falling and decreasing the defects since the concentration of surfactant therein should be low in order to suppress the dissolution of the resinous ingredient in the photoresist while, such a limited concentration of the surfactant leads to the increased surface tension as a disadvantage.
• JP2001-23893A a method for coating, in the course of resist-pattern forming, with a defect treating agent having a hydrophobic group and a hydrophilic group or, namely, with a surfactant but this method has shortages that the top portion of the resist pattern is rounded to degrade the orthogonality of the cross section and, in addition, film thickness reduction of the resist layer is caused by this treatment.
• a developer solution is usually supplied through a collective pipeline throughout the development treatment so that, in a semiconductor manufacturing plant wherein various resists should be used, it is necessary to exchange the treatment agent to be used corresponding to the respective resist, and to clean the device and the pipeline after each run. Consequently, this method is unsuitable.
• a method of using a composition of a rinsing agent containing a nitrogen-containing compound with a molecular weight of 45 to 10000, which has an amino group or an imino group, and a hydrocarbon group with 1 to 20 carbon atoms in the molecule, so as to inhibit falling and damage on a resist pattern occurring in a rinsing step and a drying step JP11-295902A
• JP11-295902A JP11-295902A
• the present invention has been completed with objects to provide a novel cleaning solution for lithography capable of: overcoming the shortages in the conventional cleaning solution for lithography; maintaining a low surface tension even by decreasing the concentration of the surfactant; efficiently reducing pattern falling and defects; and further improving non-uniformity of the pattern width (LWR) and fine ruggedness on the side walls of the pattern (LER) without including size changes in the resist pattern.
• a novel cleaning solution for lithography capable of: overcoming the shortages in the conventional cleaning solution for lithography; maintaining a low surface tension even by decreasing the concentration of the surfactant; efficiently reducing pattern falling and defects; and further improving non-uniformity of the pattern width (LWR) and fine ruggedness on the side walls of the pattern (LER) without including size changes in the resist pattern.
• the surface tension can be kept low so as efficiently to prevent pattern falling and to decrease the defects enabling prevention of dimensional variations in the resist pattern by using a cleaning solution for lithography containing at least one kind selected from nitrogen-containing cationic surfactants and nitrogen-containing amphoteric surfactants and an anionic surfactant, even if the concentration of the surfactants is low enough to prevent dissolution of the resinous ingredient in the photoresist composition.
• the present invention provides: a cleaning solution for lithography comprising an aqueous solution containing (A) at least one kind selected from nitrogen-containing cationic surfactants and nitrogen-containing amphoteric surfactants and (B) an anionic surfactant and; a method for forming a resist pattern by successively undertaking the steps including
• the cleaning solution of the present invention for lithography contains, as the component (A), at least one kind selected from nitrogen-containing cationic surfactants and nitrogen-containing amphoteric surfactants and, as the component (B), an anionic surfactant.
• the nitrogen-containing cationic surfactant is exemplified by, for example, amines or salt thereof, quaternary ammonium salts and amine oxides, the nitrogen atom(s) being bonded to at least one long-chain molecular chain.
• the amine can be any one of primary amines, secondary amines and tertiary amines.
• the salt of amine includes hydrochlorides, hydrobromides, borates, acetates, lactates and the like.
• Typical ones of the aforementioned long-chain molecular chain include saturated or unsaturated, straight-chain or branched-chain hydrocarbon groups which may optionally have aromatic rings such as benzene rings, naphthalene rings, pyridine rings and the like at the terminal or intermediate positions or which may optionally be interrupted by ether linkages, thioether linkages, amide linkages, ester linkages and the like at the intermediate position.
• the molecular chain interrupted by ether linkages includes a polyalkylene oxide chain and this polyalkylene oxide chain can be bonded to an aromatic group at the terminal or intermediate position.
• the substituent groups other than the long-chain molecular chain bonded to the nitrogen atom(s) are a lower alkyl group or a lower hydroxyalkyl group having 1 to 4 carbon atoms and such a substituent group is exemplified, for example, by a methyl group, ethyl group, propyl group, isopropyl group, butyl group, tert-butyl group, hydroxyethyl group, hydroxypropyl group and the like.
