TW200623282A - Method of manufacturing an electronic circuit assembly - Google Patents
Method of manufacturing an electronic circuit assemblyInfo
- Publication number
- TW200623282A TW200623282A TW094125594A TW94125594A TW200623282A TW 200623282 A TW200623282 A TW 200623282A TW 094125594 A TW094125594 A TW 094125594A TW 94125594 A TW94125594 A TW 94125594A TW 200623282 A TW200623282 A TW 200623282A
- Authority
- TW
- Taiwan
- Prior art keywords
- dielectric layer
- electronic circuit
- manufacturing
- circuit assembly
- forming
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000012530 fluid Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000002322 conducting polymer Substances 0.000 abstract 1
- 229920001940 conductive polymer Polymers 0.000 abstract 1
- 238000000608 laser ablation Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04090302A EP1622435A1 (en) | 2004-07-28 | 2004-07-28 | Method of manufacturing an electronic circuit assembly using direct write techniques |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200623282A true TW200623282A (en) | 2006-07-01 |
Family
ID=34928816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094125594A TW200623282A (en) | 2004-07-28 | 2005-07-28 | Method of manufacturing an electronic circuit assembly |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080052904A1 (zh) |
EP (1) | EP1622435A1 (zh) |
JP (1) | JP2008508703A (zh) |
KR (1) | KR20070043816A (zh) |
CN (1) | CN101002515A (zh) |
TW (1) | TW200623282A (zh) |
WO (1) | WO2006010639A2 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI613177B (zh) * | 2011-11-16 | 2018-02-01 | 製陶技術股份有限公司 | 製造一基材的方法 |
TWI779093B (zh) * | 2017-09-15 | 2022-10-01 | 日商琳得科股份有限公司 | 膜狀燒製材料、具支撐片的膜狀燒製材料以及半導體裝置之製造方法 |
US12046504B2 (en) | 2019-06-11 | 2024-07-23 | Kulicke & Soffa Netherlands B.V. | Positional error compensation in assembly of discrete components by adjustment of optical system characteristics |
Families Citing this family (92)
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US7476851B2 (en) * | 2004-11-12 | 2009-01-13 | Regents Of The University Of Minnesota | Aerodynamic focusing of nanoparticle or cluster beams |
DE102005005359B4 (de) * | 2005-02-02 | 2009-05-07 | Siemens Ag | Verfahren zum Kaltgasspritzen |
US20080102225A1 (en) * | 2005-03-23 | 2008-05-01 | Braun Christopher P | Method for Manufacturing a Device Using Imprint Lithography and Direct Write Technology |
US8063315B2 (en) * | 2005-10-06 | 2011-11-22 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate |
US7473912B2 (en) * | 2005-11-09 | 2009-01-06 | Yang Xiao Charles | Method and apparatus for patterning micro and nano structures using a mask-less process |
KR20140033245A (ko) * | 2006-05-24 | 2014-03-17 | 다이니폰 인사츠 가부시키가이샤 | 부품 내장 배선판, 부품 내장 배선판의 제조 방법 |
TWI327361B (en) * | 2006-07-28 | 2010-07-11 | Unimicron Technology Corp | Circuit board structure having passive component and stack structure thereof |
TWI328984B (en) * | 2006-08-29 | 2010-08-11 | Ind Tech Res Inst | Substrate structures and fabrication methods thereof |
US7504550B2 (en) | 2006-08-31 | 2009-03-17 | Kimberly-Clark Worldwide, Inc. | Conductive porous materials |
JP4235921B2 (ja) * | 2006-09-21 | 2009-03-11 | 株式会社フューチャービジョン | 液晶表示パネルの製造方法および液晶表示パネル |
JP2008166736A (ja) * | 2006-12-06 | 2008-07-17 | Hitachi Via Mechanics Ltd | プリント基板の製造方法およびプリント基板加工機 |
US8299317B2 (en) | 2007-03-29 | 2012-10-30 | Kimberly-Clark Worldwide, Inc. | Absorbent articles with external access to internal conductors |
US8440916B2 (en) | 2007-06-28 | 2013-05-14 | Intel Corporation | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
US8877565B2 (en) * | 2007-06-28 | 2014-11-04 | Intel Corporation | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method |
KR100859008B1 (ko) * | 2007-08-21 | 2008-09-18 | 삼성전기주식회사 | 배선기판 제조방법 |
US7974505B2 (en) * | 2007-10-17 | 2011-07-05 | Bae Systems Information And Electronic Systems Integration Inc. | Method for fabricating selectively coupled optical waveguides on a substrate |
TW200919327A (en) * | 2007-10-29 | 2009-05-01 | China Steel Corp | Three-dimensional wireless identification label adhered onto metal |
US7733289B2 (en) | 2007-10-31 | 2010-06-08 | The Invention Science Fund I, Llc | Electromagnetic compression apparatus, methods, and systems |
