TW200634847A - Memory chip architecture with high speed operation - Google Patents

Memory chip architecture with high speed operation

Info

Publication number
TW200634847A
TW200634847A TW094147408A TW94147408A TW200634847A TW 200634847 A TW200634847 A TW 200634847A TW 094147408 A TW094147408 A TW 094147408A TW 94147408 A TW94147408 A TW 94147408A TW 200634847 A TW200634847 A TW 200634847A
Authority
TW
Taiwan
Prior art keywords
transmission block
memory device
semiconductor memory
address
data transmission
Prior art date
Application number
TW094147408A
Other languages
English (en)
Other versions
TWI319197B (en
Inventor
Geun-Il Lee
Yong-Suk Joo
Original Assignee
Hynix Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050027401A external-priority patent/KR100703834B1/ko
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Publication of TW200634847A publication Critical patent/TW200634847A/zh
Application granted granted Critical
Publication of TWI319197B publication Critical patent/TWI319197B/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • G11C11/4097Bit-line organisation, e.g. bit-line layout, folded bit lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Memories (AREA)
TW094147408A 2005-03-31 2005-12-30 Memory chip architecture with high speed operation TWI319197B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050027401A KR100703834B1 (ko) 2004-09-22 2005-03-31 고속 동작을 위한 메모리 칩 아키텍쳐

Publications (2)

Publication Number Publication Date
TW200634847A true TW200634847A (en) 2006-10-01
TWI319197B TWI319197B (en) 2010-01-01

Family

ID=37030524

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094147408A TWI319197B (en) 2005-03-31 2005-12-30 Memory chip architecture with high speed operation

Country Status (4)

Country Link
US (2) US7310258B2 (zh)
JP (1) JP4982711B2 (zh)
CN (1) CN100490009C (zh)
TW (1) TWI319197B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7310258B2 (en) * 2005-03-31 2007-12-18 Hynix Semiconductor Inc. Memory chip architecture with high speed operation
US7554864B2 (en) * 2007-03-27 2009-06-30 Hynix Semiconductor Inc. Semiconductor memory device including a global input/output line of a data transfer path and its surrounding circuits
US8775238B2 (en) 2007-04-03 2014-07-08 International Business Machines Corporation Generating customized disincentive marketing content for a customer based on customer risk assessment
US8812355B2 (en) 2007-04-03 2014-08-19 International Business Machines Corporation Generating customized marketing messages for a customer using dynamic customer behavior data
US9626684B2 (en) 2007-04-03 2017-04-18 International Business Machines Corporation Providing customized digital media marketing content directly to a customer
US8831972B2 (en) 2007-04-03 2014-09-09 International Business Machines Corporation Generating a customer risk assessment using dynamic customer data
US8639563B2 (en) 2007-04-03 2014-01-28 International Business Machines Corporation Generating customized marketing messages at a customer level using current events data
US9361623B2 (en) 2007-04-03 2016-06-07 International Business Machines Corporation Preferred customer marketing delivery based on biometric data for a customer
US9031858B2 (en) 2007-04-03 2015-05-12 International Business Machines Corporation Using biometric data for a customer to improve upsale ad cross-sale of items
US9846883B2 (en) 2007-04-03 2017-12-19 International Business Machines Corporation Generating customized marketing messages using automatically generated customer identification data
US9092808B2 (en) 2007-04-03 2015-07-28 International Business Machines Corporation Preferred customer marketing delivery based on dynamic data for a customer
US9685048B2 (en) 2007-04-03 2017-06-20 International Business Machines Corporation Automatically generating an optimal marketing strategy for improving cross sales and upsales of items
US9031857B2 (en) 2007-04-03 2015-05-12 International Business Machines Corporation Generating customized marketing messages at the customer level based on biometric data
JP5131816B2 (ja) * 2007-04-18 2013-01-30 ルネサスエレクトロニクス株式会社 半導体記憶装置
JP2009009633A (ja) * 2007-06-27 2009-01-15 Elpida Memory Inc 半導体記憶装置
KR102620562B1 (ko) * 2016-08-04 2024-01-03 삼성전자주식회사 비휘발성 메모리 장치
US11017838B2 (en) 2016-08-04 2021-05-25 Samsung Electronics Co., Ltd. Nonvolatile memory devices
US10268389B2 (en) * 2017-02-22 2019-04-23 Micron Technology, Inc. Apparatuses and methods for in-memory operations
JP2020047325A (ja) 2018-09-18 2020-03-26 キオクシア株式会社 半導体記憶装置
KR102670866B1 (ko) 2018-11-28 2024-05-30 삼성전자주식회사 복수의 메모리 플레인들을 포함하는 비휘발성 메모리 장치 및 이를 포함하는 메모리 시스템
US11657858B2 (en) 2018-11-28 2023-05-23 Samsung Electronics Co., Ltd. Nonvolatile memory devices including memory planes and memory systems including the same

