BRPI0509409B8 - Papel de aramida e processo de produção de papel de aramida - Google Patents

Papel de aramida e processo de produção de papel de aramida

Info

Publication number
BRPI0509409B8
BRPI0509409B8 BRPI0509409A BRPI0509409A BRPI0509409B8 BR PI0509409 B8 BRPI0509409 B8 BR PI0509409B8 BR PI0509409 A BRPI0509409 A BR PI0509409A BR PI0509409 A BRPI0509409 A BR PI0509409A BR PI0509409 B8 BRPI0509409 B8 BR PI0509409B8
Authority
BR
Brazil
Prior art keywords
aramid paper
production process
aramid
paper production
flake
Prior art date
Application number
BRPI0509409A
Other languages
English (en)
Inventor
R Levit Mikhail
Original Assignee
Du Pont
Dupont Safety & Construction Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont, Dupont Safety & Construction Inc filed Critical Du Pont
Publication of BRPI0509409A publication Critical patent/BRPI0509409A/pt
Publication of BRPI0509409B1 publication Critical patent/BRPI0509409B1/pt
Publication of BRPI0509409B8 publication Critical patent/BRPI0509409B8/pt

Links

Classifications

    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10—Organic non-cellulose fibres
    • D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H13/26—Polyamides; Polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
    • D21H25/005—Mechanical treatment
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
    • D21H25/04—Physical treatment, e.g. heating, irradiating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Paper (AREA)

Abstract

"PAPEL DE ARAMIDA, PLACAS DE FIAÇÃO IMPRESSA, MATERIAIS ISOLANTES ELÉTRICOS, ESTRUTURA COMPÓSITA, MATERIAL ESTRUTURAL E PROCESSO DE PRODUÇÃO DE PAPEL DE ARAMIDA". A presente invenção refere-se a um papel de aramida que é apropriado para estruturas compósitas e que é produzido ao se utilizar uma combinação de polpa de aramida, floco e, opcionalmente, um material aglutinante polimérico.
BRPI0509409A 2004-04-16 2005-04-15 Papel de aramida e processo de produção de papel de aramida BRPI0509409B8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/826,530 US20050230072A1 (en) 2004-04-16 2004-04-16 Aramid paper blend
PCT/US2005/012996 WO2005103376A1 (en) 2004-04-16 2005-04-15 Aramid paper blend

Publications (3)

Publication Number Publication Date
BRPI0509409A BRPI0509409A (pt) 2007-09-04
BRPI0509409B1 BRPI0509409B1 (pt) 2015-12-22
BRPI0509409B8 true BRPI0509409B8 (pt) 2023-01-31

Family

ID=34967398

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0509409A BRPI0509409B8 (pt) 2004-04-16 2005-04-15 Papel de aramida e processo de produção de papel de aramida

Country Status (7)