JP5209938B2 (ja) * | 2007-11-01 | 2013-06-12 | 上村工業株式会社 | 回路形成方法 |
US20090218524A1 (en) * | 2008-02-29 | 2009-09-03 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Electromagnetic cloaking and translation apparatus, methods, and systems |
US8362617B2 (en) | 2008-05-01 | 2013-01-29 | Infineon Technologies Ag | Semiconductor device |
CN101590775A (zh) * | 2008-05-28 | 2009-12-02 | Icf科技有限公司 | 塑胶元件表面处理方法 |
US8736982B2 (en) * | 2008-05-30 | 2014-05-27 | The Invention Science Fund I Llc | Emitting and focusing apparatus, methods, and systems |
US8164837B2 (en) * | 2008-05-30 | 2012-04-24 | The Invention Science Fund I, Llc | Negatively-refractive focusing and sensing apparatus, methods, and systems |
US8773776B2 (en) * | 2008-05-30 | 2014-07-08 | The Invention Science Fund I Llc | Emitting and negatively-refractive focusing apparatus, methods, and systems |
US9019632B2 (en) * | 2008-05-30 | 2015-04-28 | The Invention Science Fund I Llc | Negatively-refractive focusing and sensing apparatus, methods, and systems |
US8638504B2 (en) * | 2008-05-30 | 2014-01-28 | The Invention Science Fund I Llc | Emitting and negatively-refractive focusing apparatus, methods, and systems |
US8638505B2 (en) * | 2008-05-30 | 2014-01-28 | The Invention Science Fund 1 Llc | Negatively-refractive focusing and sensing apparatus, methods, and systems |
US8531782B2 (en) * | 2008-05-30 | 2013-09-10 | The Invention Science Fund I Llc | Emitting and focusing apparatus, methods, and systems |
US7777962B2 (en) | 2008-05-30 | 2010-08-17 | The Invention Science Fund I, Llc | Negatively-refractive focusing and sensing apparatus, methods, and systems |
US8817380B2 (en) * | 2008-05-30 | 2014-08-26 | The Invention Science Fund I Llc | Emitting and negatively-refractive focusing apparatus, methods, and systems |
US7869131B2 (en) * | 2008-05-30 | 2011-01-11 | The Invention Science Fund I | Emitting and negatively-refractive focusing apparatus, methods, and systems |
US8773775B2 (en) * | 2008-05-30 | 2014-07-08 | The Invention Science Fund I Llc | Emitting and negatively-refractive focusing apparatus, methods, and systems |
EP2294482A4 (en) * | 2008-05-30 | 2012-02-08 | Searete Llc | APPARATUS, METHODS, AND SYSTEMS FOR FOCUSING AND DETECTION |
US7872812B2 (en) * | 2008-05-30 | 2011-01-18 | The Invention Science Fund I, Llc | Emitting and focusing apparatus, methods, and systems |
US8493669B2 (en) * | 2008-05-30 | 2013-07-23 | The Invention Science Fund I Llc | Focusing and sensing apparatus, methods, and systems |
US7830618B1 (en) * | 2008-05-30 | 2010-11-09 | The Invention Science Fund I | Negatively-refractive focusing and sensing apparatus, methods, and systems |
US8837058B2 (en) * | 2008-07-25 | 2014-09-16 | The Invention Science Fund I Llc | Emitting and negatively-refractive focusing apparatus, methods, and systems |
US8730591B2 (en) * | 2008-08-07 | 2014-05-20 | The Invention Science Fund I Llc | Negatively-refractive focusing and sensing apparatus, methods, and systems |
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- 2005-07-28 WO PCT/EP2005/008376 patent/WO2006010639A2/en active Application Filing
- 2005-07-28 KR KR1020077002390A patent/KR20070043816A/ko not_active Application Discontinuation
- 2005-07-28 JP JP2007523035A patent/JP2008508703A/ja active Pending
- 2005-07-28 US US11/572,524 patent/US20080052904A1/en not_active Abandoned
- 2005-07-28 CN CNA2005800251263A patent/CN101002515A/zh active Pending
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TWI613177B (zh) * | 2011-11-16 | 2018-02-01 | 製陶技術股份有限公司 | 製造一基材的方法 |
TWI779093B (zh) * | 2017-09-15 | 2022-10-01 | 日商琳得科股份有限公司 | 膜狀燒製材料、具支撐片的膜狀燒製材料以及半導體裝置之製造方法 |
US12046504B2 (en) | 2019-06-11 | 2024-07-23 | Kulicke & Soffa Netherlands B.V. | Positional error compensation in assembly of discrete components by adjustment of optical system characteristics |
Also Published As
Publication number | Publication date |
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CN101002515A (zh) | 2007-07-18 |
JP2008508703A (ja) | 2008-03-21 |
WO2006010639A2 (en) | 2006-02-02 |
WO2006010639A3 (en) | 2006-10-26 |
KR20070043816A (ko) | 2007-04-25 |
US20080052904A1 (en) | 2008-03-06 |
EP1622435A1 (en) | 2006-02-01 |
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