TW200728908A - Photosensitive dry film resist, printed wiring board using same, and method for producing printed wiring board - Google Patents

Photosensitive dry film resist, printed wiring board using same, and method for producing printed wiring board

Info

Publication number
TW200728908A
TW200728908A TW096102302A TW96102302A TW200728908A TW 200728908 A TW200728908 A TW 200728908A TW 096102302 A TW096102302 A TW 096102302A TW 96102302 A TW96102302 A TW 96102302A TW 200728908 A TW200728908 A TW 200728908A
Authority
TW
Taiwan
Prior art keywords
photosensitive layer
flame retardant
wiring board
printed wiring
dry film
Prior art date
Application number
TW096102302A
Other languages
English (en)
Inventor
Toshio Yamanaka
Koji Okada
Kohei Kojima
Hitoshi Nojiri
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of TW200728908A publication Critical patent/TW200728908A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0955—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
TW096102302A 2006-01-25 2007-01-22 Photosensitive dry film resist, printed wiring board using same, and method for producing printed wiring board TW200728908A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006016392 2006-01-25
JP2006150252 2006-05-30
JP2006171927 2006-06-21

Publications (1)

Publication Number Publication Date
TW200728908A true TW200728908A (en) 2007-08-01

Family

ID=38309175

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102302A TW200728908A (en) 2006-01-25 2007-01-22 Photosensitive dry film resist, printed wiring board using same, and method for producing printed wiring board

Country Status (5)

Country Link
US (1) US20100218984A1 (zh)
JP (1) JP5255847B2 (zh)
CN (1) CN101371197B (zh)
TW (1) TW200728908A (zh)
WO (1) WO2007086385A1 (zh)

Cited By (2)

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TWI582829B (zh) * 2015-01-23 2017-05-11 東芝股份有限公司 半導體裝置及其製造方法
TWI745329B (zh) * 2015-12-30 2021-11-11 美商富士軟片電子材料美國股份有限公司 光敏性堆疊結構體、乾膜結構體及製造其之方法、傾斜凸紋影像的製造方法、三維物體及半導體元件

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WO2009004926A1 (ja) * 2007-07-05 2009-01-08 Kaneka Corporation 感光性ドライフィルムレジスト材料、及びこれを用いたプリント配線板、並びにプリント配線板の製造方法
TWI426345B (zh) * 2007-08-20 2014-02-11 Lg Chemical Ltd 鹼溶性感光樹脂組成物以及使用其所製得之乾膜
KR101665402B1 (ko) * 2009-01-28 2016-10-12 제이에스알 가부시끼가이샤 감방사선성 수지 조성물 및, 액정 표시 소자의 스페이서 및 그의 형성 방법
CN102712755A (zh) * 2010-01-25 2012-10-03 三井化学株式会社 聚酰亚胺树脂组合物、含有该组合物的粘接剂、叠层体及组件
CN102108124A (zh) * 2010-12-30 2011-06-29 上海市合成树脂研究所 一种可熔性聚酰亚胺模塑料的制备方法
KR101478301B1 (ko) * 2011-08-30 2014-12-31 주식회사 엘지화학 고분자 수지 조성물, 폴리이미드 수지 필름, 폴리이미드 수지 필름의 제조 방법, 금속 적층체 및 회로 기판
JP5814749B2 (ja) * 2011-11-10 2015-11-17 日東電工株式会社 ポリイミド前駆体組成物およびそれを用いた配線回路基板
WO2014115637A1 (ja) * 2013-01-22 2014-07-31 東レ株式会社 接着剤組成物、接着剤シートならびにこれらを用いた硬化物および半導体装置
KR101959648B1 (ko) * 2014-10-14 2019-03-18 다이요 잉키 세이조 가부시키가이샤 적층 구조체
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CN104536266B (zh) * 2015-01-30 2018-08-07 杭州福斯特应用材料股份有限公司 一种干膜抗蚀剂层压体
US10365559B2 (en) * 2015-03-04 2019-07-30 Toray Industries, Inc. Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device
WO2016172092A1 (en) * 2015-04-21 2016-10-27 Fujifilm Electronic Materials U.S.A., Inc. Photosensitive polyimide compositions
CN110419000B (zh) * 2017-03-15 2023-07-28 东丽株式会社 感光性硅氧烷树脂组合物、固化膜及触摸面板用构件
KR20210018966A (ko) * 2018-07-09 2021-02-18 어플라이드 머티어리얼스, 인코포레이티드 라인 배가를 위한 포토레지스트 조성물
CN114545734B (zh) * 2022-03-09 2022-08-12 珠海市能动科技光学产业有限公司 一种阻焊干膜光阻剂、其制备方法及应用
CN115236936B (zh) * 2022-09-22 2022-12-06 之江实验室 一种飞秒激光固化交联的聚酰胺酸光刻胶及其制备方法、使用方法和应用

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Publication number Priority date Publication date Assignee Title
TWI582829B (zh) * 2015-01-23 2017-05-11 東芝股份有限公司 半導體裝置及其製造方法
US9891524B2 (en) 2015-01-23 2018-02-13 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
TWI745329B (zh) * 2015-12-30 2021-11-11 美商富士軟片電子材料美國股份有限公司 光敏性堆疊結構體、乾膜結構體及製造其之方法、傾斜凸紋影像的製造方法、三維物體及半導體元件
US11175582B2 (en) 2015-12-30 2021-11-16 Fujifilm Electronic Materials U.S.A., Inc. Photosensitive stacked structure

Also Published As

Publication number Publication date
WO2007086385A1 (ja) 2007-08-02
CN101371197B (zh) 2012-12-26
JP5255847B2 (ja) 2013-08-07
JPWO2007086385A1 (ja) 2009-06-18
US20100218984A1 (en) 2010-09-02
CN101371197A (zh) 2009-02-18

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