TW200640979A - Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same - Google Patents

Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same

Info

Publication number
TW200640979A
TW200640979A TW095106767A TW95106767A TW200640979A TW 200640979 A TW200640979 A TW 200640979A TW 095106767 A TW095106767 A TW 095106767A TW 95106767 A TW95106767 A TW 95106767A TW 200640979 A TW200640979 A TW 200640979A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
same
cured product
resin composition
producing
Prior art date
Application number
TW095106767A
Other languages
English (en)
Other versions
TWI351412B (en
Inventor
Hisataka Ito
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200640979A publication Critical patent/TW200640979A/zh
Application granted granted Critical
Publication of TWI351412B publication Critical patent/TWI351412B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3236—Heterocylic compounds
    • C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
TW95106767A 2005-03-01 2006-03-01 Cured product of epoxy resin composition and metho TWI351412B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005056027A JP4799883B2 (ja) 2005-03-01 2005-03-01 エポキシ樹脂組成物硬化体およびその製法ならびにそれを用いた光半導体装置

Publications (2)

Publication Number Publication Date
TW200640979A true TW200640979A (en) 2006-12-01
TWI351412B TWI351412B (en) 2011-11-01

Family

ID=36946250

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95106767A TWI351412B (en) 2005-03-01 2006-03-01 Cured product of epoxy resin composition and metho

Country Status (6)

Country Link
US (1) US20060204761A1 (zh)
JP (1) JP4799883B2 (zh)
KR (1) KR100830776B1 (zh)
CN (1) CN100381497C (zh)
MY (1) MY151073A (zh)
TW (1) TWI351412B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504664B (zh) * 2009-09-07 2015-10-21 Nitto Denko Corp 光學半導體裝置用樹脂組合物、使用其所得之光學半導體裝置導線架、及光學半導體裝置

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MY143212A (en) * 2005-03-01 2011-03-31 Nitto Denko Corp Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
KR100693463B1 (ko) * 2005-10-21 2007-03-12 한국광기술원 2 이상의 물질을 포함하는 봉지층을 구비한 광 확산 발광다이오드
KR101308349B1 (ko) * 2006-11-15 2013-09-17 히타치가세이가부시끼가이샤 열경화성 광반사용 수지 조성물의 제조방법
JP5207658B2 (ja) * 2007-05-17 2013-06-12 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物およびその硬化体ならびにそれを用いた光半導体装置
US20100209701A1 (en) * 2007-06-28 2010-08-19 Lg Chem, Ltd. Method for manufacturing transparent plastic film and transparent plastic film manufactured by the method
JP2010144015A (ja) * 2008-12-17 2010-07-01 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
KR101124349B1 (ko) * 2009-08-03 2012-03-19 대주전자재료 주식회사 에폭시 혼성 수지 조성물 및 이로써 피복된 발광 반도체 소자
JP5488326B2 (ja) * 2009-09-01 2014-05-14 信越化学工業株式会社 光半導体装置用白色熱硬化性シリコーンエポキシ混成樹脂組成物及びその製造方法並びにプレモールドパッケージ及びｌｅｄ装置
TWI456810B (zh) 2009-09-15 2014-10-11 Maintek Comp Suzhou Co Ltd 發光二極體
WO2011034138A1 (ja) * 2009-09-18 2011-03-24 株式会社日本触媒 硬化成型体の製造方法及び硬化成型体
JP5319567B2 (ja) * 2010-01-25 2013-10-16 日東電工株式会社 光半導体装置用エポキシ樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置
JP5638812B2 (ja) 2010-02-01 2014-12-10 株式会社ダイセル 硬化性エポキシ樹脂組成物
CN101805577A (zh) * 2010-04-09 2010-08-18 东莞市天环科技有限公司 一种透明环氧树脂封装胶粘剂
WO2012066902A1 (ja) * 2010-11-17 2012-05-24 株式会社村田製作所 封止用樹脂シートの製造方法
JP2012116890A (ja) * 2010-11-29 2012-06-21 Hitachi Chemical Co Ltd 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP5647071B2 (ja) * 2011-05-24 2014-12-24 日東電工株式会社 光半導体装置用エポキシ樹脂組成物およびそれを用いた光半導体装置
JP5875269B2 (ja) * 2011-07-13 2016-03-02 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP2013023661A (ja) * 2011-07-25 2013-02-04 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
CN103666364B (zh) * 2012-09-13 2015-09-16 东睦新材料集团股份有限公司 金属软磁复合材料用有机绝缘粘结剂及制备金属软磁复合材料方法
CN103862048B (zh) * 2012-12-07 2015-12-02 中国科学院理化技术研究所 一种通过热压制备软磁性复合材料的方法
CN103013282B (zh) * 2012-12-14 2015-02-25 江门市江海区亿宏光电有限公司 一种抗光衰led固晶绝缘胶
TWI661037B (zh) * 2014-12-03 2019-06-01 日商信越化學工業股份有限公司 光半導體元件封裝用熱固性環氧樹脂組合物及使用其的光半導體裝置
CN104448714B (zh) * 2014-12-24 2017-01-25 中科院广州化学有限公司 Led封装用有机氟无规共聚物改性环氧材料及其制法
CN113166376A (zh) * 2018-11-29 2021-07-23 Dic株式会社 双液固化型环氧树脂组合物、固化物、纤维增强复合材料及成形品
KR20210038011A (ko) 2019-09-30 2021-04-07 동우 화인켐 주식회사 에폭시 수지 조성물 및 이를 포함하는 반도체 소자용 밀봉재
TWI777406B (zh) * 2021-02-08 2022-09-11 台虹應用材料股份有限公司 封裝膠結構、電子裝置以及電子裝置的封裝方法
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Publication number Priority date Publication date Assignee Title
TWI504664B (zh) * 2009-09-07 2015-10-21 Nitto Denko Corp 光學半導體裝置用樹脂組合物、使用其所得之光學半導體裝置導線架、及光學半導體裝置

Also Published As

Publication number Publication date
TWI351412B (en) 2011-11-01
KR20060099408A (ko) 2006-09-19
JP4799883B2 (ja) 2011-10-26
JP2006241230A (ja) 2006-09-14
CN1827684A (zh) 2006-09-06
MY151073A (en) 2014-03-31
CN100381497C (zh) 2008-04-16
KR100830776B1 (ko) 2008-05-20
US20060204761A1 (en) 2006-09-14

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