KR20060099408A - 에폭시 수지 조성물의 경화 생성물, 그 제조 방법 및 그경화 생성물을 사용하는 광반도체 장치 - Google Patents
에폭시 수지 조성물의 경화 생성물, 그 제조 방법 및 그경화 생성물을 사용하는 광반도체 장치 Download PDFInfo
- Publication number
- KR20060099408A KR20060099408A KR1020060019510A KR20060019510A KR20060099408A KR 20060099408 A KR20060099408 A KR 20060099408A KR 1020060019510 A KR1020060019510 A KR 1020060019510A KR 20060019510 A KR20060019510 A KR 20060019510A KR 20060099408 A KR20060099408 A KR 20060099408A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- cured product
- component
- silicone resin
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 144
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 144
- 239000000203 mixture Substances 0.000 title claims abstract description 109
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920002050 silicone resin Polymers 0.000 claims abstract description 80
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 38
- 239000002245 particle Substances 0.000 claims abstract description 38
- 239000004065 semiconductor Substances 0.000 claims abstract description 35
- 230000003287 optical effect Effects 0.000 claims abstract description 33
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 26
- 239000004593 Epoxy Substances 0.000 claims abstract description 14
- 238000005538 encapsulation Methods 0.000 claims abstract description 13
- 239000000243 solution Substances 0.000 claims description 26
- 238000002156 mixing Methods 0.000 claims description 21
- 239000011259 mixed solution Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 4
- 238000011049 filling Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 abstract description 18
- 239000011342 resin composition Substances 0.000 abstract description 8
- 239000000047 product Substances 0.000 description 66
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 51
- -1 methylnadic acid Anhydrides Chemical class 0.000 description 23
- 238000000034 method Methods 0.000 description 21
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 15
- 239000007788 liquid Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 125000003545 alkoxy group Chemical group 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 9
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 230000007423 decrease Effects 0.000 description 9
- 230000009477 glass transition Effects 0.000 description 9
- 150000002430 hydrocarbons Chemical group 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 238000001878 scanning electron micrograph Methods 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 125000005375 organosiloxane group Chemical group 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- 238000001721 transfer moulding Methods 0.000 description 5
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 4
- 239000005046 Chlorosilane Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000003607 modifier Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 239000007858 starting material Substances 0.000 description 4
- 239000003826 tablet Substances 0.000 description 4
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 239000012264 purified product Substances 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000005055 methyl trichlorosilane Substances 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical class C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000005054 phenyltrichlorosilane Substances 0.000 description 2
- 150000003018 phosphorus compounds Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000011856 silicon-based particle Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 230000001131 transforming effect Effects 0.000 description 2
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- PMUPSYZVABJEKC-UHFFFAOYSA-N 1-methylcyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)CCCCC1C(O)=O PMUPSYZVABJEKC-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 1
- 125000005999 2-bromoethyl group Chemical group 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 125000003229 2-methylhexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- CSHJJWDAZSZQBT-UHFFFAOYSA-N 7a-methyl-4,5-dihydro-3ah-2-benzofuran-1,3-dione Chemical class C1=CCCC2C(=O)OC(=O)C21C CSHJJWDAZSZQBT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910018879 Pt—Pd Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 125000004212 difluorophenyl group Chemical group 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- FPVGTPBMTFTMRT-NSKUCRDLSA-L fast yellow Chemical compound [Na+].[Na+].C1=C(S([O-])(=O)=O)C(N)=CC=C1\N=N\C1=CC=C(S([O-])(=O)=O)C=C1 FPVGTPBMTFTMRT-NSKUCRDLSA-L 0.000 description 1
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical class O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 125000006178 methyl benzyl group Chemical group 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 150000001367 organochlorosilanes Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000001712 tetrahydronaphthyl group Chemical group C1(CCCC2=CC=CC=C12)* 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3236—Heterocylic compounds
- C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (4)
- (A) 에폭시 수지,(B) 산 무수물 경화제,(C) 상기 성분 (A) 에폭시 수지와 용융-혼합될 수 있는 실리콘 수지, 및(D) 경화 촉진제를 포함하되, 입자 크기가 1 내지 100 nm 인 상기 성분 (C) 실리콘 수지의 입자들이 경화 생성물 중에 균일하게 분산되어 있는 것을 특징으로 하는 광반도체 소자 봉입용 에폭시 수지 조성물의 경화 생성물.