Country Link
US (1) US20050230072A1 (pt)
EP (1) EP1756360B1 (pt)
JP (2) JP2007532798A (pt)
CN (1) CN1942629B (pt)
BR (1) BRPI0509409B8 (pt)
CA (1) CA2561329C (pt)
WO (1) WO2005103376A1 (pt)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7455750B2 (en) * 2004-06-25 2008-11-25 E.I. Du Pont De Nemours And Company Meta- and para-aramid pulp and processes of making same
JP4297163B2 (ja) * 2004-10-08 2009-07-15 パナソニック株式会社 多層回路基板の製造方法
WO2007076364A2 (en) * 2005-12-21 2007-07-05 E.I. Du Pont De Nemours And Company Pipd paper and components made therefrom
JP2009521620A (ja) * 2005-12-21 2009-06-04 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Ｐｉｐｄパルプを含んでなる紙およびその製造方法
US7740741B2 (en) 2005-12-21 2010-06-22 E.I. Du Pont De Nemours And Company Para-aramid pulp including meta-aramid fibrids and processes of making same
EP1969181A2 (en) * 2005-12-21 2008-09-17 E.I. Du Pont De Nemours And Company Paper comprising pipd floc and process for making the same
US20080145602A1 (en) * 2006-12-15 2008-06-19 Gary Lee Hendren Processes for making shaped honeycomb and honeycombs made thereby
US7815993B2 (en) * 2006-12-15 2010-10-19 E.I. Du Pont De Nemours And Company Honeycomb from paper having flame retardant thermoplastic binder
US7771810B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from paper having a high melt point thermoplastic fiber
US8025949B2 (en) * 2006-12-15 2011-09-27 E.I. Du Pont De Nemours And Company Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom
US7771811B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from controlled porosity paper
US8268434B2 (en) * 2007-11-30 2012-09-18 E I Du Pont De Nemours And Company Honeycomb having a high compression strength and articles made from same
US8118975B2 (en) * 2007-12-21 2012-02-21 E. I. Du Pont De Nemours And Company Papers containing fibrids derived from diamino diphenyl sulfone
US7803247B2 (en) * 2007-12-21 2010-09-28 E.I. Du Pont De Nemours And Company Papers containing floc derived from diamino diphenyl sulfone
US8114251B2 (en) * 2007-12-21 2012-02-14 E.I. Du Pont De Nemours And Company Papers containing fibrids derived from diamino diphenyl sulfone
US20090214818A1 (en) * 2008-02-26 2009-08-27 E. I. Du Pont De Nemours And Company Core having a high shear strength and articles made from same
WO2012093048A1 (en) 2011-01-04 2012-07-12 Teijin Aramid B.V. Electrical insulating paper
CN102174770A (zh) * 2011-01-27 2011-09-07 深圳昊天龙邦复合材料有限公司 包含芳族合成纤维纸的半固化片和由其制得的印刷电路板
US9666848B2 (en) 2011-05-20 2017-05-30 Dreamweaver International, Inc. Single-layer lithium ion battery separator
WO2013117462A1 (en) 2012-02-07 2013-08-15 Teijin Aramid B.V. Aramid paper having increased strength and process for manufacturing thereof
JP6096281B2 (ja) * 2012-04-18 2017-03-15 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 多層シート
US9428864B2 (en) * 2012-04-18 2016-08-30 E I Du Pont De Nemours And Company Multilayered sheet
CA2868103A1 (en) * 2012-04-18 2013-10-24 E. I. Du Pont De Nemours And Company Multilayered sheet
US8936878B2 (en) 2012-11-20 2015-01-20 Dreamweaver International, Inc. Methods of making single-layer lithium ion battery separators having nanofiber and microfiber components
WO2014079761A1 (en) * 2012-11-23 2014-05-30 Teijin Aramid B.V. Electrical insulating paper
JP6217894B2 (ja) * 2013-02-08 2017-10-25 デュポン帝人アドバンスドペーパー株式会社 着色アラミド紙及びその製造方法
CN105579641B (zh) * 2013-07-18 2018-12-18 帝人芳纶有限公司 阻燃片材
KR101515307B1 (ko) * 2013-12-30 2015-04-24 도레이케미칼 주식회사 고평량 메타 아라미드 페이퍼 및 그 제조방법
KR101524788B1 (ko) * 2013-12-30 2015-06-01 도레이케미칼 주식회사 저평량 메타 아라미드 페이퍼 및 그 제조방법
US9976258B2 (en) * 2014-10-03 2018-05-22 E I Du Pont De Nemours And Company Honeycomb core having a high compression strength
KR101547776B1 (ko) 2014-11-24 2015-09-07 한국섬유개발연구원 허니컴용 아라미드 습식부직포 및 그 제조방법
JP6405583B2 (ja) * 2014-12-26 2018-10-17 特種東海製紙株式会社 絶縁紙
US10407829B2 (en) 2015-05-28 2019-09-10 Kolon Industries, Inc. Aramid paper, manufacturing method therefor, and use thereof
KR101700827B1 (ko) * 2015-05-28 2017-01-31 코오롱인더스트리 주식회사 적층 아라미드 종이 및 그 제조방법
US10245804B2 (en) 2015-10-16 2019-04-02 Hexcel Corporation Fire retarded aramid fiber-based honeycomb
US10767316B2 (en) * 2017-11-01 2020-09-08 Dupont Safety & Construction, Inc. Paper comprising aramid pulp and a friction paper made therefrom
KR102201806B1 (ko) * 2018-02-22 2021-01-11 코오롱인더스트리 주식회사 전기 절연지용 전방향족 아라미드 종이 및 그의 제조방법
US11686048B2 (en) * 2018-05-28 2023-06-27 Teijin Aramid B.V. Aramid-based paper with improved properties
US11078627B2 (en) 2018-08-14 2021-08-03 Dupont Safety & Construction, Inc. High tensile strength paper suitable for use in electrochemical cells

