WO2009004926A1 - 感光性ドライフィルムレジスト材料、及びこれを用いたプリント配線板、並びにプリント配線板の製造方法 - Google Patents

感光性ドライフィルムレジスト材料、及びこれを用いたプリント配線板、並びにプリント配線板の製造方法 Download PDF

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Publication number
WO2009004926A1
WO2009004926A1 PCT/JP2008/061134 JP2008061134W WO2009004926A1 WO 2009004926 A1 WO2009004926 A1 WO 2009004926A1 JP 2008061134 W JP2008061134 W JP 2008061134W WO 2009004926 A1 WO2009004926 A1 WO 2009004926A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
dry film
photosensitive dry
film resist
Prior art date
Application number
PCT/JP2008/061134
Other languages
English (en)
French (fr)
Inventor
Koji Okada
Toshio Yamanaka
Tomohiro Koda
Original Assignee
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to JP2009521575A priority Critical patent/JP5378213B2/ja
Publication of WO2009004926A1 publication Critical patent/WO2009004926A1/ja

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)

Abstract

　本発明は、水系現像が可能で、解像度、難燃性、密着性、耐湿性、電気信頼性に優れた感光性ドライフィルムレジスト材料、及びこれを用いたプリント配線板、並びにその製造方法を提供する。支持フィルム（２）上に、感光性ドライフィルムレジスト（３）が設けられた感光性ドライフィルムレジスト材料（１）において、感光性ドライフィルムレジスト（３）の表面（４）（支持フィルム（２）と接する面）におけるリン原子の存在比よりも、感光性ドライフィルムレジスト（３）の表面（５）（表面（４）の裏側に位置する面）におけるリン原子の存在比のほうが小さくなるようにする。
PCT/JP2008/061134 2007-07-05 2008-06-18 感光性ドライフィルムレジスト材料、及びこれを用いたプリント配線板、並びにプリント配線板の製造方法 WO2009004926A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009521575A JP5378213B2 (ja) 2007-07-05 2008-06-18 感光性ドライフィルムレジスト材料、及びこれを用いたプリント配線板、並びにプリント配線板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-177757 2007-07-05
JP2007177757 2007-07-05

Publications (1)

Publication Number Publication Date
WO2009004926A1 true WO2009004926A1 (ja) 2009-01-08

Family

ID=40225977

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061134 WO2009004926A1 (ja) 2007-07-05 2008-06-18 感光性ドライフィルムレジスト材料、及びこれを用いたプリント配線板、並びにプリント配線板の製造方法

Country Status (2)

Country Link
JP (1) JP5378213B2 (ja)
WO (1) WO2009004926A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018030974A (ja) * 2016-08-26 2018-03-01 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、積層樹脂シート、樹脂シート、及びプリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10115919A (ja) * 1996-08-02 1998-05-06 E I Du Pont De Nemours & Co プリント回路を被覆する可撓性、難燃性、および光画像形成性組成物
JP2004157188A (ja) * 2002-11-01 2004-06-03 Kanegafuchi Chem Ind Co Ltd 感光性樹脂組成物およびこれを用いた感光性ドライフィルムレジスト、並びに、これらを用いたフレキシブルプリント配線板
WO2007086385A1 (ja) * 2006-01-25 2007-08-02 Kaneka Corporation 感光性ドライフィルムレジスト、これを用いたプリント配線板、および、プリント配線板の製造方法
JP2008065312A (ja) * 2006-07-19 2008-03-21 E I Du Pont De Nemours & Co 難燃性の多層光画像形成性カバーレイ組成物およびそれに関連する方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10115919A (ja) * 1996-08-02 1998-05-06 E I Du Pont De Nemours & Co プリント回路を被覆する可撓性、難燃性、および光画像形成性組成物
JP2004157188A (ja) * 2002-11-01 2004-06-03 Kanegafuchi Chem Ind Co Ltd 感光性樹脂組成物およびこれを用いた感光性ドライフィルムレジスト、並びに、これらを用いたフレキシブルプリント配線板
WO2007086385A1 (ja) * 2006-01-25 2007-08-02 Kaneka Corporation 感光性ドライフィルムレジスト、これを用いたプリント配線板、および、プリント配線板の製造方法
JP2008065312A (ja) * 2006-07-19 2008-03-21 E I Du Pont De Nemours & Co 難燃性の多層光画像形成性カバーレイ組成物およびそれに関連する方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018030974A (ja) * 2016-08-26 2018-03-01 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、積層樹脂シート、樹脂シート、及びプリント配線板

Also Published As

Publication number Publication date
JPWO2009004926A1 (ja) 2010-08-26
JP5378213B2 (ja) 2013-12-25

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