- (A) 에폭시 수지 및 (C) 상기 성분 (A) 에폭시 수지와 용융-혼합될 수 있는 실리콘 수지를 용융-혼합함으로써 에폭시 수지-실리콘 수지 용액을 제조하는 단계;(B) 산 무수물 경화제, (D) 경화 촉진제 및 기타 블렌드 성분들을 혼합함으로써 형성된 경화제 용액을 제조하는 단계; 및상기 에폭시 수지-실리콘 수지 용액과 상기 경화제 용액을 혼합하고, 그 혼합 용액을 주형에 충전하여, 그 혼합 용액을 경화시키는 단계를 포함하는 것을 특징으로 하는 광반도체 소자 봉입용 에폭시 수지 조성물의 경화 생성물을 제조하는 방법.
- (A) 에폭시 수지 및 (B) 산 무수물 경화제를 가열 및 혼합하고, 이것에 (C) 상기 성분 (A) 에폭시 수지와 용융-혼합될 수 있는 실리콘 수지, (D) 경화 촉진제 및 기타 블렌드 성분들을 첨가하고 혼합함으로써 에폭시 수지 조성물을 제조하는 단계; 및상기 에폭시 수지 조성물을 반 경화 상태로 제공하고, 그 반 경화 상태의 에폭시 수지 조성물을 소정의 주형에 넣고, 그 에폭시 수지 조성물을 경화시키는 단계를 포함하는 것을 특징으로 하는 광반도체 소자 봉입용 에폭시 수지 조성물의 경화 생성물을 제조하는 방법.
- 제 1 항에 따른 에폭시 수지 조성물의 경화 생성물을 포함하는 봉입용 수지 층에 의해 광반도체 소자가 봉입된 것을 특징으로 하는 광반도체 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005056027A JP4799883B2 (ja) | 2005-03-01 | 2005-03-01 | エポキシ樹脂組成物硬化体およびその製法ならびにそれを用いた光半導体装置 |
JPJP-P-2005-00056027 | 2005-03-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060099408A true KR20060099408A (ko) | 2006-09-19 |
KR100830776B1 KR100830776B1 (ko) | 2008-05-20 |
Family
ID=36946250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060019510A KR100830776B1 (ko) | 2005-03-01 | 2006-02-28 | 에폭시 수지 조성물의 경화체, 그 제조방법 및 그 경화체를 사용한 광반도체 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060204761A1 (ko) |
JP (1) | JP4799883B2 (ko) |
KR (1) | KR100830776B1 (ko) |
CN (1) | CN100381497C (ko) |
MY (1) | MY151073A (ko) |
TW (1) | TWI351412B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210038011A (ko) | 2019-09-30 | 2021-04-07 | 동우 화인켐 주식회사 | 에폭시 수지 조성물 및 이를 포함하는 반도체 소자용 밀봉재 |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100830775B1 (ko) * | 2005-03-01 | 2008-05-20 | 닛토덴코 가부시키가이샤 | 광반도체 소자 봉지용 에폭시 수지 조성물 및 이를 이용한 광반도체 장치 |
KR100693463B1 (ko) * | 2005-10-21 | 2007-03-12 | 한국광기술원 | 2 이상의 물질을 포함하는 봉지층을 구비한 광 확산 발광다이오드 |
CN102516712B (zh) | 2006-11-15 | 2015-04-22 | 日立化成株式会社 | 光反射用热固化性树脂组合物、用该组合物的光半导体元件搭载用基板及其光半导体装置 |
JP5207658B2 (ja) * | 2007-05-17 | 2013-06-12 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物およびその硬化体ならびにそれを用いた光半導体装置 |
US20100209701A1 (en) * | 2007-06-28 | 2010-08-19 | Lg Chem, Ltd. | Method for manufacturing transparent plastic film and transparent plastic film manufactured by the method |
JP2010144015A (ja) * | 2008-12-17 | 2010-07-01 | Nitto Denko Corp | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
KR101124349B1 (ko) * | 2009-08-03 | 2012-03-19 | 대주전자재료 주식회사 | 에폭시 혼성 수지 조성물 및 이로써 피복된 발광 반도체 소자 |
JP5488326B2 (ja) * | 2009-09-01 | 2014-05-14 | 信越化学工業株式会社 | 光半導体装置用白色熱硬化性シリコーンエポキシ混成樹脂組成物及びその製造方法並びにプレモールドパッケージ及びled装置 |
JP2011074355A (ja) * | 2009-09-07 | 2011-04-14 | Nitto Denko Corp | 光半導体装置用樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置 |
TWI456810B (zh) * | 2009-09-15 | 2014-10-11 | Maintek Comp Suzhou Co Ltd | 發光二極體 |
JP5771148B2 (ja) * | 2009-09-18 | 2015-08-26 | 株式会社日本触媒 | 硬化成型体の製造方法及び硬化成型体 |
JP5319567B2 (ja) * | 2010-01-25 | 2013-10-16 | 日東電工株式会社 | 光半導体装置用エポキシ樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置 |
JP5638812B2 (ja) * | 2010-02-01 | 2014-12-10 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
CN101805577A (zh) * | 2010-04-09 | 2010-08-18 | 东莞市天环科技有限公司 | 一种透明环氧树脂封装胶粘剂 |
CN103221191B (zh) * | 2010-11-17 | 2015-08-19 | 株式会社村田制作所 | 密封用树脂片材的制造方法 |