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NL246230A (pt) * 1958-12-09
US3756908A (en) * 1971-02-26 1973-09-04 Du Pont Synthetic paper structures of aromatic polyamides
US4729921A (en) * 1984-10-19 1988-03-08 E. I. Du Pont De Nemours And Company High density para-aramid papers
US4698267A (en) * 1985-09-17 1987-10-06 E. I. Du Pont De Nemours And Company High density para-aramid papers
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WO1995014815A1 (en) * 1993-11-29 1995-06-01 Akzo Nobel N.V. Process for preparing para-aromatic polyamide paper
DE69408170T2 (de) * 1993-12-21 1998-08-20 Du Pont Aramidpapier mit hoher widerstandsfaehigkeit und bedruckbarkeit und einer glatten schichtenfoermigen oberflaeche
JP3340549B2 (ja) * 1994-03-01 2002-11-05 帝人株式会社 多孔性アラミド成形物の製造方法
EP0739707B1 (en) * 1995-04-28 2000-06-14 Showa Aircraft Industry Co., Ltd. Honeycomb core
JPH10131017A (ja) * 1996-02-21 1998-05-19 Shin Kobe Electric Mach Co Ltd 積層板用基材及びその製造法ならびにプリプレグ及び積層板
JPH1072752A (ja) * 1996-05-15 1998-03-17 Matsushita Electric Ind Co Ltd プリント配線板用不織布基材とこれを用いたプリプレグ
JPH10212688A (ja) * 1997-01-20 1998-08-11 Shin Kobe Electric Mach Co Ltd 積層板用基材の製造法及びその製造に用いる混抄不織布
US5833807A (en) * 1997-04-17 1998-11-10 E. I. Du Pont De Nemours And Company Aramid dispersions and aramid sheets of increased uniformity
JP3206500B2 (ja) * 1997-07-02 2001-09-10 王子製紙株式会社 積層板基材用原料の処理方法
JP3869559B2 (ja) * 1998-09-28 2007-01-17 新神戸電機株式会社 電気絶縁用不織布ならびにプリプレグ及び積層板
JP3631385B2 (ja) * 1998-11-18 2005-03-23 王子製紙株式会社 積層板用基材およびその製造方法
JP2000273788A (ja) * 1999-01-21 2000-10-03 Toray Ind Inc パラ系芳香族ポリアミド繊維紙およびその製造方法
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JP3321141B2 (ja) * 2000-04-03 2002-09-03 昭和飛行機工業株式会社 アラミドハニカムおよびその製造方法
US6592963B1 (en) * 2000-06-16 2003-07-15 E. I. Du Pont De Nemours And Company Honeycomb structure
US6303221B1 (en) * 2000-12-07 2001-10-16 E. I. Du Pont De Nemours And Company Two-component pulp reinforcement
US20020142689A1 (en) * 2001-01-23 2002-10-03 Levit Mikhail R. Non-woven sheet of aramid floc
US6436236B1 (en) * 2001-03-05 2002-08-20 E. I. Du Pont De Nemours & Company Electrically-conductive para-aramid pulp
JP4287622B2 (ja) * 2002-06-28 2009-07-01 デュポン帝人アドバンスドペーパー株式会社 コーティングセパレータ、その製造方法およびそれを用いた電気電子部品
US7459044B2 (en) * 2002-08-26 2008-12-02 E. I. Du Pont De Nemours And Company Sheet material especially useful for circuit boards
US20040071952A1 (en) * 2002-10-01 2004-04-15 Anderson David Wayne Aramid paper laminate
JP2005200545A (ja) * 2004-01-15 2005-07-28 Yokohama Rubber Co Ltd:The ホース補強層間ゴム組成物およびこれを用いたホース
US20050284595A1 (en) * 2004-06-25 2005-12-29 Conley Jill A Cellulosic and para-aramid pulp and processes of making same
US20060266486A1 (en) * 2005-05-26 2006-11-30 Levit Mikhail R Electroconductive aramid paper

Also Published As

Publication number Publication date
BRPI0509409A (pt) 2007-09-04
EP1756360A1 (en) 2007-02-28
CN1942629A (zh) 2007-04-04
CA2561329A1 (en) 2005-11-03
CN1942629B (zh) 2010-04-07
WO2005103376A1 (en) 2005-11-03
EP1756360B1 (en) 2012-08-15
JP5686688B2 (ja) 2015-03-18
BRPI0509409B1 (pt) 2015-12-22
CA2561329C (en) 2014-07-15
JP2007532798A (ja) 2007-11-15
JP2011219913A (ja) 2011-11-04
US20050230072A1 (en) 2005-10-20

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 22/12/2015, OBSERVADAS AS CONDICOES LEGAIS.

B25A Requested transfer of rights approved