• the nitrogen-containing cationic surfactant preferably used as the component (A) can be exemplified by: higher amines and salts thereof such as octylamine, decylamine, dodecylamine, hexadecylamine, octadecylamine, coconut-alkyl amine, soybean-alkyl amine, stearoylethylamine and oleylamideethylamine and monomethyl, dimethyl, monoethyl, diethyl, monoethanol and diethanol derivatives thereof, hydrochlorides thereof and acetates thereof and the like; quaternary ammonium salts such as cetyltrimethylammonium chloride, cetyltrimethylammonium lactate, cetyldimethylethylammonium acetate, stearyltrimethylammonium chloride, octadecyldimethylethylammonium bromide, octadeceny
• the particularly preferable nitrogen-containing cationic surfactant as the component (A) in the present invention is an amine oxide represented by the general formula
• R is a hydrophobic molecular chain
• X and X′ are each H or OH and n and m are each an integer of 1 to 4).
• the aforementioned hydrophobic molecular chain is preferably a higher alkyl or higher hydroxyalkyl group having 8 to 20 carbon atoms.
• the aforementioned lower alkyl group (X and X′ in the formula each being H) is preferably an alkyl group having 1 to 3 carbon atoms such as a methyl group, ethyl group and propyl group.
• the lower hydroxyalkyl group (X and X′ in the formula each being OH) is preferably a hydroxyalkyl group having 1 to 4 carbon atoms such as a methylol group, hydroxyethyl group, hydroxypropyl group and hydroxybutyl group.
• the alkyl group and hydroxyalkyl group mentioned above can be any of straight-chains or branched chains.
• the two lower alkyl groups (X and X′ in the formula each being H) or lower hydroxyalkyl groups (X and X′ in the formula each being OH) bonded to the nitrogen atom are desirably identical but may be different ones.
• examples of the preferable amine oxides represented by the above-given general formula (I) include: long-chain alkyl di(lower alkyl) amine oxides such as octyl dimethyl amine oxide, dodecyl dimethyl amine oxide, decyl dimethyl amine oxide, cetyl dimethyl amine oxide, stearyl dimethyl amine oxide, myristyl dimethyl amine oxide, isohexyl diethyl amine oxide, nonyl diethyl amine oxide, lauryl diethyl amine oxide, isopentadecyl methyl ethyl amine oxide, stearyl methyl propyl amine oxide and the like; long-chain alkyl di(lower alkanol) amine oxides such as lauryl di(hydroxyethyl) amine oxide, cetyl di(ethanol) amine oxide and stearyl di(hydroxyethyl) amine oxide; long-chain alkyloxyalkyl di(
• nitrogen-containing cationic surfactants can be used singly or can be used as a combination of two kinds or more.
• the nitrogen-containing amphoteric surfactants usable here include betaines including quaternary ammonium having a nitrogen atom bonded to one long-chain alkyl group having a carboxyl group at the ⁇ -position such as ⁇ -trimethylaminomyristiric betaine and dimethylamino ⁇ -(hydroxyethyl) lauric betaine, dialkylamine carboxyalkyl betaine such as N-octadecyloxymethyl-N,N-(dimethyl or diethyl)acetic betaine, dodecylthiooxymethyl dimethyl carboxymethyl betaine and the like.
• the anionic surfactant used in combination with at least one kind selected from these nitrogen-containing cationic surfactants and nitrogen-containing amphoteric surfactants is exemplified by known ones including higher fatty acid salts, higher alkylsulfate salts, higher alkylsulfonate salts, higher alkylaryl sulfonate salts, higher alcohol phosphate salts and the like, the alkyl group having 8 to 20 carbon atoms.
• the aforementioned alkyl groups can be any of straightly or branched ones.
• the molecular chains can be interrupted by intervention of phenylene groups or oxygen atoms and can be substituted by hydroxyl groups or carboxyl groups.
• Examples of the aforementioned higher fatty acid salt include alkali salts of dodecanoic acid, tetradecanoic acid, stearic acid and the like.
• Examples of the higher alkylsulfate salt include alkali metal salts and organic amine salts of decylsulfate and dodecylsulfate.
• higher alkylsulfonate salt examples include ammonium salts and organic amine salts of higher alkylsulfonic acids such as decanesulfonic acid, dodecanesulfonic acid, tetradecanesulfonic acid, stearylsulfonic acid and the like.
• examples of the higher alkylarylsulfonate salt include ammonium salts and organic amine salts of alkylarylsulfonic acid such as dodecylbenzenesulfonic acid and decylnaphthalenesulfonic acid.
• higher alcohol phosphate salt examples include, for example, ammonium salts and organic amine salts of higher alkylphosphates such as palmitylphosphate, castor oil-alkylphosphate, coconut-alkyl phosphates and the like.
• this anionic surfactant include sulfuric acid esters, sulfonic acid esters and phosphoric acid eaters containing an alkylene group or polyalkyleneoxide group of 8 to 10 carbon atoms as a neutralized form.