JP2012116890A (ja) * | 2010-11-29 | 2012-06-21 | Hitachi Chemical Co Ltd | 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
JP5647071B2 (ja) * | 2011-05-24 | 2014-12-24 | 日東電工株式会社 | 光半導体装置用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
JP5875269B2 (ja) * | 2011-07-13 | 2016-03-02 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
JP2013023661A (ja) * | 2011-07-25 | 2013-02-04 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
CN103666364B (zh) * | 2012-09-13 | 2015-09-16 | 东睦新材料集团股份有限公司 | 金属软磁复合材料用有机绝缘粘结剂及制备金属软磁复合材料方法 |
CN103862048B (zh) * | 2012-12-07 | 2015-12-02 | 中国科学院理化技术研究所 | 一种通过热压制备软磁性复合材料的方法 |
CN103013282B (zh) * | 2012-12-14 | 2015-02-25 | 江门市江海区亿宏光电有限公司 | 一种抗光衰led固晶绝缘胶 |
TWI661037B (zh) * | 2014-12-03 | 2019-06-01 | 日商信越化學工業股份有限公司 | 光半導體元件封裝用熱固性環氧樹脂組合物及使用其的光半導體裝置 |
CN104448714B (zh) * | 2014-12-24 | 2017-01-25 | 中科院广州化学有限公司 | Led封装用有机氟无规共聚物改性环氧材料及其制法 |
CN113166376A (zh) * | 2018-11-29 | 2021-07-23 | Dic株式会社 | 双液固化型环氧树脂组合物、固化物、纤维增强复合材料及成形品 |
TWI777406B (zh) * | 2021-02-08 | 2022-09-11 | 台虹應用材料股份有限公司 | 封裝膠結構、電子裝置以及電子裝置的封裝方法 |
CN113321784A (zh) * | 2021-05-18 | 2021-08-31 | 张家港衡业特种树脂有限公司 | 一种有机硅增韧环氧固化剂的制备方法 |
KR102571498B1 (ko) * | 2021-09-28 | 2023-08-28 | 주식회사 케이씨씨 | 몰딩용 에폭시 수지 조성물 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6070781A (ja) * | 1983-09-27 | 1985-04-22 | Toshiba Corp | 樹脂封止型発光装置 |
JPH07100766B2 (ja) * | 1987-06-25 | 1995-11-01 | ソマール株式会社 | エポキシ樹脂粉体塗料組成物 |
JPS6424825A (en) * | 1987-07-20 | 1989-01-26 | Mitsubishi Gas Chemical Co | Epoxy resin composition |
US4877837A (en) * | 1988-10-07 | 1989-10-31 | The Glidden Company | Epoxy functional and silicone thermosetting powder coatings |
JPH062798B2 (ja) * | 1989-06-30 | 1994-01-12 | 信越化学工業株式会社 | 光透過性エポキシ樹脂組成物及び光半導体装置 |
US5108824A (en) * | 1990-02-06 | 1992-04-28 | The Dow Chemical Company | Rubber modified epoxy resins |
JPH0563240A (ja) * | 1991-05-08 | 1993-03-12 | Nitto Denko Corp | 光半導体装置 |
JPH06279654A (ja) * | 1993-02-26 | 1994-10-04 | Matsushita Electric Works Ltd | 液状エポキシ樹脂組成物 |
JPH088367A (ja) * | 1994-06-16 | 1996-01-12 | Nitto Denko Corp | 光半導体用熱硬化性透明樹脂硬化体およびそれにより封止された光半導体装置 |
US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
JP3851441B2 (ja) * | 1998-04-23 | 2006-11-29 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物及び光半導体装置 |
JP2000230039A (ja) * | 1998-12-08 | 2000-08-22 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2000294922A (ja) * | 1999-04-01 | 2000-10-20 | Victor Co Of Japan Ltd | 多層プリント配線板用の絶縁樹脂組成物 |
TW538482B (en) * | 1999-04-26 | 2003-06-21 | Shinetsu Chemical Co | Semiconductor encapsulating epoxy resin composition and semiconductor device |
JP3468195B2 (ja) * | 1999-06-17 | 2003-11-17 | 荒川化学工業株式会社 | エポキシ樹脂組成物 |
US6664318B1 (en) * | 1999-12-20 | 2003-12-16 | 3M Innovative Properties Company | Encapsulant compositions with thermal shock resistance |
JP2001207019A (ja) * | 2000-01-28 | 2001-07-31 | Matsushita Electric Works Ltd | 光半導体用エポキシ樹脂組成物及び光半導体装置 |
EP1172408A1 (de) * | 2000-07-14 | 2002-01-16 | Abb Research Ltd. | Volumenmodifizierte Vergussmassen auf der Basis polymerer Matrixharze |