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0366091A (ja) * 1989-08-03 1991-03-20 Hitachi Ltd 半導体集積回路装置及びそれを搭載する樹脂封止型半導体装置
JPH0650194A (ja) * 1992-07-31 1994-02-22 Honda Motor Co Ltd 内燃エンジンの酸素センサ劣化検出装置
JPH08255479A (ja) * 1995-03-20 1996-10-01 Fujitsu Ltd 半導体記憶装置
US6388314B1 (en) * 1995-08-17 2002-05-14 Micron Technology, Inc. Single deposition layer metal dynamic random access memory
JPH09306175A (ja) * 1996-05-14 1997-11-28 Hitachi Ltd 半導体集積回路装置
JPH1050958A (ja) * 1996-08-05 1998-02-20 Toshiba Corp 半導体記憶装置、半導体記憶装置のレイアウト方法、半導体記憶装置の動作方法および半導体記憶装置の回路配置パターン
US6172935B1 (en) * 1997-04-25 2001-01-09 Micron Technology, Inc. Synchronous dynamic random access memory device
JPH10302470A (ja) * 1997-04-28 1998-11-13 Nec Corp 半導体記憶装置
US5880987A (en) * 1997-07-14 1999-03-09 Micron Technology, Inc. Architecture and package orientation for high speed memory devices
US6314042B1 (en) * 1998-05-22 2001-11-06 Mitsubishi Denki Kabushiki Kaisha Fast accessible semiconductor memory device
JP2000048567A (ja) * 1998-05-22 2000-02-18 Mitsubishi Electric Corp 同期型半導体記憶装置
JPH11353870A (ja) * 1998-06-05 1999-12-24 Mitsubishi Electric Corp 半導体記憶装置
US6097640A (en) * 1998-08-05 2000-08-01 Winbond Electronics Corporation Memory and circuit for accessing data bits in a memory array in multi-data rate operation
JP2000113695A (ja) * 1998-10-01 2000-04-21 Mitsubishi Electric Corp 同期型半導体記憶装置
KR100275751B1 (ko) 1998-11-09 2000-12-15 윤종용 구조가 간단한 반도체 메모리 장치
KR100335486B1 (ko) 1999-03-22 2002-05-04 윤종용 다수개의 스택형 뱅크들에 공유되는 데이터 입출력 라인의 구조를 갖는 반도체 메모리 장치
KR100326922B1 (ko) * 1999-09-09 2002-03-13 윤종용 반도체 메모리 장치
US6751651B2 (en) * 1999-11-30 2004-06-15 David A. Crockett Web-site consistency administration among inconsistent software-object libraries of remote distributed health-care providers
JP4756724B2 (ja) * 2000-02-24 2011-08-24 エルピーダメモリ株式会社 半導体記憶装置
JP4684394B2 (ja) * 2000-07-05 2011-05-18 エルピーダメモリ株式会社 半導体集積回路装置
KR100816915B1 (ko) * 2000-07-07 2008-03-26 모사이드 테크놀로지스, 인코포레이티드 일정한 액세스 레이턴시를 지닌 고속 dram 및 메모리 소자
JP4307694B2 (ja) 2000-07-10 2009-08-05 文化シヤッター株式会社 建物用付設物の取付具及び建物用付設物の取付構造
US6541849B1 (en) * 2000-08-25 2003-04-01 Micron Technology, Inc. Memory device power distribution
KR100374638B1 (ko) 2000-10-25 2003-03-04 삼성전자주식회사 입출력데이타의 전파경로 및 전파경로들 간의 차이를최소화하는 회로를 구비하는 반도체 메모리장치
US7061941B1 (en) * 2000-11-28 2006-06-13 Winbond Electronics Corporation America Data input and output circuits for multi-data rate operation
KR100380409B1 (ko) 2001-01-18 2003-04-11 삼성전자주식회사 반도체 메모리 소자의 패드배열구조 및 그의 구동방법
US6898110B2 (en) * 2001-01-31 2005-05-24 Hitachi, Ltd. Semiconductor integrated circuit device
KR100762867B1 (ko) 2001-06-28 2007-10-08 주식회사 하이닉스반도체 글로벌 입출력 라인을 갖는 반도체 메모리 장치
JP2003100073A (ja) 2001-09-25 2003-04-04 Mitsubishi Electric Corp 半導体記憶装置
JP2003338175A (ja) * 2002-05-20 2003-11-28 Mitsubishi Electric Corp 半導体回路装置
KR100465602B1 (ko) 2002-09-10 2005-01-13 주식회사 하이닉스반도체 글로벌 입출력(gio) 라인에 리피터를 구비하는 반도체메모리 장치
KR100546321B1 (ko) * 2003-03-15 2006-01-26 삼성전자주식회사 데이터 라인 상에 전압 감지 증폭기와 전류 감지 증폭기를갖는 멀티 뱅크 메모리 장치
JP4419049B2 (ja) * 2003-04-21 2010-02-24 エルピーダメモリ株式会社 メモリモジュール及びメモリシステム
KR100605576B1 (ko) * 2003-12-29 2006-07-28 주식회사 하이닉스반도체 일정한 데이터 억세스 타이밍을 유지할 수 있는 반도체메모리 장치
KR100537199B1 (ko) * 2004-05-06 2005-12-16 주식회사 하이닉스반도체 동기식 메모리 소자
KR100599444B1 (ko) * 2004-05-06 2006-07-13 주식회사 하이닉스반도체 글로벌 데이터 버스 연결회로를 구비하는 멀티-포트메모리 소자
KR100605573B1 (ko) * 2004-05-06 2006-07-31 주식회사 하이닉스반도체 멀티-포트 메모리 소자
JP2005340227A (ja) * 2004-05-24 2005-12-08 Hitachi Ltd 半導体記憶装置と半導体装置
US7110321B1 (en) * 2004-09-07 2006-09-19 Integrated Device Technology, Inc. Multi-bank integrated circuit memory devices having high-speed memory access timing
US7310258B2 (en) * 2005-03-31 2007-12-18 Hynix Semiconductor Inc. Memory chip architecture with high speed operation

Also Published As

Publication number Publication date
JP4982711B2 (ja) 2012-07-25
JP2006286169A (ja) 2006-10-19
CN1841553A (zh) 2006-10-04
US7495991B2 (en) 2009-02-24
CN100490009C (zh) 2009-05-20
US20080089107A1 (en) 2008-04-17
US20060221753A1 (en) 2006-10-05
TWI319197B (en) 2010-01-01
US7310258B2 (en) 2007-12-18

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