• a preferable solvent for dissolving at least one kind selected from the nitrogen-containing cationic surfactants and amphoteric surfactants and the anionic surfactant is only water but it is optional to employ a mixture solvent of water and a water-miscible organic solvent, if so desired.
• the water-miscible organic solvent used in this case is preferably a monohydric or polyhydric alcoholic organic solvent.
• the aforementioned monohydric alcohol suitable for use is exemplified by methanol, ethanol and propanol
• the polyhydric alcohol suitable for use is exemplified by ethyleneglycol, propyleneglycol, diethyleneglycol and glycerin as well as alkyl etherified or esterified products thereof.
• the content of the aforementioned water-miscible organic solvent is selected in the range usually from 0.01 to 10% by mass or, preferably, from 0.1 to 5% by mass relative to the overall mass of the mixture solvent.
• the cleaning solution for lithography can be efficiently dispersed and spread over the surface thereof.
• the inventive cleaning solution for lithography that at least one kind of the nitrogen-containing cationic surfactants and the nitrogen-containing amphoteric surfactants selected from the above exemplified ones as the component (A) and the anionic surfactants selected from the above exemplified ones as the component (B) are compounded in the mass contents of 1 ppm to 1% by mass, preferably, 10 ppm to 1000 ppm, more preferably, 30 ppm to 300 ppm or, particularly preferably, 30 ppm to 200 ppm of the component (A), 1 ppm to 1% by mass, preferably, 10 ppm to 2000 ppm, more preferably, 50 ppm to 1000 ppm or, particularly preferably, 200 ppm to 700 ppm of the component (B) relative to the overall mass amount of the cleaning solution for lithography with the proviso that the mass ratio of the component (A) to the component (B) is in the range from 100:1 to 1:100.
• This mass ratio of the two components can be modified depending on the object of their use. It is possible by taking the compounding amounts of the two components within the above specified ranges to accomplish decrease of the defects, prevention of pattern falling and prevention of size changes of the resist pattern over all of the resist properties.
• the inventive cleaning solution for lithography further contains, in addition to at least one kind selected from the nitrogen-containing cationic surfactants and nitrogen-containing amphoteric surfactants and the anionic surfactant, a water-soluble polymer.
• the water-soluble polymer includes polymers of the monomers such as vinyl imidazole, vinyl imidazoline, vinyl pyrrolidone, vinyl morpholine, vinyl caprolactam, vinyl alcohol, hydroxyl alkyl esters of acrylic acid or methacrylic acid and the like as well as copolymers thereof. It is suitable that the water-soluble polymer has a mass-average molecular weight in the range of 500-1500000 or, preferably, 1000-50000.
• the compounding amount of the water-soluble polymer is selected in the range of 0.1 ppm to 10% by mass or, preferably, 10 ppm to 5% by mass relative to the overall mass of the cleaning solution for lithography.
• the inventive cleaning solution for lithography is admixed with an organic carboxylic acid to be rendered acidic with a pH of 6 or lower or admixed with a lower amine compound or a lower quaternary ammonium hydroxide to be rendered basic with a pH of 8 or higher. Addition of such compounds has an effect of preventing over-time degradation of the cleaning solution or, namely, generation of bacteria.
• the aforementioned organic carboxylic acid includes formic acid, acetic acid, propionic acid, butyric acid, isobutyric acid, glycolic acid, oxalic acid, fumaric acid, maleic acid, phthalic acid, peracetic acid, sulfuric acid, trifluoroacetic acid and the like.
• the organic carboxylic acid usable here also includes ascorbic acid.
• the aforementioned amine compound usable here includes monoethanolamine, 2-(2-aminoethoxy)ethanol and the like and the quaternary ammonium hydroxide usable here includes tetramethylammonium hydroxide, tetraethylammonium hydroxide, 2-hydroxyethyl trimethylammonium hydroxide, tetrapropylammonium hydroxide, methyl tripropylammonium hydroxide, tetrabutylammonium hydroxide, methyl tributylammonium hydroxide and the like.
• the inventive cleaning solution for lithography is employed for the treatment of a substrate at the stage following the alkali development of the photoresist film on the substrate after the image forming light-exposure.
• the treatment is undertaken by dipping the substrate bearing the photoresist film in this treatment solution or by coating with or by spraying this cleaning solution onto the photoresist film.
• a treatment time of 1 to 30 seconds would be sufficient with this cleaning solution.
• the inventive cleaning solution for lithography is suitable as a cleaning solution for cleaning a resist pattern obtained by:
• the step (1) is a step for the formation of a photoresist film on a substrate.
• the substrate for use is usually a silicon wafer. While silicon wafers of 8 inches or 12 inches or larger have entered or are entering practical applications, in particular, the problems of photoresist pattern falling and the problems of defects occurrence are becoming more and more important.