US7037399B2 (en) * | 2002-03-01 | 2006-05-02 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulant for wafer packaging and method for its application |
US6800373B2 (en) * | 2002-10-07 | 2004-10-05 | General Electric Company | Epoxy resin compositions, solid state devices encapsulated therewith and method |
KR100540914B1 (ko) * | 2002-12-31 | 2006-01-11 | 제일모직주식회사 | 반도체 언더필용 에폭시 수지 조성물 |
KR100540913B1 (ko) * | 2002-12-31 | 2006-01-11 | 제일모직주식회사 | 액상 에폭시 수지 조성물 |
-
2005
- 2005-03-01 JP JP2005056027A patent/JP4799883B2/ja active Active
-
2006
- 2006-02-28 MY MYPI20060844A patent/MY151073A/en unknown
- 2006-02-28 KR KR1020060019510A patent/KR100830776B1/ko active IP Right Grant
- 2006-03-01 CN CNB2006100198465A patent/CN100381497C/zh active Active
- 2006-03-01 US US11/364,327 patent/US20060204761A1/en not_active Abandoned
- 2006-03-01 TW TW95106767A patent/TWI351412B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210038011A (ko) | 2019-09-30 | 2021-04-07 | 동우 화인켐 주식회사 | 에폭시 수지 조성물 및 이를 포함하는 반도체 소자용 밀봉재 |
Also Published As
Publication number | Publication date |
---|---|
US20060204761A1 (en) | 2006-09-14 |
TW200640979A (en) | 2006-12-01 |
MY151073A (en) | 2014-03-31 |
KR100830776B1 (ko) | 2008-05-20 |
JP4799883B2 (ja) | 2011-10-26 |
CN1827684A (zh) | 2006-09-06 |
TWI351412B (en) | 2011-11-01 |
CN100381497C (zh) | 2008-04-16 |
JP2006241230A (ja) | 2006-09-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100830776B1 (ko) | 에폭시 수지 조성물의 경화체, 그 제조방법 및 그 경화체를 사용한 광반도체 장치 | |
KR100830775B1 (ko) | 광반도체 소자 봉지용 에폭시 수지 조성물 및 이를 이용한 광반도체 장치 | |
EP2097483B1 (en) | Curable silicone composition | |
KR101500757B1 (ko) | 광 반도체 소자 밀봉용 에폭시ㆍ실리콘 혼성 수지 조성물 및 그것을 포함하는 트랜스퍼 성형용 타블렛 | |
KR101560839B1 (ko) | 광반도체 소자 밀봉용 수지 조성물 | |
JP5380325B2 (ja) | 光半導体素子封止用熱硬化性樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置 | |
JP3388537B2 (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
JP2011074355A (ja) | 光半導体装置用樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置 | |
KR20130133812A (ko) | 경화성 에폭시 수지 조성물 | |
JP5293525B2 (ja) | 光半導体素子封止用組成物 | |
KR101683891B1 (ko) | 광 반도체 소자 밀봉용 수지 조성물 | |
JP2010144015A (ja) | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 | |
EP2079802B1 (en) | Curable silicone composition and cured body thereof | |
JP4822001B2 (ja) | エポキシ・シリコーン混成樹脂組成物及びその硬化物 | |
KR101784019B1 (ko) | 광반도체 장치용 에폭시 수지 조성물 및 이를 사용한 광반도체 장치 | |
JP5132239B2 (ja) | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 | |
JP5319567B2 (ja) | 光半導体装置用エポキシ樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置 | |
CN109721948B (zh) | 半导体封装树脂组合物和半导体器件 | |
JP2011132337A (ja) | エポキシ樹脂組成物及び半導体装置 | |
JP2009144066A (ja) | 光半導体素子封止用熱硬化性樹脂組成物およびそれを用いた光半導体装置 | |
JP2005154694A (ja) | 半導体封止用難燃性エポキシ樹脂組成物及び半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130502 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20140418 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20150416 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20160418 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20170421 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20180502 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20190429 Year of fee payment: 12 |