• the inventive cleaning solution for lithography is particularly effective in the process where the silicon wafers used have such a large diameter.
• the photoresist composition for the formation of a photoresist film there can be used any of known ones including, for the current lithography, those adaptable to the KrF excimer lasers (248 nm) containing a hydroxystyrene-based resin, the ArF excimer lasers (193 nm) containing an acrylic resin or a cycloolefin-based resin and the like as well as, for the future lithography, the liquid-immersion lithography under attention.
• KrF excimer lasers (248 nm) containing a hydroxystyrene-based resin
• the ArF excimer lasers (193 nm) containing an acrylic resin or a cycloolefin-based resin and the like as well as, for the future lithography, the liquid-immersion lithography under attention.
• the present invention is applicable particularly preferably to the cases of using a silicon wafer of a large diameter under the trend of lithography.
• a photoresist film is formed on a substrate such as a silicon wafer which is coated with a solution of a photoresist composition prepared in the aforementioned manner by a spinner and the like followed by a drying treatment.
• step (2) nextly, the photoresist film formed in step (1) is subjected to a selective light-exposure treatment through a photomask pattern to form a latent image followed by step (3) in which a post-exposure baking treatment or, namely, a PEB treatment, is undertaken.
• step (3) in which a post-exposure baking treatment or, namely, a PEB treatment, is undertaken.
• the photoresist film after the PEB treatment in this way is then subjected in step (4) to an alkali-development treatment.
• This alkali-development treatment is carried out, for example, by using an aqueous solution of tetramethyl ammonium hydroxide (referred to hereinbelow as an aqueous TMAH solution) in a concentration of 1 to 10% by mass or, preferably, in a concentration of 2.38% by mass.
• step (4) or, namely, the alkali-development treatment is followed by the subsequent step (5) in which the photoresist film should be subjected to a treatment with the aforementioned cleaning solution for lithography.
• the treatment time should preferably be as short as possible. Accordingly, this treatment time is selected in the range of 1 to 180 seconds.
• the treatment with this cleaning solution for lithography is conducted, for example, by coating with or by spraying the cleaning solution at the resist pattern surface or by dipping the resist pattern in the cleaning solution.
• step (6) is a step for cleaning with pure water after undertaking step (5).
• the resist pattern formation usually, one of the reasons leading to defects is that an alkali-insoluble ingredient in the photoresist composition precipitates out in the course of water rinse after the alkali development to be deposited on the surface of the photoresist film after formation of the resist pattern.
• the resist pattern surface is imparted with hydrophilicity so that redeposition of the alkali-dissolved matter in the photoresist onto the resist pattern surface can be suppressed giving rise to an assumption that a particularly great decrease is caused in the redeposition-based defects.
• An 8-inch silicon wafer was coated with an antireflection film-forming agent (a product by Brewer Science, Inc., product name “ARC-29A”) and subjected to a heat treatment at 215° C. for 60 seconds to form an antireflection film having a film thickness of 77 nm.
• the antireflection film was coated with a photoresist (a product by TOKYO OHKA KOGYO CO., product name “TARF-P7066”) followed by a heat treatment at 130° C. for 90 seconds to form a photoresist film of 215 nm film thickness.
• the photoresist film obtained in this way was subjected to a light-exposure treatment by using a light-exposure machine (a product by Nikon Corp., Model “Nikon NSR-S302A”) followed by a heat treatment at 130° C. for 90 seconds.
• a light-exposure machine a product by Nikon Corp., Model “Nikon NSR-S302A”
• a heat treatment at 130° C. for 90 seconds.
• the thus prepared hole pattern was subjected to a cleaning treatment for 7 seconds at 2000 rpm by using 100 ml of a test sample of the cleaning solution for lithography followed by drying and then the number of defects generated on this resist pattern was measured by using a surface defects observation apparatus (a product by KLA Tencor Corp., Model “KLA-2351”) to count the number of defects taking the number measured after the treatment using pure water as 100%.
• a surface defects observation apparatus a product by KLA Tencor Corp., Model “KLA-2351”
• a product name “TARF-P6111” a product by TOKYO OHKA KOGYO CO.
• cleaning solutions for lithography were prepared by dissolving, in pure water, a 1:1 by mole mixture of lauryl dimethyl amine oxide (a product by NOF Corp., product name “UNISAFE A-LM”) and a mixed alkyl (average number of carbon atoms 14) sulfonic acid trimethylamine salt (a product by Takemoto Oil & Fat Co.) in a concentration of 200 ppm, 300 ppm, 400 ppm or 500 ppm, respectively.
• lauryl dimethyl amine oxide a product by NOF Corp., product name “UNISAFE A-LM”
• UNISAFE A-LM mixed alkyl (average number of carbon atoms 14) sulfonic acid trimethylamine salt
• Table 1 shows the defects occurrence rates and the un fallen pattern ratios with these cleaning solutions.
• Two kinds of cleaning solutions for lithography were prepared by dissolving, in pure water, a 4:1 or 3:2 by moles mixture of lauryl dimethyl amine oxide (LDMO) and a mixed alkylsulfonic acid trimethylamine salt (ASTMA) in a concentration of 400 ppm, respectively.
• Table 2 shows the defects occurrence rates and the un fallen pattern ratios with these cleaning solutions.
• a cleaning solution for lithography was prepared by dissolving, in pure water, a 1:1 by mole mixture of dimethyl myristyl amine oxide (a product by NOF Corp, product name “UNISAFE A-MM”) and the same mixed alkylsulfonic acid trimethylamine salt as used in Example 1 in a concentration of 300 ppm.
• Table 3 shows the defects occurrence rate and the un fallen pattern ratio with this cleaning solution.
• a cleaning solution for lithography was prepared by dissolving, in pure water, a 1:1 by mole mixture of polyethylene glycol lauryl amine (a product by NOF Corp., product name “NYMEEN L-207”) and the same mixed alkylsulfonic acid trimethylamine salt as used in Example 1 in a concentration of 300 ppm.
• Table 3 shows the defects occurrence rate and the un fallen pattern ratio with this cleaning solution.
• An antireflection film having a film thickness of 77 nm was formed on an 8-inch silicon wafer by coating with an antireflection film-forming agent (a product by Brewer Science, Inc., product name “ARC-29A”) followed by a heating treatment at 215° C. for 60 seconds.
• This antireflection film was coated with a photoresist (a product by TOKYO OHKA KOGYO CO., product name “TARF-P7145”) followed by a heating treatment at 145° C. for 60 seconds to form a photoresist film of 180 nm film thickness.
• the thus obtained photoresist film was subjected to a light-exposure treatment by using a light-exposure machine (a product by Nikon Corp., Model “Nikon NSR-S306C”) followed by a heat treatment at 110° C. for 60 seconds.
• a light-exposure machine a product by Nikon Corp., Model “Nikon NSR-S306C”
• a heat treatment at 110° C. for 60 seconds.
• the hole pattern prepared in this way was subjected to a cleaning treatment for 7 seconds at 2000 rpm by using 100 ml of a test solution of a cleaning solution for lithography prepared by compounding lauryl dimethyl amine oxide (a product by NOF Corp., product name “UNISAFE A-LM”) and a mixed alkyl (average number of carbon atoms 14) sulfonic acid trimethylamine salt (a product by Takemoto Oil & Fat Co.) in concentrations indicated in Table 4 below followed by drying to measure the number of the defects occurred on the resist pattern by using the surface defects observation apparatus (a product by KLA Tencor Corp., Model “KLA-2351”) to count the number of defects taking the value measured after the treatment using pure water as 100%. Table 4 shows the results thereof.
• lauryl dimethyl amine oxide a product by NOF Corp., product name “UNISAFE A-LM”
• a mixed alkyl (average number of carbon atoms 14) sulfonic acid trimethylamine salt a product by Takemoto Oil
• a hole pattern of 130 nm diameter formed in the same manner as above was subjected to the cleaning treatment under the same conditions as above followed by drying and the dimension of the hole pattern was determined by SEM (scanning electron microscope) to give the diameter of the hole pattern by taking the value determined after the cleaning treatment with pure water as 100%. Table 4 shows the results thereof.
• Example 5 250 50 37 105.9
• Example 6 100 100 88 103.5
• Example 7 50 250 39 103.1
• Example 8 200 400 25 104.7
• Example 9 50 450 37 103.5
• Example 10 100 500 27 104.1
• Example 11 200 600 23 104.4
• the cleaning solution for lithography of the invention can be uniformly dispersed and diffused even on a large size wafer of 300 mm or larger.
• Improvements can be accomplished for the ruggedness in the resist pattern width generally known as the LWR (line width roughness) and fine ruggedness on the side walls of the pattern generally known as the LER (line edge roughness) resulting in improving the resolution performance of the pattern as well as an additional effect for suppression of the dimensional changes of resist pattern in the treatment with the cleaning solution.
• LWR line width roughness
• LER line edge roughness
• the present invention can be utilized in the manufacture of semiconductor devices such as LSIs, ULSIs and others using the lithographic method.

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